Moisture-curable type organosilicon-modified flame-retardant polyurethane hot melt adhesive and preparation method thereof

A polyurethane hot-melt adhesive and moisture-curing technology, which is applied in the field of structural adhesives, can solve the problems of reducing the chemical resistance of polyurethane hot-melt adhesive coatings, solve solvent resistance, improve flame retardancy and adhesion , the effect of improving compatibility

Inactive Publication Date: 2019-04-12
SHUNDE POLYTECHNIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These non-reactive system tackifying resins cannot participate in curing to form a cross-linked network, which easily reduces the chemical resistance, heat resistance and aging resistance of polyurethane hot melt adhesive coatings.

Method used

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  • Moisture-curable type organosilicon-modified flame-retardant polyurethane hot melt adhesive and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] It is a moisture-curing silicone-modified flame-retardant polyurethane hot-melt adhesive, which is prepared by the following steps:

[0027] Step 1 Synthesis of hydroxyl-terminated phosphorus-containing flame-retardant polyorganosilicon acrylate copolymer

[0028] 7 parts of methacryloxypropyl monoblocked dimethyl polysiloxane MAPDMS, 10 parts of methyl methacrylate MMA, 20 parts of butyl acrylate BA and 8 parts of 2-methyl-2 -Acrylic acid-2-hydroxyethyl ester phosphate HMP was dissolved in 50 parts of toluene, controlled at 60°C, and under nitrogen protection, 2.4 parts of thermal initiator 4,4'-azobis(4-cyano Pentanol), polymerized for 5 hours, and after the toluene was removed by rotary evaporation, a hydroxyl-terminated phosphorus-containing flame-retardant polyorganosilicon acrylate copolymer was obtained, and the number-average molecular weight of the hydroxyl-terminated phosphorus-containing flame-retardant polyorganosilicon acrylate copolymer was 11000, whose c...

Embodiment 2

[0032] It is a moisture-curing silicone-modified flame-retardant polyurethane hot-melt adhesive, which is prepared by the following steps:

[0033] Step 1 Synthesis of hydroxyl-terminated phosphorus-containing flame-retardant polyorganosilicon acrylate copolymer

[0034] 13 parts of methacryloxypropyl monoblocked dimethyl polysiloxane MAPDMS, 25 parts of methyl methacrylate MMA, 10 parts of butyl acrylate BA and 15 parts of 2-methyl-2- Acrylic acid-2-hydroxyethyl ester phosphate HMP was dissolved in 80 parts of toluene, controlled at 65°C, under nitrogen protection, added 1.5 parts of thermal initiator 4,4'-azobis(4-cyanopentyl Alcohol), polymerization reaction for 14 hours, after removing toluene by rotary evaporation, obtain hydroxyl-terminated phosphorus-containing flame-retardant polyorganosilicon acrylate copolymer, the number-average molecular weight of hydroxyl-terminated phosphorus-containing flame-retardant polyorganosilicon acrylate copolymer is 23000 , its chemical...

Embodiment 3

[0038] It is a moisture-curing silicone-modified flame-retardant polyurethane hot-melt adhesive, which is prepared by the following steps:

[0039] Step 1 Synthesis of hydroxyl-terminated phosphorus-containing flame-retardant polyorganosilicon acrylate copolymer

[0040] 15 parts of methacryloxypropyl monoblocked dimethyl polysiloxane MAPDMS, 25 parts of methyl methacrylate MMA, 15 parts of butyl acrylate BA and 20 parts of 2-methyl-2- Acrylic acid-2-hydroxyethyl ester phosphate HMP was dissolved in 90 parts of toluene, controlled at 75°C, under the protection of nitrogen, 0.5 parts of thermal initiator 4,4'-azobis(4-cyanopentyl) was added alcohol), polymerized for 10 hours, and removed toluene by rotary evaporation to obtain a hydroxyl-terminated phosphorus-containing flame-retardant polyorganosilicon acrylate copolymer, and the number-average molecular weight of the hydroxyl-terminated phosphorus-containing flame-retardant polyorganosilicon acrylate copolymer was 33,000 , i...

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Abstract

The invention discloses a moisture-curable type organosilicon-modified flame-retardant polyurethane hot melt adhesive and a preparation method thereof. The hot melt adhesive is characterized by comprising 5-15 parts of polyether diol, 1-25 parts of liquid polyester diol, 1-40 parts of flame-retardant polyether polyol, 1-25 parts of crystalline type polyester diol, 5-40 parts of hydroxyl-terminatedphosphorus-containing flame-retardant poly organosilicon acrylate copolymer, 10-40 parts of isocyanate, 0.1-1 part of catalyst, 0.01-1 part of antioxidant, and 0.1-2 parts of silane coupling agent. According to the invention, hydroxyl-terminated poly(monomethacryloxypropyl terminated polydimethylsiloxane-random-methyl methacrylate-random-butyl acrylate-random-2-hydroxyethyl methacrylate phosphate) is firstly synthesized, then is added to a polyurethane prepolymer, an organosilicon acrylate copolymer chain segment and a reactive flame retardant are introduced, so that the chemical aging resistance and flame retardancy of a polyurethane colloid are further improved.

Description

technical field [0001] The invention belongs to the technical field of structural adhesives, and in particular relates to a moisture-curing silicone-modified flame-retardant polyurethane hot-melt adhesive and a preparation method thereof, which are mainly used in electronics and electric appliances, automobiles, textiles and footwear, and food packaging Industry, wood material processing and furniture industry and other structural bonding fields. Background technique [0002] Polyurethane hot melt adhesive is a new generation of structural adhesive that can provide excellent bonding performance. It is a type of hot melt adhesive made of polyurethane prepolymer as the main material and various additives. Polyurethane hot melt adhesives are easy to use and environmentally friendly, and their performance is comparable to solvent-based hot melt adhesives. In the past ten years, polyurethane hot melt adhesives have been rapidly developed and widely used in high-end fields such a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/08C09J11/06C08G18/48C08G18/42C08G18/63
CPCC08G18/4072C08G18/42C08G18/48C08G18/635C09J11/06C09J175/08C08K5/54
Inventor 陈燕舞刘锋彭琦路风辉霍应鹏唐秋实徐健浩何华荣
Owner SHUNDE POLYTECHNIC
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