A kind of preparation method of high thermal conductivity composite filler and polymer-based composite material thereof

A technology of thermally conductive fillers and composite fillers, which is applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems of limited thermal conductivity of composite materials, obstacles to industrialized large-scale production, and low thermal conductivity of thermally conductive fillers, etc., to achieve broad thermal conductivity Application prospect, lower percolation threshold, and effect of improving thermal conductivity

Active Publication Date: 2020-09-01
SHANGHAI JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] At present, there are mainly two types of methods to prepare filled thermally conductive composite materials: the first type of method is to randomly fill a large amount of traditional thermally conductive fillers (such as alumina, silica, etc.), and to improve the thermal conductivity by increasing the filling amount of fillers. The advantage is that the preparation process is simple and the traditional thermally conductive filler is cheap, and it is easy to industrialized large-scale production. The mechanical properties of the material are severely deteriorated; the second type of method is to introduce advanced thermally conductive fillers with high thermal conductivity (such as boron nitride, graphene, etc.) The thermal conduction network channel composed of the high-performance advanced thermal conductive filler and the thermal conduction channel constructed in the composite material can greatly improve the thermal conductivity of the composite material. The loading amount must reach the percolation threshold in the composite material in order to efficiently exert its thermal conductivity. However, this type of filler is often expensive, which hinders industrial mass production.

Method used

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  • A kind of preparation method of high thermal conductivity composite filler and polymer-based composite material thereof
  • A kind of preparation method of high thermal conductivity composite filler and polymer-based composite material thereof
  • A kind of preparation method of high thermal conductivity composite filler and polymer-based composite material thereof

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Embodiment 1

[0041] This embodiment relates to a preparation method of a high thermal conductivity composite filler and the epoxy composite material filled therein, the composite material is covered by a 35% volume fraction of an epoxy resin matrix and a 65% volume fraction of boron nitride nanosheets. Composite filler of alumina microspheres (Al 2 o 3 @BNNS) composition. where Al 2 o 3 The preparation process of @BNNS composite filler is as follows figure 1 shown in a, prepared by the following steps:

[0042] A. Liquid phase exfoliation of hexagonal boron nitride (h-BN): according to the liquid phase ultrasonic exfoliation reported in the literature (Chen, et al., Adv. Funct. Mater. 2017, 27, 1604754-1604762.) Method for preparing boron nitride nanosheets (BNNS);

[0043] B. Amination of BNNS: Add dried BNNS powder, aminosilane coupling agent APS (0.5-1wt%) and 20mL toluene solution into a 50mL round bottom flask, heat to 110-130°C and react under nitrogen protection for at least ...

Embodiment 2

[0053] This embodiment relates to a preparation method of a high thermal conductivity composite filler and the filled epoxy composite material, the composite material is covered with nitrogen by 35% volume fraction of epoxy resin matrix and 65% volume fraction of boron nitride nanosheets Composite filler (AlN@BNNS) composition of aluminum oxide microspheres. Wherein the amination preparation process of boron nitride nanosheets is the same as in Example 1, the difference is that in step C, the three-dimensional spherical filler is AlN microspheres, and a small amount of pyridine and triphenyl phosphate are also added during the epoxidation process. The ester is used as a dehydrating agent to prevent the hydrolysis reaction of AlN when it encounters water during the reaction; in step D, the aminated BNNS -APS and epoxidized AlN-GPTMS dispersed into toluene solution. Under a nitrogen atmosphere, react with gentle stirring at 120-135° C. for 4-8 hours. After the reaction, the re...

Embodiment 3

[0057] This embodiment relates to a high thermal conductivity composite filler and the silicone rubber composite material filled therewith, the composite material is covered by a 35% volume fraction of epoxy resin matrix and 65% volume fraction of graphene oxide nanosheets coated silica micro Composite filler composition of balls. Of which SiO 2 @GO composite fillers were prepared by the following steps:

[0058] A. Chemical exfoliation of graphene: According to the improved Hummer's Method reported in the literature (G.Q.Shi, et al., J.Am.Chem.Soc., 2008, 130, 5856.), graphite oxide was prepared by chemical exfoliation alkene;

[0059] B, epoxidation of graphene oxide (GO): add dried GO powder, epoxy silane coupling agent GPTMS (1~2wt%) and 20mL toluene solution in a 50mL round bottom flask, heat to 80~ The reaction was stirred at 100° C. for at least 3 h under the protection of nitrogen. After the reaction, the mixture was filtered and the solid was washed with toluene 2...

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Abstract

The invention provides a preparation method of a high thermal conductivity composite filling material and a polymer matrix composite material of the high thermal conductivity composite filling material. The high thermal conductivity composite filling material comprises a sheet-shaped heat conductive filling material and a spheroidic heat conductive filling material; and the surface of the spheroidic heat conductive filling material is coated with the sheet-shaped heat conductive filling material. The preparation method comprises following steps: the sheet-shaped heat conductive filling material and the spheroidic heat conductive filling material are subjected to surface modification respectively, and are dispersed in an organic solvent for heating stirring, so that chemical reaction and bond connection among reactive groups from the filling materials are realized, and self assembling is carried out so as to obtain a structure similar to sesame seed balls, wherein the surface of the spheroidic heat conductive filling material is coated with the sheet-shaped heat conductive filling material. The unique structure is capable of realizing formation of high efficiency heat conductive paths in a composite material filled with the high thermal conductivity composite filling material, so that adding of a small amount of the high thermal conductivity two-dimensional sheet-shaped fillingmaterial is capable of improving the thermal conductivity of the polymer matrix composite material obviously, and heat conduction requirements of preparation of electrical and electronic equipment canbe satisfied.

Description

technical field [0001] The invention belongs to the technical field of heat-conducting composite material preparation, and relates to a high-heat-conducting composite filler and a method for preparing the polymer-based composite material. Background technique [0002] With the development of the electrical and electronic industry towards high integration and high performance, the power per unit area of ​​devices continues to increase, and the accompanying heat generation is also increasing. If electronic and electrical equipment works at a high temperature for a long time, not only its own performance will decline, but the internal components will also undergo accelerated aging, resulting in a greatly reduced lifespan or even direct failure. Therefore, thermal management is very important for electronic and electrical equipment. Polymer-based thermally conductive and insulating composite materials have been widely researched and used in the industry due to their corrosion re...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K7/18
CPCC08K7/18C08K9/10C09K5/14C08L63/00
Inventor 黄兴溢邹德晓江平开陈金王德钊
Owner SHANGHAI JIAOTONG UNIV
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