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A high thermal conductivity crosslinkable resin composition and prepreg and thermosetting copper clad laminate prepared therefrom

A technology of cross-linking resin and composition, applied in the field of communication materials, can solve the problems of difficult to meet high-speed, high-frequency, lossless and large-capacity information transmission, limited addition of thermally conductive fillers, and limited improvement of substrate thermal conductivity, etc. The basis of industrial production, the uniformity of each performance, and the effect of suitable viscosity

Active Publication Date: 2021-06-01
CHANGZHOU ZHONGYING SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the compounding of various thermosetting resins and thermally conductive fillers mentioned above is usually realized through the solution mixing method, followed by gluing-baking-curing and other steps. The process is complicated and the solvent pollution is serious
In particular, the amount of thermally conductive filler added in this process is extremely limited, resulting in a limited increase in the thermal conductivity of the substrate, which is difficult to meet the current needs of high-speed, high-frequency, lossless and large-capacity information transmission

Method used

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  • A high thermal conductivity crosslinkable resin composition and prepreg and thermosetting copper clad laminate prepared therefrom

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Take 70 parts of polybutadiene (Craigville Ricon130), 30 parts of polybutadiene-maleic anhydride copolymer (Craigville Ricon130MA8), 40 parts of BN (particle size 5 μm), 5 parts of SiO 2 (Xinyi Hongrun), 35 parts of decabromodiphenylethane (Shandong Haiwang Chemical) and 1 part of dibenzoyl peroxide (Qinfeng Chemical), 20 o C, stirred and mixed in a ball mill for 120 hours to obtain a uniform high thermal conductivity polydiene composition; the composition was scraped on a clean stainless steel plate to form a film with a thickness of about 0.81 mm, and after baking at 65 ° C for 25 minutes, Continue to bake at 120°C for 60 minutes. After it naturally drops to room temperature, peel off the film from the stainless steel sheet to obtain a semi-cured dielectric sheet; take 1 sheet of the semi-cured dielectric sheet and 2 pieces of loz copper foil, and heat it under a pressure of 130 ~150kg / cm 2 , and laminated for 8 hours at a temperature of 320° C. to prepare a thermose...

Embodiment 2

[0019] Take 65 parts of polybutadiene (Kray Willy Ricon130), 35 parts of polybutadiene-maleic anhydride copolymer (Kray Willy Ricon130MA8), 15 parts of BN (particle size 5 μm), 20 parts of SiC (particle size 6μm), 30 parts of flame retardant magnesium hydroxide (USA Albemarle MAGNIFIN H-5), 20 parts of decabromodiphenylethane (Shandong Haiwang Chemical) and 0.9 parts of dibenzoyl peroxide (Qinfeng Chemical), 20 o C, after stirring and mixing in a ball mill for 120h, a uniform high thermal conductivity polydiene composition was obtained; the molding temperature was set at 25 o C. Molding pressure is 30kg / cm 2 1. The molding time is 10 minutes, and the composition is made into a film with a thickness of about 0.81 mm. After baking at 65°C for 25 minutes, continue to bake at 120°C for 60 minutes. Peel off the stainless steel sheet to obtain a semi-cured dielectric sheet; take 1 sheet of the semi-cured dielectric sheet and 2 pieces of loz copper foil, and press it under a pressur...

Embodiment 3

[0021] Take 65 parts of polybutadiene (Craigville Ricon130), 35 parts of polybutadiene-maleic anhydride copolymer (Craigville Ricon130MA8), 35 parts of BN (particle size 5 μm), 45 parts of polytetrafluoroethylene Pre-sintered material (Shandong Dongyue), 28 parts of decabromodiphenylethane (Shandong Haiwang Chemical) and 0.9 parts of dibenzoyl peroxide (Qinfeng Chemical), 20 o C, after stirring and mixing in a ball mill for 120 hours, a uniform high thermal conductivity polydiene composition was obtained; the composition was scraped on a clean glass plate to form a film with a thickness of about 0.81mm, and after baking at 65°C for 25 minutes, Then continue to bake at 120°C for 60 minutes, and after it naturally drops to room temperature, peel off the film from the glass sheet to obtain a semi-cured dielectric sheet; take 1 sheet of the semi-cured dielectric sheet and 2 pieces of loz copper foil, and heat it under a pressure of 140 ~155kg / cm 2 , and laminated for 8 hours at a t...

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Abstract

The invention relates to a highly thermally conductive cross-linkable resin composition and a prepreg and thermosetting copper clad laminate prepared therefrom. In the invention, the crosslinkable matrix resin, modified resin, high thermal conductivity filler, auxiliary filler, fire retardant and initiator are uniformly mixed through ball milling to prepare a high thermal conductivity crosslinkable resin composition. Subsequently, in a low temperature environment, an uncured sheet with uniform thickness and smooth surface is obtained by extrusion, molding or scraping, and then baked to obtain a prepreg with suitable toughness and viscosity. Finally, the prepreg, film and copper foil are stacked together, and a thermosetting copper clad laminate is prepared by lamination process, which has excellent dielectric properties, mechanical strength and heat resistance, high thermal conductivity, low thermal expansion coefficient, The uniformity of each performance is good, which can meet the various performance requirements of high thermal conductivity copper clad laminate materials in the current high frequency and high speed communication field. The invention has a good industrial production basis and broad application prospects.

Description

technical field [0001] The invention belongs to the field of communication materials, and in particular relates to a highly thermally conductive crosslinkable resin composition and a prepreg and a thermosetting copper clad laminate prepared therefrom. Background technique [0002] Electronic products are rapidly developing in the direction of miniaturization, light weight, thinner and multi-functional. As the main carrier of electronic components, the copper clad laminate has higher and higher integration and finer circuit layout. Therefore, in addition to excellent insulation and thermal-mechanical properties, copper clad laminates should also have good thermal conductivity and heat dissipation functions. Although metal-based CCL has the best heat dissipation capability, its manufacturing cost remains high and production is difficult, and it is mostly used in high-current modules. Ceramic substrates such as alumina-based, aluminum-nitride-based, and silicon-nitride-based s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L47/00C08L27/18C08K13/02C08K3/38C08K3/36C08K5/03C08K3/34C08K3/22B32B15/08B32B27/18B32B27/20B32B27/28B32B37/02B32B37/06B32B37/10
CPCB32B15/08B32B27/18B32B27/20B32B27/28B32B37/02B32B37/06B32B37/10B32B2307/302B32B2457/08C08K2003/2224C08K2003/385C08L47/00C08L2201/02C08L2203/20C08L2205/025C08L2205/03C08K13/02C08K3/38C08K3/36C08K5/03C08K3/34C08K3/22C08L27/18
Inventor 俞卫忠俞丞顾书春冯凯
Owner CHANGZHOU ZHONGYING SCI & TECH CO LTD
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