Multi-station self-adaption actuator for micro water mist polishing

Abstract

The invention discloses a multi-station self-adaption actuator for micro water mist polishing. The multi-station self-adaption actuator for micro water mist polishing comprises a multi-station revolution unit, self-adaption auto-rotation units, a pressurizing and clamping unit and a mist supplying unit, wherein the multi-station revolution unit is arranged on a movable cross beam of a gantry device; and the self-adaption auto-rotation units, the pressurizing and clamping unit and the mist supplying unit are arranged under the multi-station revolution unit from top to bottom. According to the multi-station self-adaption actuator for micro water mist polishing provided by the invention, an auto-rotation motor and a precise rotary table are adopted for controlling auto-rotation and revolutionmotion, so that the independent wide-range stepless regulation of auto-rotation and revolution speeds is realized. According to the multi-station self-adaption actuator for micro water mist polishingprovided by the invention, a gravity type loading scheme based on a balance weight ring is adopted, the polishing pressure is uniformly applied to the polished surface of a crystal workpiece, so thatthe degradation of the surface figure accuracy is effectively suppressed. According to the multi-station self-adaption actuator for micro water mist polishing provided by the invention, a ball splinesliding pair is adopted for realizing the self-adaption of the axial direction of an auto-rotation axis, so that the influence of a self-flatness error of a grinding and polishing plate on the polishing movement and the pressure smoothness is avoided. According to the multi-station self-adaption actuator for micro water mist polishing provided by the invention, the multiple self-adaption auto-rotation units are adopted, so that the number of polishing stations is increased, and the polishing efficiency is remarkably improved.

Description

technical field [0001] The invention is applied in the technical field of precision ultra-precision machining, and relates to a micro-nano polishing device for a functional crystal device with water-dissolving properties, in particular to a multi-station self-adaptive actuator for micro-water mist polishing. Background technique [0002] In nature, there is a class of functional crystal materials with water-soluble properties, such as: potassium dihydrogen phosphate KDP, ammonium dihydrogen phosphate ADP, lithium cesium borate CLBO, due to their many excellent properties (such as: piezoelectric properties , electro-optical characteristics, nonlinear optical characteristics) and are widely used in aerospace, energy science, engineering physics and other major national engineering projects. With the continuous upgrading of related technologies and equipment in these fields, the requirements for the processing quality of crystal devices are becoming more and more stringent. Ho...

AI Technical Summary

Problems solved by technology

[0005] First, the non-uniformity of the polished surface finish caused by too low revolution speed; the polishing planetary movement of crystal workpieces is completed by precision optical CNC machine tools, in which the rotation movement is realized by the spindle of the machine tool, and the revolution movement relies on the screw guide mechanism in the arc insertion It is realized under the control of the supplementary program. Since the main moving parts of the machine tool are made of large-size granite and have relatively large inertia, in order to ensure the smooth operation of the machine tool, the moving speed of the screw guide mechanism must be strictly limited, which greatly restricts the increase in the revolution speed. , making it difficult to bridge the differences in surface planarization efficiency at various positions on the polished surface, resulting in non-uniform surface finish;

[0006] Second, the surface shape accuracy of the crystal workpiece caused by single-point loading deteriorates; the ball head assembly is pressed on the upper surface of the clamping disc during micro-water mist polishing, and the polishing pressure is applied to the clamping disc in the form of point load, and through the clamping disc The contact surface with the top of the crystal workpiece converts the point load into a uniformly distributed surface load, and applies the surface load to the polishing surface. However, due to factors such as vibration and motion instability during the actual polishing operation, the load conversion process is disturbed , which reduces the uniformity of the surface load, leading to the difference in the material removal rate at each position of the polished surface, which in turn causes the deterioration of the surface shape accuracy;

[0007] Third, the polishing movement instability caused by the flatness error of the holed grinding and polishing plate; in the actual manufacturing of the holed grinding and polishing plate, there are inevitably microscopic uneven areas on the surface, and when the crystal workpiece moves through these areas, it is very easy to cause motion instability. Stability and pressure fluctuations will affect the polishing quality in light cases, and cause damage to crystal workpieces in severe cases;

[0008] Fourth, the polishing efficiency is low due to too few polishing stations; the device only has one pressurized clamping unit, so only one finished crystal workpiece can be obtained for each polishing, which seriously limits the improvement of polishing efficiency

[0010] Chinese patent CN107336105A discloses "a planetary polishing device with compact structure". The layered arrangement scheme makes the structure of the device too compact, which reduces the adjustment range of the polishing revolution radius, which is not conducive to the arrangement of the micropores of the atomized water particles; at the same time, the device adopts a two-stage belt drive scheme, which greatly reduces the transmission efficiency and operation reliability.

[0011] Chinese patent CN107414631A discloses the "Eccentric Planetary Polishing Device for Large-Aperture Aspheric Surface Robot" because of the low-friction cylinder and ball spline configuration, which significantly improves the adaptability of the polishing movement and can effectively avoid the flatness of the grinding and polishing plate itself. Polishing movement and pressure instability caused by degree errors; at the same time, its polishing revolution speed can also be adjusted steplessly in a wide range; however, this device has similar defects to the aforementioned patents, that is, insufficient adjustment range of polishing revolution radius and transmission low efficiency

[0012] The "polishing head" disclosed in Chinese patent CN105583727A can respectively realize the large-scale stepless adjustment of the polishing rotation and revolution speed; The moment of inertia of the revolution movement of the head will reduce the stability and reliability of the overall operation of the device; in addition, the centralized arrangement of the air storage tank, cylinder pressure regulating valve, torque sensor and displacement sensor adopted in this patent significantly increases the manufacturing and maintenance of the device. cost

[0013] In addition, Chinese Patent CN107214582A discloses "A Grinding Gear Disc and Optical Grinding and Polishing Machine", Chinese Patent CN106425830A discloses "A Double-sided Grinding and Polishing Machine", Chinese Patent CN101712133A discloses "A Polishing Device", Chinese Patent CN108214272A The disclosed "A Method for Polishing the Impeller Cover Plate of a Centrifugal Pump and its Polishing Device" and the "Optical Polishing Device and System" disclosed in Chinese Patent CN107097121A can obtain a larger range of adjustment of the polishing revolution speed; however, in the above-mentioned invention patents In the process of autorotation and revolution of the polished workpiece, a single motor and gear transmission are used. Different speed combinations are obtained by changing the transmission ratio of the gear train. As a result, the autorotation and revolution speeds cannot be adjusted steplessly, which limits the polishing process. The adjustment range of process parameters is not conducive to the acquisition of high-quality crystal surfaces

[0014] In the published academic papers and published patented technologies, no examples have been found that can solve the four defects mentioned above at the same time in terms of functional principles and application technologies.

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