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Electrochemical treatment method for resisting oxidation of copper materials

A treatment method, electrochemical technology, applied in the direction of electrolytic organic material coating, etc., can solve the problems of expensive treatment, long treatment time, high treatment temperature, etc., and achieve high salt and alkali corrosion resistance, simple operation, and strong oxidation resistance. Effect

Active Publication Date: 2019-01-08
XIAMEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although this method improves the antioxidant capacity of copper powder, it needs to add expensive reagents such as benzotriazole and silver nitrate, which will inevitably increase the cost.
[0011] The above anti-oxidation methods are either expensive to deal with, will pollute the environment, or the treatment temperature is high and the treatment time is long. Therefore, developing a simple and efficient anti-oxidation and corrosion-resistant surface treatment method for copper materials is currently the solution The main way to apply technical problems in the fields of electrical power industry, machinery and vehicle manufacturing industry, chemical industry, construction industry, defense industry, etc.

Method used

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  • Electrochemical treatment method for resisting oxidation of copper materials
  • Electrochemical treatment method for resisting oxidation of copper materials
  • Electrochemical treatment method for resisting oxidation of copper materials

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Take 1×3cm 2 For copper foil (thickness: 25 μm), the organic matters and oxides on the surface are ultrasonically washed with an ethanol solution of 1 wt% formic acid, and then washed with ethanol, and dried with nitrogen for use. The electrochemical workstation of CHI660E is used as the electrochemical treatment equipment, the cleaned copper foil is used as the working electrode, the saturated calomel electrode is used as the reference electrode, and the platinum electrode is used as the counter electrode to form a three-electrode system, using 1wt% sodium formate aqueous solution (pH=10) As the electrolyte solution, the cyclic voltammetry technique (scanning speed: 10mV / s, scanning range: -1~0.5V) is used to scan the surface of the copper foil twice at 30°C to conduct electricity on the surface of the copper foil. Chemical reconstruction, the copper foil before and after the electrochemical reconstruction was subjected to x-ray diffraction test. The results showed that ...

Embodiment 2

[0037] Take 1×3cm 2 The copper foil (thickness: 25 μm) was washed with a 1wt% formic acid aqueous solution for 10 min ultrasonically to wash the organic matter and oxide on the surface, then washed with ethanol, and dried with nitrogen for use. The CHI440E electrochemical workstation is used as the electrochemical processing equipment, the washed copper foil is used as the working electrode, the saturated calomel electrode is used as the reference electrode, and the graphite sheet is used as the counter electrode to form a three-electrode system, using 1wt% sodium formate / Ethylene glycol solution (pH=9) is used as the electrolyte solution. First, cyclic voltammetry (scanning speed: 50mV / s, scanning range: -1.5~0.5V) is used to scan the surface of copper foil twice at 45℃ to The surface of the copper foil was electrochemically reconstructed, and the copper foil before and after the electrochemical reconstruction was subjected to an x-ray diffraction test. The results showed that...

Embodiment 3

[0039] Take 1×3cm 2 For 1 piece of copper foil, use 1wt% formic acid aqueous solution to ultrasonic for 10min to wash the organic matter and oxide on the surface, and then wash with ethanol, then dry it with nitrogen for use. The CHI440E electrochemical workstation is used as the electrochemical processing equipment, the washed copper foil is used as the working electrode, the saturated calomel electrode is used as the reference electrode, the graphite sheet electrode is used as the counter electrode, and 2wt% sodium formate aqueous solution is used as the electrolyte solution. First, the cyclic voltammetry technique (scanning speed: 50mV / s, scanning range: -1.5~0.5V) was used to scan the surface of copper foil twice at 30°C to reconstruct the surface of the copper foil by electrochemistry. The copper foil before and after the structure was subjected to the x-ray diffraction test, and the results showed that the x-ray diffraction peak of the (110) crystal plane of the copper foi...

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Abstract

The invention belongs to the field of material surface treatment, and particularly discloses an electrochemical treatment method for resisting oxidation of copper materials. The method comprises the steps of using the copper materials as working electrodes, sequentially performing electrochemistry restructuring and electrochemical deposition in electrolyte containing a stabilizing agent, wherein the stabilizing agent is a compound which can provide formate, so that the surfaces of the copper materials can absorb formate. The electrochemical method enables the formate to be painted to the surfaces of the copper materials, so that the antioxidant ability of the copper materials is improved, and the method is simple to operate, simple in condition, and low in cost, and has high industrial application prospects.

Description

Technical field [0001] The invention belongs to the field of material surface treatment, and specifically relates to an electrochemical treatment method for copper material oxidation resistance. Background technique [0002] Copper is one of the base metal materials with the longest history of human use. Copper has very good electrical conductivity (second only to silver), thermal conductivity, excellent formability and low price, and is widely used in the electrical and power industry, machinery and vehicle manufacturing industry, chemical industry, construction industry, defense industry and other fields . However, copper materials are easily oxidized in the natural environment, and the surface is easily corroded, thereby degrading its physical and chemical properties, which is manifested as a rapid decline in electrical and thermal conductivity, which limits its application. [0003] At present, the anti-oxidation and anti-corrosion surface treatment methods of copper mainly i...

Claims

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Application Information

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IPC IPC(8): C25D9/02
CPCC25D9/02
Inventor 郑南峰彭健吴炳辉毛和旭郝树强符昂
Owner XIAMEN UNIV