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A glass-ceramic solder and method for welding porous silicon nitride and dense silicon nitride using the solder

A glass-ceramic and silicon nitride technology is applied in the field of solder and the use of the solder to weld dense Si3N4 ceramics and porous Si3N4 ceramics, and can solve problems such as mismatching thermal expansion coefficients

Active Publication Date: 2021-03-30
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims to solve the problem that the thermal expansion coefficients of the existing ordinary glass-ceramic solder do not match with porous silicon nitride ceramics and dense silicon nitride ceramics, and provides a glass-ceramic solder and welding of porous silicon nitride and The method of dense silicon nitride

Method used

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  • A glass-ceramic solder and method for welding porous silicon nitride and dense silicon nitride using the solder
  • A glass-ceramic solder and method for welding porous silicon nitride and dense silicon nitride using the solder
  • A glass-ceramic solder and method for welding porous silicon nitride and dense silicon nitride using the solder

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specific Embodiment approach 1

[0037] Specific embodiment one: the present embodiment glass-ceramic solder is made of 20%~22% CaO, 18%~22% Al by weight percentage 2 o 3 , 50% ~ 60% SiO 2 and the balance of Li 2 O made.

specific Embodiment approach 2

[0038]Embodiment 2: In this embodiment, the method for welding porous silicon nitride and dense silicon nitride with glass-ceramic solder includes the following steps:

[0039] 1. Preparation of glass-ceramic solder:

[0040] ①CaO: 20%~22% by weight, Al 2 o 3 : 18%~22%, SiO 2 : 50% ~ 60%, the balance of Li 2 O weighs CaO and Al respectively 2 o 3 , SiO 2 and Li 2 O as solder;

[0041] ② Ball mill the solder, then dry the solder to obtain mixed powder;

[0042] ③Melting the mixed powder, then pouring the melt directly into distilled water to obtain glass fragments that explode into small pieces;

[0043] 4. Carry out ball milling with glass fragments, obtain glass powder, pass through 300 mesh sieves after drying, set aside;

[0044] 2. Welded dense Si 3 N 4 Ceramic and Porous Si 3 N 4 ceramics:

[0045] ①Dense Si 3 N 4 Ceramic and Porous Si 3 N 4 Ceramic processing to welding size, dense Si 3 N 4 The surface to be welded of the ceramic base material is gro...

specific Embodiment approach 3

[0049] Specific embodiment three: the difference between this embodiment and specific embodiment two is: the concrete method that solder is carried out ball milling in step 1.2. is: solder is put into agate ball mill jar, then puts into ZrO 2 (99.9%) balls, adding absolute ethanol, ball milling for 2-4 hours, and the rotating speed is 200-300r / min. Others are the same as in the second embodiment.

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Abstract

The invention relates to a microcrystalline glass solder and a method for soldering porous Si3N4 (silicon nitride) and dense Si3N4 by using the microcrystalline glass solder, in particular to a methodfor soldering dense Si3N4 and porous Si3N4 by the microcrystalline glass solder, which aims at solving the problem of mismatching between the existing common microcrystalline glass solder and the thermal expansion coefficients of porous Si3N4 ceramic and dense Si3N4 ceramic. The microcrystalline glass solder is prepared from the following components of CaO (calcium oxide), Al2O3 (aluminum oxide),SiO2 (silicon dioxide) and Li2O (lithium oxide). The method comprises the following steps of 1, preparing the microcrystalline glass solder; 2, soldering the dense Si3N4 ceramic and the porous Si3N4ceramic. The method is characterized in that the Li2O is added into a CaO-Al2O3-SiO2 system using separated anorthite as a main crystal phase, so as to reduce the melting temperature; spodumene with low thermal expansion coefficient is separated out, so as to reduce the thermal expansion coefficient, thereby matching with the thermal expansion coefficient of base metal. The microcrystalline glasssolder is applied to connect the dense Si3N4 ceramic and the porous Si3N4 ceramic.

Description

technical field [0001] The invention relates to a kind of solder and using the solder to weld dense Si 3 N 4 Ceramic and Porous Si 3 N 4 ceramic method. Background technique [0002] Si 3 N 4 Ceramic materials have the advantages of high hardness, high strength, high wear resistance, good corrosion resistance and thermal shock resistance, and low dielectric constant. Compared with dense silicon nitride ceramics, porous silicon nitride ceramics not only have the basic characteristics of dense silicon nitride ceramics such as high temperature resistance, wear resistance, corrosion resistance and good thermal shock resistance, but also have high porosity and low density. And other characteristics, and the dielectric constant ε can be adjusted by changing the porosity of silicon nitride ceramics, which is more in line with the requirements of high-speed missile radome, and is an ideal missile radome material. Therefore, it is of great engineering significance to realize t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03C10/00C04B37/00
CPCC03C10/0036C04B37/003C04B2237/10
Inventor 张杰方健刘春凤孙良博汪宣志
Owner HARBIN INST OF TECH
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