A kind of formula and preparation method of scar repair

A scar and repair material technology, applied in medical science, surgery, etc., can solve problems such as unsatisfactory curative effect, skin damage, and difficulty in recovery, and achieve the effects of being conducive to orderly growth, increasing adhesion, and promoting absorption

Active Publication Date: 2022-06-21
北京幸福益生高新技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

From the perspective of repair effect, surgical resection and laser treatment have 100% recurrence, and some also cause skin damage or local pain, and the curative effect is not satisfactory; traditional drug treatment can control the development of the disease and relieve symptoms, but it is not easy to recover

Method used

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  • A kind of formula and preparation method of scar repair

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] A formula for repairing scars, comprising the following formulas in parts by weight:

[0050] Phase A: 5 parts ethylhexyl palmitate 2 parts ceteareth-25

[0051] 2 parts Cetyl Alcohol 2 parts Caprylic / Capric Triglycerides

[0052] 1 part Tocopheryl Acetate Ceteareth-6 1 part

[0053] 1.5 parts shea butter

[0054] Phase B: 8 parts of glycerin, 0.3 parts of xanthan gum

[0055] Carboxymethyl chitin 0.1 part Sodium hyaluronate 0.08 part

[0056] Phase C: 57.5 parts of deionized water, 0.1 part of methylparaben

[0057] Curacao Aloe Vera Leaf Extract 0.2 servings

[0058] Centella Asiatica Extract 0.3 servings

[0059] Phase D: 6 parts of recycled silicon material, 8 parts of polyethylene glycol 400

[0060] Phase E: 2.5 parts citric acid, 0.1 part acetylhydroxyproline

[0061] 2-o-ethyl ascorbic acid 0.1 part

[0062] Phase F: 0.2 part of propylene glycol

[0063] Dimethylolimidazolidinyl urea 0.08 part

[0064] Iodopropynyl Butyl Carbamate 0.01 part.

[0065]...

Embodiment 2

[0096] A formula for repairing scars, comprising the following formulas in parts by weight:

[0097] Phase A: 5 parts ethylhexyl palmitate 2 parts ceteareth-25

[0098] 2 parts Cetyl Alcohol 2 parts Caprylic / Capric Triglycerides

[0099] 1 part Tocopheryl Acetate Ceteareth-6 1 part

[0100] 1.5 parts shea butter

[0101] Phase B: 8 parts of glycerin, 0.3 parts of xanthan gum

[0102] Carboxymethyl chitin 0.1 part Sodium hyaluronate 0.08 part

[0103] Phase C: 57.5 parts of deionized water, 0.1 part of methylparaben

[0104] Curacao Aloe Vera Leaf Extract 0.2 servings

[0105] Centella Asiatica Extract 0.3 servings

[0106] Phase D: 8 parts of recycled silicon material, 8 parts of polyethylene glycol 400

[0107] Phase E: 2.5 parts citric acid, 0.1 part acetylhydroxyproline

[0108] 2-o-ethyl ascorbic acid 0.1 part

[0109] Phase F: 0.2 part of propylene glycol

[0110] Dimethylolimidazolidinyl urea 0.08 part

[0111] Iodopropynyl Butyl Carbamate 0.01 part.

[0112]...

Embodiment 3

[0143] A formula for repairing scars, comprising the following formulas in parts by weight:

[0144] Phase A: 5 parts ethylhexyl palmitate 2 parts ceteareth-25

[0145] 2 parts Cetyl Alcohol 2 parts Caprylic / Capric Triglycerides

[0146] 1 part Tocopheryl Acetate Ceteareth-6 1 part

[0147] 1.5 parts shea butter

[0148] Phase B: 8 parts of glycerin, 0.3 parts of xanthan gum

[0149] Carboxymethyl chitin 0.1 part Sodium hyaluronate 0.08 part

[0150] Phase C: 57.5 parts of deionized water, 0.1 part of methylparaben

[0151] Curacao Aloe Vera Leaf Extract 0.2 servings

[0152] Centella Asiatica Extract 0.3 servings

[0153] Phase D: 15 parts of recycled silicon material, 8 parts of polyethylene glycol 400

[0154] Phase E: 2.5 parts citric acid, 0.1 part acetylhydroxyproline

[0155] 2-o-ethyl ascorbic acid 0.1 part

[0156] Phase F: 0.2 part of propylene glycol

[0157] Dimethylolimidazolidinyl urea 0.08 part

[0158] Iodopropynyl Butyl Carbamate 0.01 part.

[0159...

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Abstract

The invention discloses a formula and preparation method for scar repair. The formula includes: phase A, phase B, phase C, phase D, phase E, and phase F, adopting a specific ratio, using recycled silicon material as the main ingredient, and transparent Sodium erythronate and hydroxymethyl chitosan are used as excipients and other auxiliaries; Among them: Regenerated silicon material as the main component can form a three-dimensional network scaffold structure consistent with the structure of human bones and soft tissues, realizing cell self-source It is conducive to the orderly growth of cells and the mechanism of promoting the proliferation of healthy cells to form new tissues; sodium hyaluronate increases the adhesion between regenerative silicon materials and skin tissue; other additives promote the absorption of preparations at scar sites; The above components work together to form a reasonable regulation mechanism in the process of scar repair, inhibit the excessive proliferation of fibrin, promote the orderly growth of tissue, and complete scar repair.

Description

technical field [0001] The invention relates to a formula for scar repair and a preparation method. Background technique [0002] Scars are caused by human trauma, burns, and after surgery due to the lack of regulatory mechanisms in the healing process of the wound and the lack of protection of the healed skin. Scars not only affect the appearance, but also make people unconfident; therefore, scar removal is becoming more and more popular. people's attention. At present, the commonly used methods of scar repair include: surgical excision, external application of drugs, skin grafting, laser and sealing treatment for hypertrophic scars, especially scalds, as well as grinding and filling. From the point of view of the repair effect, surgical excision and laser treatment have 100% recurrence, and some also cause skin damage or local pain, and the effect is not ideal; traditional drug treatment can control the development of the disease and relieve symptoms, but it is not easy t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): A61L31/06A61L31/04A61L31/00A61L31/14A61L31/16
Inventor 胡方郭创洲殷昊李道胜王健
Owner 北京幸福益生高新技术有限公司
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