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Cyanide-free organic solvent electroplating gold solution

An organic solvent and gold electroplating technology, applied in the field of cyanide-free gold plating solutions, can solve the problems of poor uniformity and low gold quality, and achieve the effects of strong tolerance, high purity and good effect

Inactive Publication Date: 2018-08-24
LASER FUSION RES CENT CHINA ACAD OF ENG PHYSICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention proposes a brand-new electroplating gold solution without cyanide organic solvent, which overcomes the shortcomings of the original gold plating solution and solves the problems of low quality and poor uniformity of electroplated gold

Method used

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  • Cyanide-free organic solvent electroplating gold solution
  • Cyanide-free organic solvent electroplating gold solution
  • Cyanide-free organic solvent electroplating gold solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Embodiment one: a kind of electroplating solution of cyanide-free organic solvent, its composition is as follows:

[0019]

[0020] Prepare the gold plating solution according to the above composition, add it to the plating tank and control the distance between the cathode and the anode to be 5cm, and control the solution temperature and current density at 65°C and 15mA / cm respectively 2 , continuously stirring the solution evenly. The electroplating lasted for 1 hour, and the coating was compact, bright in color, and about 57 microns in thickness. At this time, the plating solution was colorless and clear, and no sediment appeared in the plating tank.

Embodiment 2

[0021] Embodiment two: a kind of electroplating solution of cyanide-free organic solvent, its composition is as follows:

[0022]

[0023] Prepare the gold plating solution according to the above composition, add it to the plating tank and control the distance between the cathode and the anode to about 5cm, and control the solution temperature and current density at 55°C and 10mA / cm respectively 2 , continuously stirring the solution evenly. The electroplating lasts for 1 hour, and the coating is compact, bright in color, and about 38 microns in thickness. At this time, the plating solution is colorless and clear, and no sediment occurs in the plating tank.

Embodiment 3

[0024] Embodiment three: a kind of electroplating solution of cyanide-free organic solvent, its composition is as follows:

[0025]

[0026] Prepare the gold plating solution according to the above composition, add it to the plating tank and control the distance between the cathode and the anode to about 5cm, and control the solution temperature and current density at 50°C and 5mA / cm respectively 2 , continuously stirring the solution evenly. The electroplating lasts for 1 hour, and the coating is compact, bright in color, and about 19 microns in thickness. At this time, the plating solution is colorless and clear, and no sediment occurs in the plating tank.

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Abstract

A cyanide-free organic solvent electroplating gold solution comprises a non-aqueous solvent, a gold source, a reducing agent and a complexing agent. At least one of dimethyl sulfoxide, ethanediol anddimethylformamide is used as the non-aqueous solvent. Chloroauric acid is used as the gold source. At least one of sodium borohydride, ascorbic acid, oxalic acid and thiourea is used as the reducing agent. At least one of 1-hydroxyethylidene-1,1-diphosphonic acid, ethylenediamine, diethanol amine, triethanolamine, formamide, acetamide, 5,5-dimethyl hydantoin, 1,3-dichloro-5,5-dimethylhydantoin, 1,3-dibromo-5,5-dimethylhydantoin, ammonium chloride, ammonium carbonate, ammonium citrate, ethylenediaminetetraacetic acid and tetrahydroxy ethylenediamine is used as the complexing agent. The electroplating gold solution is simple in formula, the electroplating gold film effect is good, maintaining is easy, and the stability is good; the efficiency is high when the cathode current density is 5-20mA / cm<2>, cyanide-containing substances are not adopted by the solution, the safety is good, and waste solution treatment is convenient; and common metal hetero ions form stable complexes by using thecomplexing agent, and the purity of prepared gold coatings is high.

Description

technical field [0001] The invention relates to a cyanide-free gold plating solution, in particular to a high-speed electroplating gold solution without a cyanide organic solvent. Background technique [0002] At present, the commercial electroplating process is still a highly toxic cyanide system. The relatively mature cyanide-free electroplating process uses monovalent gold salts, such as sodium gold sulfite. Trivalent gold is more stable than monovalent gold in aqueous solution The disproportionation reaction of monovalent gold complexes slowly occurs in aqueous solution to generate trivalent gold and elemental gold, resulting in poor stability of the plating solution, which is currently the main factor limiting the promotion of cyanide-free monovalent gold salt electroplating. In recent years, studies have found that in some organic solvents and ionic liquids, the electrochemical potentials of monovalent gold and trivalent gold have changed greatly, and the stability of ...

Claims

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Application Information

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IPC IPC(8): C25D3/48
CPCC25D3/48
Inventor 张云望卢春林尹强苏琳李娃朱方华王宇光徐嘉靖肖江张超汤楷
Owner LASER FUSION RES CENT CHINA ACAD OF ENG PHYSICS
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