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Paste compositions, thermosetting resin compositions, prepregs, laminates and printed circuit boards

A composition, thermosetting technology, applied in the directions of printed circuits, circuit substrate materials, printed circuit components, etc., can solve the problems of hard settling, poor slurry stability, poor surface bonding force of fillers, etc., and achieve excellent fluidity and low viscosity. , the effect of excellent stability

Active Publication Date: 2020-05-19
联瑞新材(连云港)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, through these modification methods, most of the modifiers are adsorbed on the filler surface by physical adsorption, and the binding force with the filler surface is poor. During the preparation of slurry or mixing with thermosetting resin, the modifier is easy to detach from the filler surface. Lead to poor modification effect, poor slurry stability, prone to hard settlement, poor interface between filler and thermosetting resin, etc.

Method used

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  • Paste compositions, thermosetting resin compositions, prepregs, laminates and printed circuit boards
  • Paste compositions, thermosetting resin compositions, prepregs, laminates and printed circuit boards
  • Paste compositions, thermosetting resin compositions, prepregs, laminates and printed circuit boards

Examples

Experimental program
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Effect test

preparation example Construction

[0074] As the preparation method of the resin composition of the present disclosure, known methods such as compounding, stirring, and mixing the slurry composition, thermosetting resin, curing agent and optional curing accelerator, initiator and solvent, and various Additives, to prepare.

[0075] The solvent of the thermosetting resin composition in the present disclosure is not particularly limited, and specific examples include alcohols such as methanol, ethanol, butanol, ethyl cellosolve, butyl cellosolve, ethylene glycol-methyl ether, Carbitol, butyl carbitol and other ethers, acetone, butanone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone and other ketones, toluene, xylene, mesitylene and other aromatic hydrocarbons Classes, ethoxyethyl acetate, ethyl acetate and other esters, N, N-dimethylformamide, N, N-dimethylacetamide, N-methyl-2-pyrrolidone and other nitrogen-containing products solvent. The above-mentioned solvents can be used alone or in combinati...

Embodiment 1-5 and comparative example 1-6

[0103] Embodiment 1-5 and comparative example 1-6 (slurry composition)

[0104] 1. Preparation of modified silica powder (ie component (A)) in Examples 1-5 and Comparative Examples 1-6

[0105] Component (A) uses figure 1 Device preparation as shown

[0106] 100 g of silica powder (raw material silica shown in Table 1) was added to the reforming vessel 10 of the plasma reforming apparatus 100 and stirred by a magnetic stirrer 15 . The inside of the reforming container 10 is evacuated to a vacuum degree of 50-60 Pa by a vacuum pump 20 via a safety bottle 22 . Open the argon gas inlet valve 52 to feed argon gas into the modification container 10, and adjust the argon gas inlet valve 52 to keep the vacuum degree in the modification container 10 at 55 Pa. Then, the reforming container 10 is discharged by the radio frequency power source 30, the discharge power is 120W, and the discharge time is 5min. After the discharge is completed, the first monomer intake valve 42 and the s...

Embodiment 6-10 and comparative example 8-13

[0126] Embodiment 6-10 and comparative example 8-13 (thermosetting resin composition)

[0127] Mix 70 parts by weight of polyphenylene ether resin MMMAPPE and 70 parts by weight of toluene solvent as a solvent, and dissolve completely to obtain a polyphenylene ether resin solution. Then add 30 parts by weight of R100 as cross-linking curing agent, and add 3 parts by weight of cumene peroxide DCP as initiator, 15 parts by weight of BT-93W as flame retardant and embodiments 1 to 5 and comparative example 2- 7 One of the prepared slurry compositions (45 parts by weight based on solid content, that is, the amount of the slurry composition excluding the solvent toluene or xylene) was used as filler. Stir the above mixture evenly to obtain the thermosetting resin compositions of Examples 6-10 and Comparative Examples 8-13.

[0128]The thermosetting resin compositions of Examples 6-10 and Comparative Examples 8-13 were subjected to the following performance evaluation. The evaluati...

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Abstract

The invention provides a slurry composition, a thermosetting resin composition, a prepreg, a laminated board, and a printed circuit board. The slurry composition comprises: (A) a silica powder, wherein the surface of the silica powder is grafted with an organic polymer layer formed by plasma treatment of a weakly polar or non-polar monomer; and (B) an organic solvent, wherein the component (A) accounts for 30-80% of the total weight of the slurry composition. The slurry composition has a low viscosity and an excellent stability; and the thermosetting resin composition containing the slurry composition has excellent fluidity, dispersibility, and dielectric properties.

Description

technical field [0001] The present disclosure relates to a slurry composition. Specifically, the present disclosure relates to a paste composition and a thermosetting resin composition, a prepreg, a laminate, and a printed circuit board including the paste composition. Background technique [0002] With the development of information science and technology, electronic products are rapidly developing in terms of miniaturization, multi-function, high performance and high reliability. The information carrying capacity of electronic products is also gradually increasing, and the speed of information processing is also accelerating. Laminates and printed circuit boards, which are one of the main components of electronic products, are required to have high stability and low dielectric constant. At the same time, in order to achieve high-fidelity signals under high-speed transmission, and to solve the problem of concentrated heat loss and difficulty in dissipation caused by thinni...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08K9/10C08K3/36C08K7/18C08K7/00C08L71/12C08L25/10C08K13/06C08K7/14H05K1/03B32B15/20B32B17/02B32B17/06
CPCB32B15/20B32B17/02B32B17/06C08K3/36C08K7/00C08K7/18C08K9/10C08L71/123C08L2203/20H05K1/0373C08L25/10C08K13/06C08K7/14
Inventor 郝良鹏柴颂刚胡鹏
Owner 联瑞新材(连云港)有限公司