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Crosslinking type polyaryletherketone based dielectric composite material as well as preparation method and application thereof

A technology of polyaryletherketone and composite materials, which is applied in the field of dielectric material preparation and can solve problems such as low breakdown strength, high dielectric loss, and heat generation

Active Publication Date: 2018-08-28
JILIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The purpose of the present invention is in order to solve existing dielectric composite material heating due to self loss in operation, in addition the lower glass transition temperature (T of polymer matrix) g ), showing problems such as lower breakdown strength and higher dielectric loss in a wide temperature range, and provide a cross-linked polyaryletherketone-based dielectric composite material and its preparation method and use, which has Good heat resistance, flexibility and high voltage resistance, etc.

Method used

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  • Crosslinking type polyaryletherketone based dielectric composite material as well as preparation method and application thereof
  • Crosslinking type polyaryletherketone based dielectric composite material as well as preparation method and application thereof
  • Crosslinking type polyaryletherketone based dielectric composite material as well as preparation method and application thereof

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preparation example Construction

[0046] [Preparation method of polyaryletherketone-based dielectric composite material]

[0047] As mentioned above, the present invention provides a method for preparing the above-mentioned polyaryletherketone-based dielectric composite material. The method includes the following steps:

[0048] Step 1: Hydroxylation of the surface of inorganic ceramic particles with nitric acid and hydrogen peroxide, γ-methacryloxypropyltrimethoxysilane (MPS) double bond functionalization and benzocyclobutene (BCB) functionalization, Inorganic ceramic particles with a core-shell structure are prepared and used as inorganic fillers;

[0049] The second step: preparing poly(aryl ether ketone) containing allyl side groups, and using it as a polymer matrix;

[0050] Step 3: Mix the inorganic ceramic particles with a core-shell structure in the first step with the polyaryletherketone containing allyl side groups in the second step, and then heat-treat in vacuum to prepare a polyaryletherketone-ba...

Embodiment 1

[0135] The first step: prepare benzocyclobutene functionalized BN-BCB particles, the preparation method is as follows:

[0136] (1) Put 10g of boron nitride (BN) in a three-necked flask, add HNO 3 (65w / w%), ultrasonically dispersed for 4-5 hours, washed several times with deionized water, and then centrifuged; add 250ml H 2 o 2 (30wt%), ultrasonically disperse for 30-60 minutes; then place the three-necked flask containing the BN dispersion in an oil bath, under argon protection, mechanical stirring and reflux at 80-105°C for 4-6h. After the system was cooled to room temperature, it was washed several times with deionized water, then centrifuged, and dried in vacuum at 60° C. for 24 hours to obtain hydroxylated boron nitride particles.

[0137] (2) 5g of hydroxylated boron nitride particles are placed in a three-necked flask, then 80ml of toluene is added, and ultrasonically separated for 30-60 minutes; then the three-necked flask containing the hydroxylated boron nitride di...

Embodiment 2

[0145] The other steps are the same as in Example 1, the only difference is that the volume fraction ratio of the inorganic ceramic particles with a core-shell structure in solution A and the polymer matrix in solution B is changed to prepare a cross-linked polyaryletherketone containing 10vol% BN-BCB The base dielectric composite film is recorded as 10vol% BN-BCB@30% DPAEK.

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Abstract

The invention discloses a crosslinking type polyaryletherketone based dielectric composite material as well as a preparation method and application thereof. The method comprises the steps: utilizing polyaryletherketone having good thermal and mechanical property and further containing an active functional group (allyl lateral group) as a polymer matrix material; meanwhile, utilizing an inorganic ceramic particle with high insulativity as inorganic filler, performing organic functional modification on the surface of the filler, guiding benzocyclobutene into to form an inorganic ceramic particlewith a reactable functional group and a core-shell structure, utilizing the inorganic ceramic particle as a crosslinking point, generating crosslinking reaction with the polyaryletherketone polymer matrix with the active functional group to form a three-dimensional network structure and preparing the crosslinking type polyaryletherketone based dielectric composite material with good thermal resistance, flexibility and high voltage resistance. The prepared polyaryletherketone based dielectric composite film has the advantages of lower dielectric loss and wider temperature application range; meanwhile, breakdown field strength of the prepared polyaryletherketone based dielectric composite film is obviously improved; thus, higher high voltage resistance under the high temperature can be obtained.

Description

technical field [0001] The invention belongs to the technical field of dielectric material preparation, and in particular relates to a high-voltage-resistant cross-linked polyaryletherketone-based dielectric composite material and its preparation method and application. Background technique [0002] Polymers have the advantages of light weight, chemical corrosion resistance, easy processing and molding, excellent electrical insulation properties, and excellent mechanical properties. They have become indispensable materials in the fields of microelectronic packaging, automobiles, special cables, motors, and even high-end aerospace. one. Polymers are the conventional choice for the preparation of polymer-based dielectric composites. However, the existing polymer-based dielectric composites still have many shortcomings, mainly due to high dielectric loss and low breakdown strength at high temperatures; for example , the maximum service temperature of bi-oriented polypropylene ...

Claims

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Application Information

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IPC IPC(8): C08L71/10C08K9/02C08K9/04C08K9/06C08K3/38C08K3/28C08K3/34C08K3/22C08G65/40C08J5/18C08J3/24
CPCC08G65/4012C08G65/4087C08J3/24C08J5/18C08J2371/10C08K3/22C08K3/28C08K3/34C08K3/38C08K9/02C08K9/04C08K9/06C08K2003/2227C08K2003/282C08K2003/385C08L71/00
Inventor 张云鹤刘捷许文瀚张宇姜振华
Owner JILIN UNIV
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