Method for improving copper oxidation resistance of authigenic nonmetal oxide composite film

Abstract

The invention provides a method for improving copper oxidation resistance of an authigenic nonmetal oxide composite film. Trace of Si elements are added into Cu so that a Cu@SiO2 composite attachmentfilm can be formed on the surface of Cu, and high-temperature oxidation resistance of the metal Cu and a product of the metal Cu is improved. By means of the method, trace of Si is mixed with Cu, repeated smelting is conducted in a vacuum smelting furnace, and a light doped CuSi alloy is manufactured. The added trace of Si elements are annealed in the Ar-20%H2 atmosphere, the trace of Si in the alloy is segregated to the surface of the alloy through the segregation effect and is reacted with residual O2 in the annealing atmosphere to generate SiO2, and therefore the Cu@SiO2 composite attachment film with a high melting point and stable performance can be formed, and it is ensured that a Cu metal matrix of the CuSi alloy is not oxidized under the high-temperature and pure-oxygen condition.By means of the method, the use reliability of copper-based parts and equipment is ensured, the cost is reduced, and industrial waste is reduced.

Description

technical field [0001] The invention relates to the field of anti-oxidation of metal composites, in particular to a method for improving copper anti-oxidation ability of a self-generated non-metal oxide composite film. Background technique [0002] Due to its good electrical and thermal conductivity and anti-electromigration function, metallic copper has been widely used in industrial production, such as ultra-large-scale connection materials and electronic equipment. However, the surface of metallic copper is easily oxidized in actual production, making Copper-based products are easily corroded, which seriously affects the performance of the product and causes huge industrial waste. In the face of this problem, in the current industrial production, it is generally used to add one or more elements such as Al, Ti, Ni, Mg, Cr, etc. to copper to form a composite to increase the utilization rate of metal copper. It will affect the performance of copper itself, such as the decre...

AI Technical Summary

Problems solved by technology

[0002] Due to its good electrical and thermal conductivity and anti-electromigration function, metallic copper has been widely used in industrial production, such as ultra-large-scale connection materials and electronic equipment. However, the surface of metallic copper is easily oxidized in actual production, making Copper-based products are easily corroded, which seriously affects the performance of the product and causes huge industrial waste

In the face of this problem, in the current industrial production, it is generally used to add one or more elements such as Al, Ti, Ni, Mg, Cr, etc. to copper to form a composite to increase the utilization rate of metal copper. It will affect the performance of copper itself, such as the decrease of electrical conductivity and thermal conductivity, and the impact of mechanical properties, etc., which will limit the use of this process

In addition, the electroplating method is also widely used in metal anti-corrosion, but the electrolyte, tank mud, and waste liquid in the electroplating process are all extremely harmful environmental pollutants.

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