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Heat dissipating ink and heat dissipating shield case preparation method

A technology of shielding cover and ink, which is applied in the direction of ink, household utensils, applications, etc., can solve problems such as temperature rise of electronic components, heat concentration of electronic products, dead components and other problems, and achieve improved yield rate, excellent electrical insulation performance, Effect of Excellent Heat Dissipation Performance

Active Publication Date: 2019-01-25
GUANGDONG HERUN PRECISION METAL MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The components of electronic products such as mobile phones and tablet computers will generate heat when they are working. When the heat inside the electronic product cannot be diffused to the outside of the electronic product in time through the shielding cover, it may cause the internal heat of the electronic product to concentrate, causing the temperature of the electronic component to rise. High causes crash or component burnout

Method used

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  • Heat dissipating ink and heat dissipating shield case preparation method
  • Heat dissipating ink and heat dissipating shield case preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] A heat dissipation ink, comprising the following raw materials in parts by weight: 60 parts of polyimide modified epoxy resin, 30 parts of polyvinyl chloride resin, 50 parts of boron nitride thermal conductive filler, 25 parts of radiation heat dissipation filler, 10 parts of γ-ammonia Propyl triethoxysilane coupling agent, 10 parts of organic bentonite anti-sedimentation agent, 8 parts of 1090 leveling agent, 15 parts of pigment and filler, 50 parts of butanone solvent, 35 parts of curing agent.

[0049] Among them, the boron nitride thermally conductive filler is nanoscale acicular boron nitride thermally conductive filler, nanoscale granular boron nitride thermally conductive filler, nanoscale fibrous boron nitride thermally conductive filler and nanoscale columnar boron nitride thermally conductive filler. 2:3:8:1.5 composed.

[0050] The radiation heat dissipation filler is a mixture of silicon dioxide and sericite powder in a weight ratio of 3:5.

[0051] The cur...

Embodiment 2

[0061] A heat dissipation ink, comprising the following raw materials in parts by weight: 70 parts of polyimide modified epoxy resin, 37.5 parts of polyvinyl chloride resin, 57.5 parts of thermal conductive filler, 32.5 parts of radiation heat dissipation filler, 12.5 parts of coupling agent, 12.5 parts Anti-settling agent, 10 parts of leveling agent, 20.5 parts of pigment and filler, 55 parts of solvent, 40.5 parts of curing agent.

[0062] Among them, the thermally conductive filler is a mixture of boron nitride and silicon carbide at a weight ratio of 2:1, and the thermally conductive fillers are nanoscale needle-shaped thermally conductive fillers, nanoscale granular thermally conductive fillers, nanoscale fibrous thermally conductive fillers, and nanoscale columnar thermally conductive fillers. The thermal conductive filler is composed of 3.5:3.5:9:1.75 by weight.

[0063] The coupling agent is a mixture of pyrophosphate titanate and vinyl tris(β-methoxyethoxy)silane in a...

Embodiment 3

[0072] A heat dissipation ink, comprising the following raw materials in parts by weight: 80 parts of polyimide modified epoxy resin, 45 parts of polyvinyl chloride resin, 65 parts of thermal conductive filler, 40 parts of radiation heat dissipation filler, 15 parts of coupling agent, 15 parts Anti-settling agent, 12 parts of leveling agent, 26 parts of pigment and filler, 60 parts of solvent, 46 parts of curing agent.

[0073] Among them, the thermally conductive filler is a mixture of alumina, magnesia, and graphene oxide at a weight ratio of 1:1:1, and the thermally conductive filler is nanoscale needle-shaped thermally conductive filler, nanoscale granular thermally conductive filler, nanoscale fibrous thermally conductive filler, and nanoscale fibrous thermally conductive filler. The filler and the nano-scale columnar thermal conductive filler are composed of a weight ratio of 5:4:10:2.

[0074] The coupling agent is a mixture of γ-aminopropyltriethoxysilane, vinyltrietho...

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Abstract

The invention relates to the technical field of heat dissipating materials, particularly to heat dissipating ink and a heat dissipating shield case preparation method, wherein the heat dissipating inkcomprises the following raw materials by weight: 60-80 parts of a polyimide modified epoxy resin, 30-45 parts of a polyvinyl chloride resin, 50-65 parts of a thermally conductive filler, 25-40 partsof a radiation heat-dissipating filler, 10-15 parts of a coupling agent, 10-15 parts of an anti-precipitation agent, 8-12 parts of a leveling agent, 15-26 parts of a pigment filler, 50-60 parts of a solvent, and 35-46 parts of a curing agent. The heat dissipating ink of the present invention has advantages of excellent heat dissipation performance, good dielectric property, good thermal stability,good toughness and good aging resistance.

Description

technical field [0001] The invention relates to the technical field of heat dissipation materials, in particular to a preparation method of heat dissipation ink and a heat dissipation shield. Background technique [0002] The shielding cover is a tool used to shield the influence of external electromagnetic waves on the internal circuit and the external radiation of electromagnetic waves generated inside. It is mainly used in mobile phones, tablet computers, GPS and other fields. The components of electronic products such as mobile phones and tablet computers will generate heat when they are working. When the heat inside the electronic product cannot be diffused to the outside of the electronic product in time through the shielding cover, it may cause the internal heat of the electronic product to concentrate, causing the temperature of the electronic component to rise. High lead to crashes or components burnt out. Therefore, the heat dissipation performance of the shield i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/102C09D11/106C09D11/03
CPCC09D11/03C09D11/102C09D11/106
Inventor 刘声金
Owner GUANGDONG HERUN PRECISION METAL MATERIALS CO LTD
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