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Multi-arc bottomed metalized magnetic core and preparation method thereof, and chip inductor

A technology of bottom metal and magnetic core, which is applied in the field of multi-arc bottom metallized magnetic core and its preparation, can solve the problems of good strength and solder resistance, high film density, good adhesion strength, etc., and achieve the reduction of metallization Cost, high quality, and the effect of improving welding quality

Pending Publication Date: 2019-05-10
SHENZHEN KANGCI ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of this, the present invention provides a kind of multi-arc bottoming metallized magnetic core, and its magnetic core electrode welding spot is prepared by adopting multi-arc ion plating and magnetron sputtering to obtain the metal film layer with special structure, and the compactness of film layer High strength, good solder resistance, good adhesion, special layered design is also beneficial to reduce the stress problem of the film layer, solve the problem of poor welding caused by stress, and the preparation process is green and pollution-free

Method used

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  • Multi-arc bottomed metalized magnetic core and preparation method thereof, and chip inductor
  • Multi-arc bottomed metalized magnetic core and preparation method thereof, and chip inductor
  • Multi-arc bottomed metalized magnetic core and preparation method thereof, and chip inductor

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preparation example Construction

[0036] An embodiment of the present invention provides a method for preparing a multi-arc bottom metallized magnetic core, comprising the following steps:

[0037] S10, take the magnetic core, the magnetic core is provided with an electrode area; adopt the mode of multi-arc ion plating to prepare a multi-arc primer layer on the surface of the electrode area, and the multi-arc primer layer is a titanium layer, a chromium layer, and an aluminum layer , zirconium layer or nickel-chromium alloy layer;

[0038] S20. Using magnetron sputtering to sequentially prepare a first coating layer and a second coating layer on the multi-arc primer layer to obtain a metal film layer, the first coating layer includes alternately arranged n layers of first metal layers and n- 1 second metal layer, the material of the first metal layer is one or more of nickel-copper alloy, nickel-vanadium alloy, silver, copper, and iron-nickel-copper alloy, and the material of the second metal layer is nickel ...

Embodiment 1

[0050] A method for preparing a multi-arc bottom metallized magnetic core, comprising the steps of:

[0051] (1) Take the ferrite core, and prepare a multi-arc primer layer on the surface of the electrode area by means of multi-arc ion plating. Specifically, arrange the magnetic cores and place them in a special jig, fix them, and only expose The electrode area is enough, then install the jig on the vacuum machine turntable, close the vacuum chamber for vacuuming, when the vacuum degree reaches 5×10 -3 Turn on the power supply of the chromium target, fill it with argon gas, and start sputtering. The current of the target is set to 70A, and the thickness of the chromium layer of the multi-arc primer layer is 0.2 microns;

[0052] (3) The first coating layer and the second coating layer are prepared on the multi-arc primer layer by magnetron sputtering to obtain a multi-arc primer metallized magnetic core, and the first coating layer includes 2 layers of nickel-copper alloy laye...

Embodiment 2

[0058] A method for preparing a multi-arc bottom metallized magnetic core, comprising the steps of:

[0059] (1) Take the ferrite core, and prepare a multi-arc primer layer on the surface of the electrode area by means of multi-arc ion plating. Specifically, arrange the magnetic cores and place them in a special jig, fix them, and only expose The electrode area is enough, then install the jig on the vacuum machine turntable, close the vacuum chamber for vacuuming, when the vacuum degree reaches 5×10 -3 At this time, turn on the power supply of the titanium target, fill it with argon gas, and start sputtering. The current of the target is set to 80A, and the thickness of the obtained multi-arc primer layer titanium layer is 0.6 microns;

[0060] (3) The first coating and the second coating are prepared on the multi-arc primer layer by magnetron sputtering to obtain a multi-arc primer metallized magnetic core, and the first coating layer includes 2 layers of nickel-vanadium allo...

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Abstract

The invention provides a multi-arc bottomed metalized magnetic core. The multi-arc bottomed metalized magnetic core comprises a magnetic core, a metal film is formed on an electrode region of the magnetic core, the metal film comprises a multi-arc bottoming layer, a first plating layer and a second plating layer; the multi-arc bottoming layer is a titanium layer, a chromium layer, an aluminum layer or a nickel-chromium alloy layer; the first plating layer comprises n layers of first metal layers and n-1 layers of second metal layers in alternate arrangement; the material of each of the first metal layer and the second metal layer is independently selected from one or multiple of nickel-copper alloy, the nickel-vanadium alloy, silver, copper, ferric-nickel-copper alloy, and the first metallayer and the second metal layer are made of different materials, n is the integer from 2-8, and the second plating layer is a silver layer and a tin layer. The multi-arc bottomed metalized magnetic core is prepared from multi-arc bottoming and magnetron sputtering; the film is high in density, good in strength and soldering resistance, and good in adhesive strength; the multilayer structure design can reduce the film layer stress and improve the bonding force strength, and the preparation process is green, environment-friendly and pollution-free. The invention further provides a preparation method of the multi-arc bottomed metalized magnetic core and a chip inductor.

Description

technical field [0001] The invention relates to a multi-arc bottom metallized magnetic core, a preparation method thereof and a chip inductor. Background technique [0002] As the core material of the chip inductor, in the process of use, the wire-wound chip inductor must make metal electrodes on the end face of the magnetic core. This process is called metallization of the magnetic core. During the pressing and sintering molding process of the raw material of the magnetic core, a large amount of dust, oil and various ion pollutions are attached to the substrate. If the film is directly metallized without treatment, the film will have poor adhesion. After the magnetic core is metallized, due to the poor bonding force of the coating layer, the peeling residue of the product is poor. After the traditional pickling process and plasma cleaning, the bonding force of the metallized coating is still not ideal, and there are pollution problems. Contents of the invention [0003]...

Claims

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Application Information

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IPC IPC(8): H01F27/24H01F27/255H01F27/28H01F41/02C23C14/32C23C14/35C23C14/14C23C14/16
Inventor 张玉朱小东
Owner SHENZHEN KANGCI ELECTRONICS CO LTD
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