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Photosensitive resin used for 3D printing materials, and preparation method thereof

A photosensitive resin and 3D printing technology, applied in the field of 3D printing materials, can solve the problems of low hardness, poor heat resistance, and poor mechanical properties of formed parts, and achieve high mechanical strength, small shrinkage, and high reactivity.

Inactive Publication Date: 2018-07-06
常州市泰英物资有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention: Aiming at the problems of low hardness, poor mechanical properties and poor heat resistance of the photosensitive resin material for 3D printing, a photosensitive resin for 3D printing material and its preparation method are provided

Method used

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  • Photosensitive resin used for 3D printing materials, and preparation method thereof

Examples

Experimental program
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Effect test

example 1

[0025] Take 20g of white corundum sand and 0.01g of dispersant S-2108, add it to 30mL of silica sol, stir at 300r / min for 20min at 50°C to obtain a mixed solution, take 30g of (3-aminopropyl)triethoxysilane , 12g acetic acid was added to 450mL absolute ethanol, ultrasonically treated with 100W ultrasonic wave for 15min, then the mixture was added dropwise at 1mL / min, and the ultrasonic treatment was continued for 30min, and then the reaction was stirred at 300r / min at 60°C for 124h. After the reaction was over Put it into a centrifuge for centrifugation for 8 minutes to obtain a precipitate A, wash the precipitate A with a mass fraction of 50% acetone-ethanol solution for 2 times, and then place it in a drying oven to dry for 3 hours to obtain aminopropyl modified composite particles, and add 12 g of triethylamine to it In 300mL of tetrahydrofuran, ultrasonically treated with 100W ultrasonic wave for 15min, add 15g of aminopropyl modified composite particles, stir at 300r / min f...

example 2

[0027]Take 25g of white corundum sand and 0.05g of dispersant S-2108, add it to 35mL of silica sol, stir at 350r / min for 25min at 55°C to obtain a mixed solution, take 37g of (3-aminopropyl)triethoxysilane , 15g acetic acid was added to 520mL absolute ethanol, ultrasonically treated with 100W ultrasonic wave for 17min, then the mixture was added dropwise at 1mL / min, and the ultrasonic treatment was continued for 35min, and then the reaction was stirred at 350r / min at 70°C for 18h. After the reaction was over Put it into a centrifuge for centrifugation for 10 minutes to obtain a precipitate A, wash the precipitate A with a mass fraction of 50% acetone-ethanol solution for 3 times, and then place it in a drying oven to dry for 4 hours to obtain aminopropyl modified composite particles, and add 15 g of triethylamine to it In 375mL of tetrahydrofuran, ultrasonically treated with 100W ultrasonic wave for 17min, add 17g of aminopropyl modified composite particles, stir at 350r / min fo...

example 3

[0029] Take 30g of white corundum sand and 0.1g of dispersant S-2108, add it to 40mL of silica sol, and stir at 400r / min for 30min at 60°C to obtain a mixed solution, take 45g of (3-aminopropyl)triethoxysilane , 18g of acetic acid, added to 600mL of absolute ethanol, ultrasonically treated with 100W ultrasonic for 20min, and then added dropwise to the mixture at 2mL / min, and continued to be ultrasonicated for 40min, and then stirred at 80°C at 400r / min for 24h. After the reaction Put it into a centrifuge for centrifugation for 12 minutes to obtain a precipitate A, wash the precipitate A with a mass fraction of 50% acetone-ethanol solution for 3 times, and then place it in a drying oven to dry for 5 hours to obtain aminopropyl modified composite particles, and add 18 g of triethylamine to it In 450mL of tetrahydrofuran, ultrasonically treated with 100W ultrasonic wave for 20min, add 20g of aminopropyl modified composite particles, stir at 400r / min for 30min, then add 20g of 2-br...

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Abstract

The invention relates to a photosensitive resin used for 3D printing materials, and a preparation method thereof, and belongs to the technical field of 3D printing materials. The preparation method comprises following steps: rapid adsorption of silica gel colloid particles onto the surfaces of white pulverized corundum particles is carried out so as to form single layer saturation distribution, and realize filling of the gaps among white pulverized corundum particles, the electrostatic repulsive force potential energy among Al2O3 particles is increased, and a novel space repulsive force potential energy is generated, particle agglomeration is effectively prevented by the synergism effect of steric effect and electrostatic repulsion, the dispersion performance of white pulverized corundum is improved, and at the same time, the SiO2 colloid particles used for coating the surfaces of the white pulverized corundum are subjected to surface grafting with polymethyl methacrylate through atomtransformation free radical polymerization, so that the dispersion performance of white pulverized corundum in a light-cured resin matrix is improved further, and at last, an epoxy acrylate and a polyurethane acrylate are combined so as to obtain the light-cured resin matrix with synergism effect with white pulverized corundum, the hardness, the heat resistance, and the mechanical properties of the photosensitive resin are improved.

Description

technical field [0001] The invention relates to a photosensitive resin for 3D printing materials and a preparation method thereof, belonging to the technical field of 3D printing materials. Background technique [0002] With the globalization of the economy, the competition in the modern market will become more and more fierce, and the production speed of the product will inevitably affect the competitiveness of the product in the market. The current rapid prototyping technology is widely used in developed countries, and new technologies such as three-dimensional rapid prototyping printing technology are gradually developed. , material types and some complex shape designs have great advantages, and have broad development prospects. In the past ten years, SL technology has made great progress in equipment application, software development and production technology. [0003] Light curing rapid prototyping technology (light curing forming system, SLA) is the most widely used, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/10C08L75/14C08L51/10B33Y70/00C08F292/00C08F220/14
CPCB33Y70/00C08F292/00C08L63/10C08L75/14C08L2201/08C08L2205/03C08L51/10C08F220/14
Inventor 刘蓉凤王文新史玉兰
Owner 常州市泰英物资有限公司