A kind of high temperature resistant PCB board and its production process
A technology of PCB board and high temperature resistance, applied in the field of PCB board manufacturing, can solve the problem that the heat resistance performance of the PCB board does not meet the requirements for use, achieve good thermal conductivity and heat dissipation, improve thermal conductivity, and facilitate the effect of phonon propagation.
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Embodiment 1
[0066] Substrate 11 is made by following method:
[0067] S1. Weigh phosphorus-containing flame-retardant epoxy resin, add it to a three-necked bottle, heat to 35°C, add epoxy resin, and mix at 300r / min for 30min; the mass ratio of phosphorus-containing flame-retardant epoxy resin to epoxy resin is 1 :1;
[0068] S2. Add acetone and dimethylformamide, mix at 300r / min for 30min, add melamine, mix for 15min, then add the mixture of boron nitride and silicon carbide, and stir at a high speed for 60min at a speed of 3000r / min to obtain a modified epoxy resin;
[0069] Wherein, the addition amount of the mixture of boron nitride and silicon carbide is 16% of the mass of the resin mixture, and the mass ratio of BN and SiC is 9:1;
[0070] S3. Put the modified epoxy resin into a mold and cold press it for 10 minutes to form it, then transfer it to an oven for drying at 160° C. for 50 minutes, and then transfer it to a hot press machine for hot pressing at 160° C. for 55 minutes unt...
Embodiment 2
[0072] Substrate 11 is made by following method:
[0073] S1. Weigh phosphorus-containing flame-retardant epoxy resin, add it to a three-neck bottle, heat to 40°C, add epoxy resin, and mix at 300r / min for 30min; the mass ratio of phosphorus-containing flame-retardant epoxy resin to epoxy resin is 1 :1.2;
[0074] S2. Add acetone and dimethylformamide, mix at 300r / min for 30min, add melamine, mix for 15min, then add the mixture of boron nitride and silicon carbide, and stir at a high speed for 60min at a speed of 3000r / min to obtain a modified epoxy resin;
[0075] Wherein, the addition amount of the mixture of boron nitride and silicon carbide is 18% of the mass of the resin mixture, and the mass ratio of BN and SiC is 9:1;
[0076] S3. Put the modified epoxy resin into a mold and cold press it for 10 minutes to form it, then transfer it to an oven for drying at 160°C for 60 minutes, and then transfer it to a hot press machine for hot pressing at 160°C for 65 minutes until i...
Embodiment 3
[0084] The potting glue is prepared by the following method:
[0085] (1) Weigh 100g of methylphenyl silicone resin and 24g of butyl acetate and mix and disperse for 30min at a speed of 2000r / min, add 1.6g of methyltrimethoxysilane and 2.4g of phenyltrimethoxysilane, and after adding Continue to disperse for 30-40 minutes;
[0086] (2) Add 1.6g of butyl titanate and 0.3g of γ-(2,3-glycidoxy)propyltrimethoxysilane, increase the rotation speed to 3000r / min, and stir at high speed for 25min;
[0087](3) Finally, 80 g of n-octane was added, stirred at 2000 r / min for 30 min, and the potting glue was prepared.
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