Photothermal double-cured resin composition for pultrusion and glass fiber composite material prepared from photothermal double-cured resin composition

A resin composition and dual curing technology, applied in the field of polymer materials, can solve the problems of low production efficiency, long curing time, environmental pollution, etc., and achieve the effects of high utilization rate, fast light curing speed and high mechanical strength

Inactive Publication Date: 2019-11-12
武汉本邦复合材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The matrix resins used in traditional composite pultrusion products are thermosetting resins such as epoxy resin and unsaturated polyester. Therefore, these composite products require high temperature heating during curing. The general curing temperature is between 160°C a...

Method used

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  • Photothermal double-cured resin composition for pultrusion and glass fiber composite material prepared from photothermal double-cured resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] A photothermal dual curing resin composition for pultrusion molding in this embodiment, said composition is composed of the following components by mass: 60 parts of bisphenol A epoxy acrylate, 25 parts of polypropylene glycol diacrylate, 5 parts of 2-hydroxy-2-methyl-1-phenylacetone, 2 parts of dibenzoyl peroxide, 1 part of KH-570, 1.5 parts of activated magnesium oxide, 0.5 parts of polydimethylsiloxane, p-hydroxybenzene 0.5 part of methyl ether, 0.5 part of zinc stearate.

[0038] The glass fiber composite material is prepared by using the above-mentioned photothermal dual curing resin composition for pultrusion molding, and the steps are as follows:

[0039] In parts by mass, 60 parts of bisphenol A epoxy acrylate, 25 parts of polypropylene glycol diacrylate, 1 part of KH-570, 1.5 parts of activated magnesium oxide, 0.5 parts of polydimethylsiloxane, and 0.5 parts of p-hydroxyanisole Add 0.5 parts of zinc stearate into a closed container, heat to 45°C and stir at h...

Embodiment 2

[0041]A photothermal dual curing resin composition for pultrusion molding in this embodiment, said composition is composed of the following components by mass: 65 parts of bisphenol A epoxy acrylate, 30 parts of tripropylene glycol diacrylate 6 parts of 1-hydroxycyclohexyl benzophenone, 3 parts of dibenzoyl peroxide, 1 part of KH-570, 2 parts of activated magnesium oxide, 0.6 parts of polydimethylsiloxane, 2,6-di-tert 0.6 parts of butyl p-cresol and 0.6 parts of zinc stearate.

[0042] The glass fiber composite material is prepared by using the above-mentioned photothermal dual curing resin composition for pultrusion molding, and the steps are as follows:

[0043] In parts by mass, 65 parts of bisphenol A epoxy acrylate, 30 parts of tripropylene glycol diacrylate, 1 part of KH-570, 2 parts of activated magnesium oxide, 0.6 parts of polydimethylsiloxane, 2,6- Add 0.6 parts of di-tert-butyl p-cresol and 0.6 parts of zinc stearate into a closed container, heat to 45°C and stir a...

Embodiment 3

[0045] A photothermal dual-curing resin composition for pultrusion molding in this embodiment, the composition is composed of the following components in parts by mass:

[0046] 65 parts of novolac epoxy acrylate, 30 parts of trimethylolpropane triacrylate, 6 parts of 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 3 parts of lauroyl peroxide, 1 part of KH -590, 2.5 parts of activated magnesium oxide, 0.6 parts of polydimethylsiloxane, 0.6 parts of 2,6-di-tert-butyl p-cresol, and 0.6 parts of zinc stearate.

[0047] The glass fiber composite material is prepared by using the above-mentioned photothermal dual curing resin composition for pultrusion molding, and the steps are as follows:

[0048] In parts by mass, 65 parts of novolac epoxy acrylate, 30 parts of trimethylolpropane triacrylate, 1 part of KH-590, 2.5 parts of activated magnesium oxide, 0.6 parts of polydimethylsiloxane, 2,6-dimethicone Add 0.6 parts of tert-butyl p-cresol and 0.6 parts of zinc stearate into a clos...

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Abstract

The invention relates to a photothermal double-cured resin composition for pultrusion and a glass fiber composite material prepared from the photothermal double-cured resin composition, and belongs tothe technical field of polymer materials. The composition is composed of the following components: in parts by mass, 60-75 parts of epoxy acrylate, 25-40 parts of a reactive diluent, 4-10 parts of aphotoinitiator, 1-4 parts of a thermal initiator, 1-3 parts of a thickener, 0.5-1 part of a silane coupling agent, 0.5-1 part of a defoamer, 0.5-1 part of a polymerization inhibitor and 0.5-1 part ofan internal releasing agent. The glass fiber composite materials which is prepared from the composition has high hardness, high tensile strength, high flexural strength and high flexural modulus; moreover, photothermal double curing is adopted, the curing depth is good, and the pultrusion speed can be increased to 5-10 m/min; and only initial molding of the material is achieved through thermal curing, no complete curing is needed, and therefore only a temperature of 80-100 DEG C is needed, so that energy consumption is greatly reduced.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to a photothermal dual curing resin composition for pultrusion molding and a glass fiber composite material prepared therefrom. Background technique [0002] The matrix resins used in traditional composite pultrusion products are thermosetting resins such as epoxy resin and unsaturated polyester. Therefore, these composite products require high temperature heating during curing. The general curing temperature is between 160°C and 180°C. High energy consumption, long curing time, pultrusion speed is usually about 2m / min, low production efficiency, in addition, some organic solvents added in the traditional matrix material system will volatilize into the air during curing, causing pollution to the environment . [0003] Based on the above reasons, this application is filed. Contents of the invention [0004] In view of the above-mentioned problems or defects ...

Claims

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Application Information

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IPC IPC(8): C08F283/10C08F222/20C08F222/14C08L63/10C08L51/08C08K7/14C08J5/04B29C70/52B29C70/54
CPCB29C70/52B29C70/525C08F283/105C08J5/043C08J2351/08C08J2363/10C08K7/14
Inventor 万春杰蔡建国刘小萍
Owner 武汉本邦复合材料科技有限公司
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