Resin grinding wheel for glass cutting and preparation method thereof

Abstract

The invention relates to a resin grinding wheel for glass cutting and a preparation method thereof, and belongs to the technical field of resin grinding wheels. The resin grinding wheel for glass cutting mainly comprises, by weight, 15-25 parts of epoxy resin, 40-50 parts of phenolic resin, 10-20 parts of auxiliary grinding materials, 5-10 parts of cerium oxide, 5-10 parts of reinforced metal and2-10 parts of water-soluble pore-forming agents. The auxiliary grinding materials are at least one of silicon carbide and corundum, and the reinforcing metal is at least one of nickel, copper, tungsten and tin. The preparation raw materials of the resin grinding wheel for glass cutting comprise diamond and cerium oxide, and the diamond is used as a grinding material and cerium oxide as a soft grinding material, and under the combined action of the diamond grinding material and the cerium oxide soft grinding material, the edge breakage size is reduced on the premise of ensuring relatively highfeeding speed.

Description

technical field [0001] The invention relates to a resin grinding wheel for glass cutting and a preparation method thereof, belonging to the technical field of resin grinding wheels. Background technique [0002] Glass is a commonly used material, which can be divided into quartz glass, borate glass, etc. according to its composition. Different types of glass have different characteristics, such as quartz glass is a high-purity (greater than 99.5wt%) silicon dioxide amorphous, uniform structure, light waves can be stably transmitted in it, very good light transmission, transmissive The spectral frequency bandwidth can cover almost all light waves from ultraviolet to infrared. In addition, quartz glass has low thermal expansion coefficient, high temperature resistance, good chemical stability, radiation resistance and good thermal shock resistance. Therefore, quartz glass is widely used in many fields such as aerospace, precision instruments, electric light sources, optical c...

AI Technical Summary

Problems solved by technology

Due to the hard and brittle nature of glass, when the abrasive hits the workpiece, cracks are prone to appear at the fracture of the workpiece and nucleate and expand to form chipping. The chipping size is generally about 50 μm, resulting in poor processing quality of glass materials.

Moreover, the cutting efficiency of the currently commonly used resin grinding wheel for cutting glass is very low, and the maximum feed speed is only 5mm / s. When the feed speed is increased, the cutting edge becomes larger, the cutting is inclined, the cutting is sparked, and the grinding wheel is even broken. A series of problems such as cracking

[0005] The Chinese invention patent application with the application publication number CN101844331A discloses a diamond ultra-thin slice for cutting optical flat glass. The slice is made of diamond, phenolic resin binder, auxiliary metal filler, silicon powder, and carbon black. The slice has high hardness and toughness, but it does not effectively reduce the chipping size when cutting glass

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