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A kind of preparation method of polyurethane modified phenolic resin composition for semiconductor encapsulation

A technology of polyurethane modification and phenolic resin, which is applied in the direction of epoxy resin glue, adhesive type, adhesive, etc., can solve the problems of not taking into account other properties of materials, high interfacial tension, poor compatibility, etc., to improve manufacturability and Excellent effects of solder resistance, modulus reduction, weather resistance and mechanical strength

Active Publication Date: 2021-11-02
杭州千岛湖赋溪实业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is prepared solely by adding organic fluorine or single-phase phenolic solidification. The interfacial tension of the two phases of organic fluorine and phenolic formaldehyde in the material is too large, the compatibility is poor, and other properties of the material cannot be considered.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Add 450ml of isopropanol and 336g of hexafluorobisphenol A, 100 grams of bisphenol A in a 2-liter reaction kettle with a thermometer, a stirrer and a reflux condenser, and stir at 60°C to make the hexafluorobisphenol A and bisphenol A fully dissolve. Then 5 g of oxalic acid was added and the temperature was raised to 80°C. Add a total of 90g of paraformaldehyde in batches, about 10g for the first feeding, and about 8g for each subsequent feeding. Control the feeding time within 45 minutes. After feeding, the temperature was raised to 95°C, and the reaction was stirred vigorously for about 5 hours. Raise the temperature to 160°C, distill under reduced pressure at a vacuum of -0.8MPa, and condense and recover the solvent through a condenser tube to obtain a fluorine-containing phenolic resin preparatory solution.

[0029] Add isophorone diisocyanate (IPDI) and polyphenol aldehyde propane into another reaction kettle according to the molar ratio of 2:1, and react at 50°...

Embodiment 2

[0031] Add 450ml of toluene, 400g of trifluoromethylphenol, 50g of phenol and 8g of benzoic acid into a 2-liter reactor equipped with a thermometer, stirrer and reflux condenser, and stir at 60°C to fully dissolve the trifluoromethylphenol and phenol . Then 8 g of benzoic acid were added and the temperature was raised to 80°C. Then dissolve 60g of paraformaldehyde in methanol at a ratio of 1:6, and add trifluoromethylphenol and phenol solution at a rate of 1 drop per second. Control the feeding time within 45 minutes. After feeding, the temperature was raised to 95°C, and the reaction was stirred vigorously for about 5 hours. Raise the temperature to 160°C, distill under reduced pressure at a vacuum of -0.8MPa, and condense and recover the solvent through a condenser tube to obtain a fluorine-containing phenolic resin preparatory solution.

[0032] Add toluene diisocyanate (TDI) and polyethylene glycol into another reaction kettle at a molar ratio of 2:1, and react at 70°C ...

Embodiment 3

[0034] Add 450ml of toluene and 500g of hexafluorobisphenol A, 250 grams of p-cresol and 6g of salicylic acid into a 2-liter reaction kettle with a thermometer, a stirrer and a reflux condenser, and stir at 60°C to make hexafluorobisphenol A Phenol A and p-cresol were fully dissolved. Then 6 g of salicylic acid was added and the temperature was raised to 80°C. Then dissolve 90g of paraformaldehyde in methanol at a ratio of 1:6, and add it into the solution of hexafluorobisphenol A and p-cresol at a rate of 1 drop per second. Control the feeding time within 45 minutes. After feeding, the temperature was raised to 95°C, and the reaction was stirred vigorously for about 5 hours. Raise the temperature to 160°C, distill under reduced pressure at a vacuum of -0.8MPa, and condense and recover the solvent through a condenser tube to obtain a fluorine-containing phenolic resin preparatory solution.

[0035] Add isophorone diisocyanate (IPDI) and polypropylene oxide into another reac...

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PUM

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Abstract

The invention provides a preparation method of a polyurethane modified phenolic resin, and the prepared polyurethane modified phenolic resin is suitable for semiconductor packaging. In the present invention, by controlling the ratio of organic fluorine groups and polyurethane groups in the phenolic resin, the organic fluorine groups and polyurethane groups are bonded in the phenolic resin compound through chemical bonds to realize the organic fluorine groups and polyurethane groups. The effective dispersion of groups in phenolic resin can effectively adjust the mechanical properties and surface properties of polyurethane modified phenolic resin materials. The application of the present invention as a curing agent modified epoxy resin composition can greatly reduce the modulus of the epoxy resin composition, and at the same time can improve the manufacturability and soldering resistance of the epoxy resin composition in semiconductor packaging. The polyurethane modified phenolic resin for semiconductor encapsulation of the present invention also possesses necessary fluidity, filling property and flame retardancy.

Description

technical field [0001] The invention relates to the field of composite materials, in particular to a preparation method of a polyurethane-modified phenolic resin composition for semiconductor packaging. Background technique [0002] As one of the three general-purpose thermosetting resins, epoxy resin has been receiving continuous attention and has been widely used in various fields. Epoxy resin contains unique active groups and polar groups such as epoxy groups, hydroxyl groups, ether bonds, etc., so it has many excellent properties and is widely used as semiconductor packaging materials, coatings, adhesives, molding materials, The matrix resin of fiber-reinforced composite materials, etc., is currently the most widely used high-performance composite material matrix resin. In order to meet the special requirements of materials for new use environments, people began to develop special epoxy resins. [0003] Phenolic resin is used as epoxy resin curing agent, the raw materi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G8/28C08G59/62C09J163/00
CPCC08G8/28C08G59/62C09J163/00
Inventor 赵艳朱婷
Owner 杭州千岛湖赋溪实业有限公司
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