Hydrogen-containing phenyl silicone resin and high-refractive-index LED packaging silicon resin composition, and preparation methods thereof

A technology of silicone resin composition and LED encapsulation, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems affecting the brittleness of polysiloxane, easy yellowing of materials, etc., and achieve excellent air tightness, high refractive index, Improves cohesiveness and adhesion

Active Publication Date: 2019-09-20
SUN YAT SEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the increase of phenyl content will affect the brittleness of polysiloxane and make the material more prone to yellowing

Method used

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  • Hydrogen-containing phenyl silicone resin and high-refractive-index LED packaging silicon resin composition, and preparation methods thereof
  • Hydrogen-containing phenyl silicone resin and high-refractive-index LED packaging silicon resin composition, and preparation methods thereof
  • Hydrogen-containing phenyl silicone resin and high-refractive-index LED packaging silicon resin composition, and preparation methods thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0091] This embodiment provides a phenyl vinyl siloxane resin, and the preparation method is as follows.

[0092]Mix 50g of diphenyldimethoxysilane, 15g of methylvinyldimethoxysilane, 20g of octamethylcyclotetrasiloxane, and 5g of tetramethyldivinyldisiloxane and place it in a round-bottomed flask , toluene was added to prepare a mixed solution with a monomer mass ratio of 50%, and 0.1 g of trifluoromethanesulfonic acid was added dropwise to make the solution acidic. At 40°C, pure water in an equimolar ratio with the reaction functional group was slowly added dropwise within 3 hours to carry out hydrolysis reaction, and then hydrolysis was performed for 1 hour after the dropwise addition. Transfer the solution to a separatory funnel and wash with water until the solution is neutral. Use a rotary evaporator to remove the solvent and water under reduced pressure at 55 °C, add 0.1% potassium hydroxide to adjust the pH, carry out the condensation reaction at 150 °C for 2 h, move ...

Embodiment 2

[0096] This embodiment provides a phenyl vinyl siloxane resin, and the preparation method is as follows.

[0097] Mix 50g of diphenyldimethoxysilane, 15g of methylvinyldimethoxysilane, 20g of octamethylcyclotetrasiloxane, and 5g of tetramethyldivinyldisiloxane and place it in a round-bottomed flask , toluene was added to prepare a mixed solution with a monomer mass ratio of 50%, and 0.1 g of trifluoromethanesulfonic acid was added dropwise to make the solution acidic. At 40°C, pure water in an equimolar ratio with the reaction functional group was slowly added dropwise within 3 hours to carry out hydrolysis reaction, and then hydrolysis was performed for 1 hour after the dropwise addition. Transfer the solution to a separatory funnel and wash with water until the solution is neutral. Use a rotary evaporator to remove the solvent and water under reduced pressure at 55 °C, add 0.1% potassium hydroxide to adjust the pH, carry out the condensation reaction at 150 °C for 0.5 h, mo...

Embodiment 3

[0099] This embodiment provides a phenyl vinyl siloxane resin, and the preparation method is as follows.

[0100] Mix 50g of diphenyldimethoxysilane, 15g of methylvinyldimethoxysilane, 20g of octamethylcyclotetrasiloxane, and 5g of tetramethyldivinyldisiloxane and place it in a round-bottomed flask , toluene was added to prepare a mixed solution with a monomer mass ratio of 50%, and 0.1 g of trifluoromethanesulfonic acid was added dropwise to make the solution acidic. At 40°C, pure water in an equimolar ratio with the reaction functional group was slowly added dropwise within 3 hours to carry out hydrolysis reaction, and then hydrolysis was performed for 1 hour after the dropwise addition. Transfer the solution to a separatory funnel and wash with water until the solution is neutral. Use a rotary evaporator to remove the solvent and water under reduced pressure at 55 °C, add 0.1% potassium hydroxide to adjust the pH, carry out the condensation reaction at 150 °C for 5 h, move...

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Abstract

The invention relates to a hydrogen-containing phenyl silicone resin and a high-refractive-index LED packaging silicon resin composition, and preparation methods thereof. The preparation method for the hydrogen-containing phenyl silicone resin comprises the following steps: mixing a monomer, water and a hydrolysis reaction catalyst, adding an organic solvent to obtain a mixed solution, carrying out heating to 30 to 60 DEG C for a hydrolysis reaction for 1 to 5 h, then performing a water diversion reaction, and successively performing washing and distillation under reduced pressure so as to obtain the hydrogen-containing phenyl silicone resin. The hydrogen-containing phenyl silicone resin provided by the invention has a high refractive index, and excellent flexibility and yellowing resistance; and when applied to preparation of LED packaging silicon resin, the hydrogen-containing phenyl silicone resin has a high refractive index and excellent tensile strength, bonding strength, light transmittance and yellowing resistance, and a part performances of the hydrogen-containing phenyl silicone resin are equal to or higher than the performances of similar products imported from abroad, so the hydrogen-containing phenyl silicone resin can meet the basic requirements of LED packaging. A packaged surface-mounted LED device has excellent air tightness.

Description

technical field [0001] The invention belongs to the technical field of electronic packaging, and in particular relates to a phenyl hydrogen-containing siloxane resin, a high refractive index LED packaging silicone resin composition and a preparation method thereof. Background technique [0002] A light-emitting diode (Light Emitting Diode, hereinafter referred to as LED) is a semiconductor component that can directly convert electrical energy into light energy. Compared with incandescent or fluorescent lighting, it has the advantages of energy saving, low consumption, long life, environmental protection, color controllability, and small size. It is expected to replace traditional light sources as a new generation of lighting sources. The packaging materials used in LED lighting equipment are mainly epoxy resin and silicone resin. Compared with epoxy resin, silicone has many advantages: such as excellent UV aging resistance, weather resistance, thermal stability, high light ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G77/12C08L83/07C08L83/05C08L83/04H01L33/56
CPCC08G77/12C08L83/04H01L33/56C08L2201/08C08L2205/025C08L2205/035
Inventor 容敏智张泽平章明秋
Owner SUN YAT SEN UNIV
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