Compound filtering arc ion plating by combined magnetic fields and lining bias porous baffle plate
The technology of arc ion plating and porous baffle plate is applied in the field of arc ion plating, which can solve the problems of uniform ablation, pollution and large particle defects of target materials, and achieve the effect of improving utilization efficiency, ensuring uniformity and realizing effective control
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specific Embodiment approach 1
[0020] Specific implementation mode one: the following combination figure 1 , 2 and 3 illustrate this embodiment, the device used in the arc ion plating combined magnetic field and lining bias porous baffle composite filter in this embodiment includes a bias power supply (1), an arc power supply (2), an arc ion plating target source ( 3), multi-stage magnetic field device (4), multi-stage magnetic field power supply (5), lining bias porous type baffle device (6), lining bias power supply (7), movable coil device (8), movable coil Device power supply (9), rheostat device (10), sample stage (11), bias power supply waveform oscilloscope (12) and vacuum chamber (13);
[0021] In this device:
[0022] The substrate workpiece to be processed is placed on the sample stage (11) in the vacuum chamber (13), the multi-stage magnetic field device (4), the lining bias porous type baffle device (6), the movable coil device (8) and the vacuum chamber (13) are insulated from each other, th...
specific Embodiment approach 2
[0036] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the device can also realize other functions: it can combine traditional DC magnetron sputtering, pulse magnetron sputtering, traditional arc ion plating and pulse cathode arc Combination of one or more than two methods, and then apply DC bias, pulse bias, DC pulse composite bias or bipolar pulse bias device on the workpiece for thin film deposition to prepare pure metal thin films and compounds with different element ratios Ceramic films, functional films and high-quality films with nano-multilayer or gradient structures.
specific Embodiment approach 3
[0037] Embodiment 3: The difference between this embodiment and Embodiment 2 is that the combined magnetic field is connected to the arc ion plating of the composite filter of the lining bias porous baffle, the arc power supply (2) is turned on, and the multi-stage magnetic field power supply ( 5) Adjust the multi-level magnetic field device (4), turn on the lining bias power supply (7), the lining bias porous type baffle device (6) maintains a positive DC bias, turn on the bias power supply (1), and turn on the movable coil The device power supply (9) adjusts the movable coil device (8), adjusts the output resistance of the rheostat device (10), adjusts the process parameters, performs film deposition, and prepares multi-layer structure films with different stress states, microstructures and element ratios. Embodiment 2 is the same.
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