Method for improving copper oxidation resistance of authigenic nonmetal oxide composite film

A technology of non-metallic oxide and anti-oxidation ability, applied in the field of self-generated non-metallic oxide composite film to improve the anti-oxidation ability of copper, can solve the problems of copper-based products being easily corroded, affecting copper performance, use restrictions, etc., to improve the anti-oxidation ability. Effects of oxidizing power, improving oxidation resistance, and improving reliability

Active Publication Date: 2019-12-17
JILIN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] Due to its good electrical and thermal conductivity and anti-electromigration function, metallic copper has been widely used in industrial production, such as ultra-large-scale connection materials and electronic equipment. However, the surface of metallic copper is easily oxidized in actual production, making Copper-based products are easily corroded, which seriously affects the performance of the product and causes huge industrial waste
In the face of this problem, in the current industrial production, it is generally used to add one or more elements such as Al, Ti, Ni, Mg, Cr, etc. to copper to form a composite to increase the utilization rate of metal copper. It will affect the performance of copper itself, such as the decrease of electrical conductivity and thermal conductivity, and the impact of mechanical properties, etc., which will limit the use of this process
In addition, the electroplating method is also widely used in metal anti-corrosion, but the electrolyte, tank mud, and waste liquid in the electroplating process are all extremely harmful environmental pollutants.

Method used

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  • Method for improving copper oxidation resistance of authigenic nonmetal oxide composite film
  • Method for improving copper oxidation resistance of authigenic nonmetal oxide composite film
  • Method for improving copper oxidation resistance of authigenic nonmetal oxide composite film

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Experimental program
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Effect test

Embodiment 1

[0031] a. being that 0.2% Si with a granular mass fraction of a purity of 99.99% is mixed with pure Cu with a granular mass fraction of 99.8% and a purity of 99.9999%;

[0032] b. Put the mixed materials in three different crucibles on the melting plate of the vacuum melting furnace, and put the titanium ingot (standard deoxidized sample) in the crucible in the center of the melting plate, and then pump the furnace to a low vacuum (-0.1 atm). Introduce high-purity argon, the flow rate of high-purity argon is 3000-6000cm 3 / min, the air pressure is 1atm, and the ventilation is repeated 3-5 times to ensure the argon protective gas environment in the vacuum melting furnace;

[0033] c. Turn on the welding machine, the welding machine adopts WS-IGBT manual tungsten argon arc welding machine, start the welding torch located in the vacuum melting furnace, point the welding torch at the crucible with titanium ingot in the center of the melting plate of the vacuum melting furnace, an...

Embodiment 2

[0038] a. be 0.5% Si with a purity of 99.99% and a granular mass fraction of 99.5% pure Cu mixed with a mass fraction of 99.9999%;

[0039] b. Put the mixed materials in three different crucibles on the melting plate of the vacuum melting furnace, and put the titanium ingot (standard deoxidized sample) in the crucible in the center of the melting plate, and then pump the furnace to a low vacuum (-0.1 atm). Introduce high-purity argon, and the flow rate of high-purity argon is 3000-6000cm 3 / min, the air pressure is 1atm, and the ventilation is repeated 3-5 times to ensure the argon protective gas environment in the vacuum melting furnace;

[0040] c. Turn on the welding machine, the welding machine adopts WS-IGBT manual tungsten argon arc welding machine, start the welding torch located in the vacuum melting furnace, point the welding torch at the crucible with titanium ingot in the center of the melting plate of the vacuum melting furnace, and repeatedly smelt titanium Ingo...

Embodiment 3

[0045] a. being 99.99% Si with a granular mass fraction of 1% purity and 99% pure Cu with a granular mass fraction of 99%; Put the titanium ingot (standard deoxidized sample) in the crucible in the center of the melting plate, and then pump the furnace to a low vacuum (-0.1atm). Introduce high-purity argon, and the flow rate of high-purity argon is 3000-6000cm 3 / min, the air pressure is 1atm, and the ventilation is repeated 3-5 times to ensure the argon protective gas environment in the vacuum melting furnace;

[0046] c. Turn on the welding machine, the welding machine adopts WS-IGBT manual tungsten argon arc welding machine, start the welding torch located in the vacuum melting furnace, point the welding torch at the crucible with titanium ingot in the center of the melting plate of the vacuum melting furnace, and repeatedly smelt titanium Ingot 8-10 times, each time 40-60s, current 3-5A, to remove possible residual oxygen in the vacuum melting furnace, to prevent the form...

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Abstract

The invention provides a method for improving copper oxidation resistance of an authigenic nonmetal oxide composite film. Trace of Si elements are added into Cu so that a Cu@SiO2 composite attachmentfilm can be formed on the surface of Cu, and high-temperature oxidation resistance of the metal Cu and a product of the metal Cu is improved. By means of the method, trace of Si is mixed with Cu, repeated smelting is conducted in a vacuum smelting furnace, and a light doped CuSi alloy is manufactured. The added trace of Si elements are annealed in the Ar-20%H2 atmosphere, the trace of Si in the alloy is segregated to the surface of the alloy through the segregation effect and is reacted with residual O2 in the annealing atmosphere to generate SiO2, and therefore the Cu@SiO2 composite attachment film with a high melting point and stable performance can be formed, and it is ensured that a Cu metal matrix of the CuSi alloy is not oxidized under the high-temperature and pure-oxygen condition.By means of the method, the use reliability of copper-based parts and equipment is ensured, the cost is reduced, and industrial waste is reduced.

Description

technical field [0001] The invention relates to the field of anti-oxidation of metal composites, in particular to a method for improving copper anti-oxidation ability of a self-generated non-metal oxide composite film. Background technique [0002] Due to its good electrical and thermal conductivity and anti-electromigration function, metallic copper has been widely used in industrial production, such as ultra-large-scale connection materials and electronic equipment. However, the surface of metallic copper is easily oxidized in actual production, making Copper-based products are easily corroded, which seriously affects the performance of the product and causes huge industrial waste. In the face of this problem, in the current industrial production, it is generally used to add one or more elements such as Al, Ti, Ni, Mg, Cr, etc. to copper to form a composite to increase the utilization rate of metal copper. It will affect the performance of copper itself, such as the decre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/10C22C1/02C22F1/08C22F1/02
CPCC22C1/02C22C9/10C22F1/02C22F1/08
Inventor 朱永福李春赫张健冀政潼郎兴友金波杨春城蒋青
Owner JILIN UNIV
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