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A kind of electroless copper plating activator and its preparation method and the method for making circuit based on the full addition of this activator

A technology of electroless copper plating and activator, which is applied in liquid chemical plating, metal material coating process, coating and other directions, can solve the problems of complicated and time-consuming preparation, poor universality of the bridge layer on the surface of the substrate, and the influence of conductive ink, etc. To achieve the effect of ensuring uniform distribution

Active Publication Date: 2020-12-18
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Aiming at the problems that the existing full-addition circuit manufacturing process faces such problems as conductive ink is easy to agglomerate and additives affect the circuit conductivity, and the bridging layer on the surface of the substrate is poor in universality and complicated and time-consuming to prepare, the present invention provides a new electroless copper plating activator and Preparation method and method for making full addition circuit based on the activator

Method used

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  • A kind of electroless copper plating activator and its preparation method and the method for making circuit based on the full addition of this activator
  • A kind of electroless copper plating activator and its preparation method and the method for making circuit based on the full addition of this activator
  • A kind of electroless copper plating activator and its preparation method and the method for making circuit based on the full addition of this activator

Examples

Experimental program
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Effect test

Embodiment 1

[0066] Select thiourea as a complexing agent, dissolve it in propylene glycol methyl ether under the condition of room temperature and magnetic stirring 200r / min, and obtain a solution with a thiourea concentration of 0.03mol / L; add catalyst AgNO 3 , completely dissolved under magnetic stirring to obtain a solution with a silver ion concentration of 0.01mol / L; then add 1.5mol / L bisphenol A epoxy resin and completely dissolve under magnetic stirring; then add an appropriate amount of curing agent 593 and magnetically stir evenly, Until the viscosity is 50-80mPa·S, the surface tension is between 25-45mN / m; use inkjet printing equipment to print the activator on the surface of the epoxy glass fiber substrate to form a preset circuit diagram with catalytic activity; room temperature curing Cooperate with electroless copper plating to obtain the required conductive pattern.

[0067] figure 2 a is the EDS energy spectrum analysis diagram of the copper layer after electroless coppe...

Embodiment 2

[0070] The operation of this embodiment is basically the same as that of Example 1, except that the composition of the electroless copper plating activator is specifically: the organic solvent is propylene glycol methyl ether acetate, and the concentration of 3-mercaptopropyltriethoxysilane is 0.1mol / L, AgNO 3 The concentration of the novolak epoxy resin is 0.015mol / L, the concentration of the novolak epoxy resin is 2mol / L, add an appropriate amount of curing agent 593 and magnetically stir evenly until the viscosity is 50-80mPa·S and the surface tension is between 25-45mN / m.

[0071] Cyclopenta-2,4-dienyl-1-thione (C 5 h 4 S) and 1-pyrrole-1-thiol (C 4 h 5 NS)

Embodiment 3

[0073] The operation of this embodiment is basically the same as that of Example 1, except that the composition of the electroless copper plating activator is specifically: the organic solvent is dipropylene glycol methyl ether, and the concentration of 3-aminopropyltriethoxysilane is 0.5mol / L, AgNO 3 The concentration of the epoxy resin is 0.02mol / L, and the concentration of the glycerol ether epoxy resin is 3mol / L. Add an appropriate amount of curing agent 593 and magnetically stir evenly until the viscosity is 50-80mPa·S and the surface tension is between 25-45mN / m.

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Abstract

An electroless copper plating activator, a preparation method thereof, and a full-additive circuit manufacturing method based on the activator belong to the technical field of electroless plating and circuit manufacturing. The present invention adds a complexing agent that is miscible with the adhesive and contains unsaturated bonds and a curing agent that matches the adhesive on the basis of the traditional activator. During the curing process after the preset circuit pattern is formed, the adhesive passes through physical adsorption and chemical action. It is firmly combined with the substrate, and the complexing agent that adsorbs the catalyst ion is chemically bonded with the epoxy resin adhesive, so that the catalyst ion is evenly distributed in the active layer on the substrate surface, thus realizing the formation of a bridging layer on the substrate surface and Immobilize the catalyst, cooperate with the subsequent electroless plating process to form a dense, bright, and strong adhesion coating, which overcomes the agglomeration of metal nanoparticles and the influence of additives on the conductivity of the line and the generality of the bridging layer on the surface of the substrate faced by the existing full-additive circuit manufacturing process. Poor adaptability and complex and time-consuming preparation.

Description

technical field [0001] The invention belongs to the technical field of electroless plating and circuit production, and in particular relates to an electroless copper plating activator, a preparation method thereof, and a method for fully additively producing circuit based on the activator. Background technique [0002] At present, the mainstream printed circuit board circuit manufacturing methods are as follows: subtractive method, semi-additive method and full additive method: [0003] The subtractive method is a method of making circuits on a substrate with a copper layer of a specified thickness (the thickness is the final required thickness of the copper layer circuit) formed on the surface. First, a film is pasted on the copper layer and developed to form a resist pattern, and then through selective engraving. The exposed copper layer is removed by etching, and finally the circuit pattern is obtained after removing the resist pattern. The process flow of the method is ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/40
CPCC23C18/40
Inventor 王跃峰洪延周国云何为王守绪王翀陈苑明杨文君
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA