Corrosion-resistance high-conductivity copper-based conductive circuit and molding process thereof
A technology of conductive circuit and forming process, which is applied in the field of copper-based conductive circuit and its forming process, which can solve the problems of easy oxidation and corrosion of copper powder, easy migration of silver-based electrons, and lower quality of touch screen, so as to avoid oxidation corrosion and improve electrical conductivity. Good, to avoid the effect of copper oxidation
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Embodiment 1
[0025] Preparation of copper-doped titanium dioxide: After polishing the titanium foil with water sandpaper until the surface is smooth, it is washed in acetone, deionized water and polishing solution successively to remove the natural oxides and other impurities on the surface, and then the titanium foil and the anode Connected, the platinum electrode is the cathode, placed in 400mL ethylene glycol electrolyte, the ethylene glycol electrolyte contains 2% deionized water and 0.3% ammonium fluoride, reacted at 6V for 2h, and dried An ordered titania nanotube array was obtained. Take 0.5mol / L copper sulfate solution, add 4g of titanium dioxide nanotube arrays, stir on a constant temperature stirrer for 20min, transfer the obtained light blue suspension into an ultraviolet circulation system and stir for 5h, and obtain a gray suspension. The turbid liquid was suction-filtered and vacuum-dried to obtain copper-doped titanium dioxide, wherein the mass ratio of copper to titanium di...
Embodiment 2
[0035]Preparation of copper-doped titanium dioxide: After polishing the titanium foil with water sandpaper until the surface is smooth, it is washed in acetone, deionized water and polishing solution successively to remove the natural oxides and other impurities on the surface, and then the titanium foil and the anode Connected, the platinum electrode is the cathode, placed in 400mL ethylene glycol electrolyte, the ethylene glycol electrolyte contains 2% deionized water and 0.3% ammonium fluoride, reacted at 4V for 2h, and dried An ordered titania nanotube array was obtained. Take 0.5mol / L copper sulfate solution, add 5g of titanium dioxide nanotube arrays, stir on a constant temperature stirrer for 20min, transfer the obtained light blue suspension into an ultraviolet circulation system and stir for 5h, and obtain a gray suspension. The turbid liquid was suction-filtered and vacuum-dried to obtain copper-doped titanium dioxide, wherein the mass ratio of copper to titanium dio...
Embodiment 3
[0041] Preparation of copper-doped titanium dioxide: After polishing the titanium foil with water sandpaper until the surface is smooth, it is washed in acetone, deionized water and polishing solution successively to remove the natural oxides and other impurities on the surface, and then the titanium foil and the anode Connected, the platinum electrode is the cathode, placed in 400mL ethylene glycol electrolyte, the ethylene glycol electrolyte contains 2% deionized water and 0.3% ammonium fluoride, reacted at 8V for 2h, and dried An ordered titania nanotube array was obtained. Take 0.5mol / L copper sulfate solution, add 6g of titanium dioxide nanotube arrays, stir on a constant temperature stirrer for 20min, transfer the obtained light blue suspension into an ultraviolet circulation system and stir for 5h, and obtain a gray suspension. The turbid liquid was suction-filtered and vacuum-dried to obtain copper-doped titanium dioxide, wherein the mass ratio of copper to titanium di...
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