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A welding method for aluminum silicon carbide ceramic substrate based on PVD coating

A technology of aluminum silicon carbide and ceramic substrates, applied in welding equipment, manufacturing tools, printed circuit manufacturing, etc., can solve the problems of poor weldability between metal and ceramics, achieve high welding bonding force, simple preparation process, and increase metal wettability and the effect of binding strength

Active Publication Date: 2021-07-23
江苏泰芯源科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The object of the present invention is to provide a method for welding aluminum silicon carbide ceramic substrates based on PVD coating, which solves the problem of poor weldability between existing metals and ceramics

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  • A welding method for aluminum silicon carbide ceramic substrate based on PVD coating

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Embodiment Construction

[0033] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0034] A kind of welding method based on the aluminum silicon carbide ceramic substrate of PVD coating provided by the invention comprises the following steps:

[0035] S1. Before spraying aluminum silicon carbide ceramic substrates and DBC boards, the substrates are first degreased and dried with 40g / L acetone degreaser; then washed with water at a temperature of 30-70°C for 1-10min, with a passing concentration of 5-20% Clean with ethylenediamine phosphate solution to decontaminate and activate the surface at a temperature of 19-30°C for 20-50s;

[0036] S2. Polish the cleaned aluminum silicon carbide ceramic substrate and DBC plate on a grinder until the surface finish is Ra<0.008 μm, and clean it by S1 method after polishing;

[0037] S3. Place the polished aluminum silicon carbide ceramic substrate and DBC plate in the coating chamber, turn on the vacuu...

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Abstract

A method for welding aluminum silicon carbide ceramic substrates based on PVD coatings provided by the present invention comprises the following steps: S1, cleaning and drying the aluminum silicon carbide ceramic substrates and DBC plates sequentially using acetone degreasing agent, water and weak hydrochloric acid ; S2, place the polished aluminum silicon carbide ceramic substrate and DBC board in the coating chamber for copper plating, respectively to obtain the primer film layer; S3, place the finished aluminum silicon carbide ceramic substrate and DBC board in the coating chamber In the process, nickel-boron plating is carried out on the primer layer to obtain the nickel-boron solderable layer of the aluminum silicon carbide ceramic substrate and the nickel-boron solderable layer of the DBC board respectively; S4, the aluminum silicon carbide ceramic substrate and the DBC board in S3 are After cleaning, place the DBC board on the aluminum silicon carbide ceramic substrate, and the nickel-boron solderable layer of the DBC board is in contact with the nickel-boron solderable layer on the aluminum silicon carbide ceramic substrate; S5, after stacking in S4 The substrate is placed in a reflow furnace for reflow soldering, and the welding of the aluminum silicon carbide ceramic substrate is completed; the welding bonding force of the present invention is relatively large, the preparation process is simple, and it can be widely used in production.

Description

technical field [0001] The invention belongs to the technical field of aluminum-silicon carbide composite materials, and in particular relates to a welding method of an aluminum-silicon carbide ceramic substrate based on a PVD coating. Background technique [0002] Aluminum silicon carbide ceramic substrates have high thermal conductivity, adjustable thermal expansion coefficient, high specific strength and specific stiffness, wear resistance, fatigue resistance, low density and good dimensional stability, and are widely used in aerospace and electronic equipment fields Because of its brittleness and hardness, the ceramic material has a higher melting point than metal, and the linear expansion coefficient is quite different from that of metal, so the residual stress in the welded joint is very high. In addition, the compatibility between ceramics and metals is poor, so the weldability of metals and ceramics is very poor. The arc welding and resistance welding commonly used i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K1/20B23K1/008H05K3/34
CPCB23K1/008B23K1/20B23K1/206H05K3/34H05K3/3494
Inventor 唐健江王鹏冲
Owner 江苏泰芯源科技有限公司