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High-temperature sintering type yellow light conductive paste and preparation method thereof, conductive circuit and preparation method thereof

A high-temperature sintering and conductive paste technology, which is applied in the direction of conductive materials dispersed in non-conductive inorganic materials, circuits, cables/conductors, etc., can solve the problems of high resistance and high performance, and achieve good adhesion and high resolution , neat effect

Active Publication Date: 2019-10-15
乾宇微纳技术(深圳)有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a high-temperature sintering type yellow photoconductive paste, which solves the defect of low-temperature sintering of inorganic material substrates in the prior art that leads to excessive resistance and poor performance

Method used

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  • High-temperature sintering type yellow light conductive paste and preparation method thereof, conductive circuit and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] (1) Organic carrier preparation:

[0055] 1-Hydroxy-2-prop-2-enylcyclohexyl-phenyl ketone (2.5%), methacrylic acid (7.5%), polyethylene glycol methacrylic acid (2.5%), hydroxyethyl methacrylate Esters (7.5%), ethyl methacrylate (7.5%), styrene (2%), azobisisobutyronitrile (0.5%) were ultrasonically dissolved and mixed. Add propylene glycol methyl ether (70%) into a glass reactor with a reflux condenser, and stir under argon protection at 85°C. The aforementioned mixture is gradually added dropwise to the glass reactor through a dropping funnel, kept at 85°C, and stirred for 4h to obtain the intermediate thing.

[0056] Intermediate, 60%;

[0057] Dimethyl adipate, 23%;

[0058] Diethylene glycol ether acetate, 7%;

[0059] Dibutyl adipate, 7%;

[0060] Modified polyether, 0.5%;

[0061] Trimethylsiloxane, 1%

[0062] Methyl phthalate, 1.5%;

[0063] The raw materials with the above-mentioned ingredients and weight ratios are weighed, mixed, heated to 90-120° C.,...

Embodiment 2

[0084] (1) Photosensitive organic carrier preparation:

[0085] Ethyl (2-methyl-1-oxo-1-phenylprop-2-yl) 2-methylprop-2-enoate (3%), acrylic acid (7.5%), polyethylene glycol methyl Acrylic acid ester (9%), propyl acrylate (7%), styrene (2%), azobisisobutyronitrile (0.5%) were ultrasonically dissolved and mixed. Add ethylene glycol methyl ether acetate (71%) into a glass reactor with a reflux condenser, and stir under argon protection at 85° C., gradually drop the aforementioned mixture into the glass reactor through a dropping funnel, and keep the temperature at 85° C. Stirred for 4h to obtain the intermediate.

[0086] Intermediate, 60%;

[0087] Dimethyl adipate, 22%;

[0088] Ethylene glycol ether acetate, 5%;

[0089] Hexylene glycol diacrylate, 8%;

[0090] Diethyl adipate, 2%;

[0091] Gas phase SiO2, 1%;

[0092] Acrylated polysiloxane, 0.5%;

[0093] Tributyl phosphate, 1%;

[0094] Methyl phthalate, 0.5%;

[0095] The above-mentioned ingredients and raw mate...

Embodiment 3

[0104] (1) Photosensitive organic carrier preparation:

[0105] The intermediate is the same as in Example 2.

[0106] Intermediate, 62%;

[0107] Dimethyl adipate, 18%;

[0108] Ethylene glycol ether acetate, 8%;

[0109] Hexylene glycol diacrylate, 7%;

[0110] Diethyl adipate, 2%;

[0111] Gas phase SiO2, 1%;

[0112] Acrylated polysiloxane, 0.5%;

[0113] Tributyl phosphate, 1%;

[0114] Methyl phthalate, 0.5%;

[0115] The above-mentioned ingredients and raw materials are weighed, mixed, heated to 90-120° C., and electrically stirred until all the materials are dissolved into a uniform liquid to obtain a photosensitive organic carrier.

[0116] (2) Preparation of yellow light silver paste:

[0117] Spherical silver powder (particle size 2.0um, specific surface area 0.4g / m 2 , the tap density is 5.5g / cm 3 , the surface organic matter is oleic acid, 0.7% burn loss at 538°C), and the weight ratio of the conductive paste is 60%;

[0118] Spherical silver powder (p...

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Abstract

The invention particularly relates to a high-temperature sintering type yellow light conductive paste and a preparation method thereof, a conductive circuit and a preparation method thereof. The high-temperature sintering type yellow light conductive paste comprises in percentage by weight: 75-90% of noble metal powder; 1%-5% of glass powder; and 8%-25% of photosensitive organic carrier, wherein the glass phase transition temperature Tg of the glass powder is 400-500 DEG C, and the melting temperature Tf is 500-600 DEG C. The noble metal powder is matched with the glass powder and the photosensitive organic carrier, so that the conductive paste is suitable for the high-temperature sintering; and the obtained conductive paste can achieve superfine wire diameter resolution, and has good resistivity and adhesive force after sintering. Glass powder with a proper glass phase transition temperature and a melting temperature is added to provide proper adhesive force for the metal conducting layer and the base material, and the optimized noble metal powder and the glass powder ensure that the sintered circuit does not have a shrinkage cavity and breakage and can reduce the resistivity; andmoreover, the photosensitive organic carrier with a proper monomer and an initiator in proper type and proportion has high resolution and a superfine line diameter after being developed.

Description

technical field [0001] The invention relates to the technical field of electronic materials, in particular to a high-temperature sintered yellow light conductive paste, a conductive circuit and a preparation method. Background technique [0002] Today electronic products have been flooded in human's daily life. With the continuous discovery of user experience and technology, the functions of various electronic products are becoming more and more perfect, and the volume and weight are getting smaller and smaller. "Light", "thin" and "small" will be the unavoidable trend of electronic products. [0003] Hardware miniaturization, light weight, and integration are a system engineering, and the three parts of the circuit chip, passive components, and circuit substrate must be reduced at the same time. [0004] The conductive paste generally needs to go through a curing process, so that the metal particles can effectively contact each other, remove excess organic components, and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/16H01B1/22H01B13/00
CPCH01B1/16H01B1/22H01B13/0016
Inventor 康文兵余男董鹏程其他发明人请求不公开姓名
Owner 乾宇微纳技术(深圳)有限公司
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