Copper-coated glass fiber reinforced flexible epoxy resin root puncture resistant waterproof composite material
A technology of flexible epoxy resin and glass fiber, which is applied in the field of waterproof material preparation, can solve the problems of difficult processing of inner corners, increased cost, complicated process, etc., achieve good root puncture resistance and waterproof effect, save production cost, and avoid pollution environmental effects
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Embodiment 1
[0029] 1) Arranging the glass fibers in a degreasing liquid for 30 minutes at 40° C., and placing the treated glass fibers in 10 wt % dilute sulfuric acid to neutralize the lye on the surface;
[0030] The degreasing liquid is: a mixed solution of sodium hydroxide 60g / L, sodium carbonate 30g / L and sodium phosphate 15g / L;
[0031] 2) Arrange the degreased and neutralized glass fiber in step 1) in the sensitization solution, sensitize it at 25°C for 10 minutes, and rinse it repeatedly with clean water;
[0032] The sensitizing solution is: a mixture of stannous chloride 10g / L and hydrochloric acid 40ml / L; the percentage concentration of hydrochloric acid is 38%;
[0033] 3) Arrange the glass fiber sensitized in step 2) in the activation solution and activate it at 25°C for 10 minutes, and the Pd in the solution 2+ The ions are converted into metal Pd particles, and then placed in 10g / L sodium hypophosphite for 10min to reduce the Pd on the surface 2+ ;
[0034] The activati...
Embodiment 2
[0040] Embodiment 2, with embodiment 1, the difference is,
[0041]1) Place the glass fiber bundles in a degreasing solution for 30 minutes at 40°C, and place the treated glass fiber bundles in 10 wt% dilute sulfuric acid to neutralize the lye on the surface;
[0042] 4) adjusting the pH value of the plating solution to 10 with ammonia water, placing the activated glass fiber bundles in step 3) in the copper plating solution, and plating copper at 80° C. for 20 minutes to obtain copper-plated glass fiber bundles;
[0043] Described copper plating liquid is: copper sulfate 40g / L, sodium hypophosphite 30g / L, sodium citrate 60g / L, the mixed solution of ammonium chloride 50g / L and thiourea 5mg / L;
[0044] 5) The mass parts are 100 parts of bisphenol A type E51 epoxy resin, 55 parts of curing agent D400 polyetheramine, 10 parts of plasticizer dibutyl phthalate, and 4 parts of curing accelerator nonylphenol. Stir evenly to obtain a flexible epoxy resin matrix;
[0045] 6) Forming ...
Embodiment 3
[0054] Embodiment 3, with embodiment 1, the difference is,
[0055] 1) Place the glass fiber bundles in a degreasing solution for 30 minutes at 40°C, and place the treated glass fiber bundles in 10 wt% dilute sulfuric acid to neutralize the lye on the surface;
[0056] 4) Adjust the pH value of the plating solution to 11 with ammonia water, place the activated glass fiber bundles in step 3) in the copper plating solution, and perform copper plating at 90° C. for 30 minutes to obtain copper-plated glass fiber bundles;
[0057] Described copper plating liquid is: copper sulfate 50g / L, sodium hypophosphite 40g / L, sodium citrate 70g / L, the mixed solution of ammonium chloride 60g / L and thiourea 6mg / L;
[0058] 5) The mass parts are 100 parts of bisphenol A type E51 epoxy resin, 55 parts of curing agent D400 polyetheramine, 10 parts of plasticizer dibutyl phthalate, and 4 parts of curing accelerator nonylphenol. Stir evenly to obtain a flexible epoxy resin matrix;
[0059] 6) Form...
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