A kind of preparation method of semiconductor interconnection structure
A technology of semiconductor and interconnection structure, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the impact of semiconductor device stability and reliability, interlayer dielectric layer damage or pollution, interlayer dielectric layer dielectric constant Drift and other issues, to achieve the effect of shortening the etching time
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[0027] In the following description, the method for preparing the semiconductor interconnection structure proposed by the present invention will be further described in detail with reference to the accompanying drawings and examples, in order to provide a more thorough understanding of the present invention through specific details. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention. In the embodiments, in order to avoid confusion with the present invention, some technical features known in the art are not described.
[0028] Please refer to the attached figure 1 The schematic diagram of the preparation process of the present invention shown, the preparation method includes the following process steps:
[0029] Step S1: providing a lower dielectric layer with interconnection lines;
[0030] Step S2: forming a ni...
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