Low-hydroxyl phosphorus-containing epoxy resin and composition for copper clad laminate and preparation method thereof
A technology of epoxy resin and resin for copper-clad laminates, which is applied in the field of low-hydroxyl phosphorus-containing epoxy resin and copper-clad laminates and its preparation, raw materials for copper-clad laminates, and can solve the problems of high dielectric constant, dielectric loss, and water absorption. High efficiency, affecting the stability of copper clad laminates and other issues, to achieve the effect of low dielectric constant, low water absorption, glass transition temperature Tg increase
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Embodiment 2-1～2-8
[0057] Example 2-1~2-8 Formulation Raw Material Consumption Table of Resin Composition for Copper Clad Laminate (Unit: kg)
[0058]
[0059]
[0060] Example 2-1 to 2-8 Sheet performance results of the resin composition for copper-clad laminates
[0061]
Embodiment 3
[0063] A low-hydroxyl phosphorus-containing epoxy resin is produced by mixing novolac epoxy resin, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO for short) and catalyst A Phosphorus-containing epoxy, then add isocyanate for further reaction to obtain low-hydroxyl phosphorus-containing epoxy resin;
[0064] The chemical structural formula of described novolak epoxy resin is:
[0065] In the formula: R is H, -CH 3 , n=1~7;
[0066] The catalyst A is tetraethylammonium bromide, tetramethylammonium chloride, triphenylphosphine, ethyltriphenylphosphine bromide, ethyltriphenylphosphine iodide, and ethyltriphenylphosphine acetate One or more mixtures;
[0067] The isocyanate is one or a mixture of two or more of diphenylmethane diisocyanate (abbreviated as MDI), toluene diisocyanate (abbreviated as TDI), and hexamethylene isocyanate (abbreviated as HDI).
Embodiment 4
[0069] The preparation method of low-hydroxyl phosphorus-containing epoxy resin, the steps are: 40 parts by mass of novolac epoxy resin, 10 parts by mass of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (abbreviated as DOPO) into the reactor (for example: three-necked flask, reaction kettle, etc.), heated to 110 ° C, stirred until 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (referred to as DOPO ) (completely) melted, add 0.1 parts by mass of catalyst A, stir and heat up to 140°C, and stir and react at this temperature for 1 hour, add 5 parts by mass of isocyanate, and then heat up to 170°C and stir for 1 to 6 hours, when When the hydroxyl equivalent is greater than or equal to 5000, lower the temperature, add 25 parts by mass of propylene glycol methyl ether and butanone mixed solvent, and stir evenly to obtain a low-hydroxyl phosphorus-containing epoxy resin.
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