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Complex plating solution, preparation method and application thereof

A composite electroplating and plating solution technology, applied in the direction of electrolytic coatings, coatings, etc., can solve the problems of short circuit system of electronic devices, affect device reliability, and easily produce tin whiskers, etc., achieve mature preparation process, release internal stress, reduce internal driving force effect

Active Publication Date: 2018-11-30
SHANG RUIYUAN CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the disadvantage of pure tin coating is that it is easy to produce tin whiskers, which will lead to short circuit of electronic devices and system failure, thus seriously affecting the reliability of devices

Method used

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  • Complex plating solution, preparation method and application thereof
  • Complex plating solution, preparation method and application thereof

Examples

Experimental program
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preparation example Construction

[0064] figure 1 It is a schematic flowchart of a method for preparing a composite electroplating solution provided by an embodiment of the present invention. Such as figure 1 Shown, the preparation method of this composite electroplating solution comprises:

[0065] Step S110, obtaining nickel nanoparticles or nickel nanowires.

[0066] In this embodiment, the obtained nickel nanoparticles or nanowires may be existing or prepared by using an existing process. Wherein, the nickel nanoparticle or nickel nanowire has a preset size.

[0067] Step S120, ultrasonically dispersing the obtained nickel nanoparticles or nickel nanowires using a polyethylene glycol dispersant.

[0068] In order to disperse the nickel nanoparticles or nickel nanowires uniformly so that they can be dispersed in the tin electroplating solution, in this embodiment, the nickel nanoparticles or nickel nanowires are ultrasonically dispersed using a polyethylene glycol dispersant. Specifically, the obtained...

Embodiment 1

[0095] Select the TO220 lead frame as the electroplating sample, the substrate is copper alloy C194, and the process flow is to remove flash, high pressure water, chemical degreasing, deoxidation, activation, electroplating, neutralization, and hot water washing. Specifically, the time for flash removal is 1min, temperature 60 degrees Celsius, high pressure water pressure 200kg, chemical degreasing 20s, degreasing temperature 50 ℃, use 5% concentration of sodium persulfate solution for deoxidation, use 10% concentration of methanesulfonic acid solution for activation; The electroplating solution is a tin methanesulfonate matte plating solution with nickel nanoparticles added, and the composition of the plating solution is: 220ml / L of stannous methanesulfonate, 80ml / L of methanesulfonic acid, 50ml / L of additives, and the The mass concentration of nickel nanoparticles is 0.3%, the particle size of nickel nanoparticles is 200nm, the volume of the electroplating tank is 300L, the e...

Embodiment 2

[0097]The TO220 lead frame is selected as the electroplating sample, the base material is copper alloy C194, and the process flow is deflashing, high pressure water, chemical degreasing, deoxidation, activation, electroplating, neutralization, and hot water washing. Specifically, the time for de-flashing is 1min, the temperature is 60 degrees Celsius, the high-pressure water pressure is 200kg, the chemical degreasing is 20s, the degreasing temperature is 50°C, 5% sodium persulfate solution is used for deoxidation, and 10% sulfuric acid solution is used for activation. The composite electroplating solution that electroplating uses is the sulfuric acid system matte electroplating solution that adds nickel nanoparticle, and plating solution consists of: stannous sulfate 20g / L, sulfuric acid 160g / L, additive 40ml / L, the nickel nanoparticle in the composite electroplating solution The mass concentration is 0.3%, the particle size of nickel nanoparticles is 200nm, the volume of the e...

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Abstract

The invention discloses a complex plating solution, and a preparation method and application thereof. The complex plating solution comprises a tin plating solution containing nickel nanoparticles or nickel nanowires. In case of plating by use of the complex plating solution, the nickel nanoparticles or the nickel nanowires are co-deposited with pure tin to form a complex plating. In the complex plating, the nickel nanoparticles or the nickel nanowires can be embedded into the crystal lattices of tin, effectively releasing the internal stress of the plating, thus reducing the internal driving force for tin whiskers to grow to effectively inhibit the growth of the tin whiskers, and with the mature preparation of nickel nanoparticles or nickel nanowires, the complex plating solution is convenient to obtain, and has a good application prospect.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to a composite electroplating solution, a preparation method of the composite electroplating solution and an electroplating method. Background technique [0002] Electroplating is the process of plating a thin layer of other metals or alloys on the surface of some metals or other materials using the principle of electrolysis. In the electronics industry, the purpose of electroplating is mainly to improve the wettability and solderability of the product, so that the product can be smoothly welded to the circuit board and realize the original function of the product. In addition, the coating can also protect the leads on the circuit board from oxidation and corrosion in the harsh external environment. [0003] Today, tin-lead alloys are predominantly used for solderability plating on integrated circuit lead frames. Sn-lead alloy coating is widely used in electronic connection...

Claims

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Application Information

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IPC IPC(8): C25D3/30C25D15/00
CPCC25D3/30C25D15/00
Inventor 桂祥梁重时罗坤金寿银孙中华薛荣富郜湾
Owner SHANG RUIYUAN CHEM TECH
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