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Method for preventing copper loss in tungsten copper material liquid phase sintering process

A technology of liquid phase sintering and copper loss, applied in the field of preventing copper loss in the liquid phase sintering process of tungsten copper materials, can solve the problems of inability to effectively control the copper loss of composite powder, and achieve strong reducibility, uniform structure and prevent copper loss. Effect

Active Publication Date: 2018-09-11
SHENZHEN QIANYAN MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, these preparation methods usually cannot effectively control the copper loss of composite powders during liquid phase sintering

Method used

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  • Method for preventing copper loss in tungsten copper material liquid phase sintering process
  • Method for preventing copper loss in tungsten copper material liquid phase sintering process
  • Method for preventing copper loss in tungsten copper material liquid phase sintering process

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Effect test

Embodiment 1

[0033] This embodiment provides a method for preventing copper loss during liquid-phase sintering of tungsten-copper materials, comprising the following steps:

[0034] S1. Preparation of precursor powder: (NH 4 ) 10 W 12 o 41 ·5H 2 O powder, Cu(NO 3 ) 2 ·3H 2After O powder is mixed according to the mass ratio of 17.97:1, it is fully dissolved in deionized water, and ammonia water and ethylene glycol are added at the same time to make a mixed solution. The mixed solution is microwave-heated with a microwave heating power of 700W, and the solid residue after evaporation is collected. The material is the tungsten copper precursor powder;

[0035] Among them, the (NH 4 ) 10 W 12 o 41 ·5H 2 O powder purity ≥ 99.90%, the Cu(NO 3 ) 2 ·3H 2 O powder purity ≥ 99.90%; in the mixed solution (NH 4 ) 10 W 12 o 41 ·5H 2 The concentration of O is 0.58mol / L, Cu(NO 3 ) 2 ·3H 2 The concentration of O is 0.42mol / L, the concentration of ammonia water is 0.30mol / L, and the ...

Embodiment 2

[0040] The method of this embodiment and embodiment 1 is basically the same, the difference is:

[0041] In step S1, the (NH 4 ) 10 W 12 o 41 ·5H 2 O powder and Cu(NO 3 ) 2 ·3H 2 The ratio of O powder is mass ratio 8.34:1, in the mixed solution (NH 4 ) 10 W 12 o 41 ·5H 2 The concentration of O is 0.18mol / L,

[0042] Cu(NO 3 ) 2 ·3H 2 The concentration of O is 0.30mol / L, the concentration of ammonia water is 0.25mol / L, the concentration of polyethylene glycol is 0.05mol / L, and the microwave heating power is 600W;

[0043] In step S2, the roasting process is as follows: the thickness of the tungsten-copper precursor powder layer is 18mm, the roasting temperature is 550°C, the heating rate is 17°C / min, the nitrogen flow rate is 0.35L / min, and the holding time is 40min; the reduction The process is: the flow rate is 0.7L / min, the reduction temperature is 810°C, the heating rate is 8°C / min, the dew point is -40°C, and the holding time is 100min;

[0044] In step S3...

Embodiment 3

[0046] The method of this embodiment and embodiment 1 is basically the same, the difference is:

[0047] In step S1, the (NH 4 ) 10 W 12 o 41 ·5H 2 O powder and Cu(NO 3 ) 2 ·3H 2 The ratio of O powder is mass ratio 4.49:1, in the mixed solution (NH 4 ) 10 W 12 o 41 ·5H 2 The concentration of O is 0.07mol / L, Cu(NO 3 ) 2 ·3H 2 The concentration of O is 0.21mol / L, the concentration of ammonia water is 0.2mol / L, the concentration of polyethylene glycol is 0.02mol / L, and the microwave heating power is 500W;

[0048] In step S2, the roasting process is as follows: the thickness of the tungsten-copper precursor powder layer is 20mm, the roasting temperature is 600°C, the heating rate is 15°C / min, the nitrogen flow rate is 0.5L / min, and the holding time is 60min; the reduction The process is: the flow rate is 1.0L / min, the reduction temperature is 850°C, the heating rate is 10°C / min, the dew point is -35°C, and the holding time is 120min;

[0049] In step S3, the press...

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Abstract

The invention relates to the technical field of powder material molding machining, and discloses a method for preventing the copper loss in the tungsten copper material liquid phase sintering process.The method comprises the following steps that S1, precursor powder is prepared; S2, precursor powder is roasted and restored; and S3, tungsten copper composite powder is molded and roasted. In the precursor powder preparing process, ammonium hydroxide and polyethylene glycol are added, and a microwave heating manner is adopted for heating. The prepared tungsten copper composite powder is of a shell-core structure, and a composite material with high density and extremely less loss can be obtained by means of the powder through liquid phase sintering. The adopted method is simple in operation,low in production cost, low in equipment requirement and suitable for industrial application, the overall performance of the tungsten copper composite material is effectively improved, and the wide application prospects are achieved.

Description

technical field [0001] The invention belongs to the technical field of powder material forming and processing, and in particular relates to a method for preventing copper loss during liquid phase sintering of tungsten-copper materials. Background technique [0002] Tungsten-copper composite materials combine the characteristics of tungsten and copper, and have excellent physical and mechanical properties, such as high electrical and thermal conductivity, low and controllable thermal expansion coefficient, non-magnetic, high-temperature strength and certain plasticity, so , are widely used in electronics, vacuum and aerospace fields. However, tungsten-copper material is a typical pseudo-alloy. Because tungsten and copper are incompatible, it is difficult to sinter and fully densify, and the porosity is large, so it has a great influence on the thermal conductivity, air tightness and mechanical properties of the material. adverse effects. The performance of products produced...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F3/02B22F3/10B22F9/22C22C1/04C22C27/04
CPCB22F3/02B22F3/1035B22F9/22C22C1/045C22C27/04B22F2998/10
Inventor 孙翱魁陈晴柔刘跃军王德志吴壮志傅臻
Owner SHENZHEN QIANYAN MATERIAL TECH
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