Graphene wave absorbing composite material with high thermal conductivity and preparation method thereof
A technology of high thermal conductivity graphite and composite materials, applied in radiation-absorbing coatings, epoxy resin coatings, unspecified rubber coatings, etc., can solve the problems of poor surface elasticity, fragility, and low thermal conductivity of materials, and achieve strong tensile strength Effects of performance, toughness and hardness
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Embodiment 1
[0022] A high thermal conductivity graphene wave-absorbing composite material, using self-made wave-absorbing material as a substrate, the substrate is coated with several graphene film layers, and the raw materials of the graphene film layers include: graphene, organic polymer solution, resin, Its mass parts composition is as follows: (0.1-10) : (1-20 ) : (0.5-1).
[0023] The preparation method of the above-mentioned high thermal conductivity graphene wave-absorbing composite material is as follows: adding 1g of single-layer graphene to 200g acrylic acid solution, adding 0.3g KH550 and 0.5g rosin and mixing to obtain graphene / acrylic acid solution, and adding 150 g of acrylic acid solution. o C, coating and drying at a speed of 10m / min to obtain a 5μm graphene film, and the graphene film was dried at 400N, 200 o Under the condition of C, it is pressed with a wave absorbing material with a thickness of 5 μm and a magnetic permeability of 240 for 0.5 hours to obtain a graphene...
Embodiment 2
[0025] The high thermal conductivity graphene wave-absorbing composite material in this embodiment is the same as that in Embodiment 1.
[0026] The preparation method of above-mentioned high thermal conductivity graphene wave-absorbing composite material is as follows: adding 100g multi-layer graphene to 10g rubber solution, adding 200g toluene, 0.5g KH550 and 1g dicyclopentadiene resin and mixing to obtain graphene / rubber solution, 60 o C, coating and drying at a speed of 10 m / min to obtain a 100 μm graphene film. o Under the condition of C, it is laminated with a wave absorbing material with a thickness of 100 μm and a magnetic permeability of 280 for 24 hours to obtain a graphene wave absorbing material with a thickness of 80 μm. The graphene wave absorbing material prepared by the above preparation method has a magnetic permeability of 280 and a thermal conductivity of 3000 W / m.k.
Embodiment 3
[0028] The high thermal conductivity graphene wave-absorbing composite material in this embodiment is the same as that in Embodiment 1.
[0029] The preparation method of above-mentioned high thermal conductivity graphene wave-absorbing composite material is as follows: adding 50g graphene oxide to 100g epoxy resin solution, adding 130g toluene, 0.5g KH550 and 1g rosin, 5g dicyclopentadiene resin, 2g alkyl phenolic The resin was mixed to obtain a graphene / epoxy resin solution at 80 o C, coating and drying at a speed of 8 m / min to obtain a 200 μm graphene film. o Under the condition of C, it is laminated with a wave absorbing material with a thickness of 200 μm and a magnetic permeability of 280 for 12 hours to obtain a graphene wave absorbing material with a thickness of 300 μm. The graphene wave absorbing material prepared by the above preparation method has a magnetic permeability of 280 and a thermal conductivity of 2500 W / m.k.
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