Aluminum or aluminum/copper or aluminum/nickel hollow wire macrobody and manufacturing system and method thereof
A technology for manufacturing systems and macro bodies, which is applied in vacuum evaporation plating, coating, sputtering plating, etc., can solve problems such as increased manufacturing costs, insufficient mechanical strength, and melting of porous polyurethane films, so as to improve utilization efficiency and application Field expansion and good chemical stability
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Embodiment 1
[0027] Such as figure 1 As shown, a porous polyurethane film with a thickness of 500mm, a width of 500mm, and an aspect ratio of 1:1 is placed in Subsystem 1 of the sputtering metal at 25°C and an absolute pressure of 0.5-5Pa in an argon atmosphere , Control the surface power of the aluminum target to 10W / cm 2 , Sputter-deposit a 500nm thick aluminum layer on the porous polyurethane film. After the metal-containing argon enters the gas purification subsystem 4 for processing, it is sent to the aluminum vapor deposition subsystem 3.
[0028] The porous polyurethane film deposited with aluminum is sent to the subsystem 2 where the polymer film is removed and the metal is reduced in situ, and oxygen-containing gas (1% oxygen, 99% nitrogen) is introduced, and treated at 400°C for 2 hours. Completely remove the porous polyurethane film. In the meantime, the combustion tail gas from the subsystem 2 that removes the polymer film and reduces the metal in situ is sent to the vapor depos...
Embodiment 2
[0032] Such as figure 1 As shown, a porous PVDF film with a thickness of 0.5mm, a width of 500mm, and an aspect ratio of 40,000:1 is placed in Subsystem 1 of the sputtering metal, at 50°C and an absolute pressure of 0.5Pa in an argon atmosphere , Control the surface power of the nickel target to 2W / cm 2 , Sputter-deposit a 50nm thick nickel layer on the porous PVDF film. After the metal-containing argon enters the gas purification subsystem 4 for processing, it is sent to the aluminum vapor deposition subsystem 3.
[0033] The nickel-deposited porous PVDF film is sent to the subsystem 2 which removes the polymer film and reduces the metal in situ, and is fed with air and treated at 200° C. for 14 hours to completely remove the porous PVDF film. In the meantime, the combustion tail gas of subsystem 2 which removes polymer film and reduces metal in situ is sent to subsystem 3 to be used as a combustion medium. After stopping the air flow, change the flow of nitrogen or argon to r...
Embodiment 3
[0037] Such as figure 1 As shown, a porous PTFE film with a thickness of 1.5mm, a width of 50mm, and an aspect ratio of 10000:1 is placed in Subsystem 1 of the sputtering metal. At 50°C, an absolute pressure of 2Pa is placed in an argon atmosphere. Control the surface power of the copper target to 2W / cm 2 , Deposit a 150nm thick copper layer on one side of the porous PTFE film by sputtering. After the metal-containing argon enters the gas purification subsystem 4 for processing, it is sent to the aluminum vapor deposition subsystem 3.
[0038] The copper-deposited porous PTFE film is sent to the subsystem 2 where the polymer film is removed and the metal is reduced in situ, and oxygen-containing gas (50% oxygen, 50% CO2) is introduced, and treated at 250°C for 8 hours. The porous PTFE film is completely removed. In the meantime, the combustion tail gas of Subsystem 2 which removes polymer film and reduces metal in situ is sent to Subsystem 3 to be used as a combustion medium. ...
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Abstract
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