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Conductive adhesive composition capable of being stored at normal temperature and preparation method thereof

A composition, conductive adhesive technology, applied in conductive adhesives, adhesives, epoxy resin adhesives, etc., can solve the problems of poor bonding performance and toughness comprehensive performance, conductive adhesives cannot be stored at room temperature and heat resistance, etc. Excellent process performance, excellent comprehensive performance, the effect of improving toughness

Inactive Publication Date: 2019-12-24
DONGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a conductive adhesive composition that can be stored at room temperature and its preparation method, so as to overcome the fact that the conductive adhesive in the prior art cannot be stored at room temperature and its comprehensive performance of heat resistance, bonding performance and toughness is not good. Defects

Method used

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  • Conductive adhesive composition capable of being stored at normal temperature and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0034] This embodiment provides a conductive adhesive composition, comprising: 6 parts of electronic grade bisphenol A epoxy resin 328 (Shanghai Huayi), 6 parts of electronic grade bisphenol F epoxy resin 370 (Shanghai Huayi), alicyclic Epoxy resin-like CELLOXIDE 2021P (Japan Daicel) 2 parts, diluent butanediol diglycidyl ether 2 parts, latent curing agent TC3632 (Shenzhen Kaiji) 0.7 parts, toughening agent MX139 (Japan KANEKA) 3 parts, Wetting and dispersing agent BYK-W969 (BYK, Germany) 0.1 part, coupling agent A-187 (Momentive, USA) 0.1 part, defoaming agent VATIX 1030 (Beijing Etif) 0.1 part, flake silver powder (average flake diameter) 12μm) (Northwest Nonferrous Metal Research Institute) 60 parts, spherical silver powder (average particle size 1μm) (Northwest Nonferrous Metal Research Institute) 20 parts.

[0035] This embodiment also provides a method for preparing a conductive adhesive composition, specifically: 6 parts of electronic grade bisphenol A epoxy resin 328 (Sha...

Embodiment 2

[0037] This embodiment provides a conductive adhesive composition, comprising: 5 parts of electronic grade bisphenol A epoxy resin 328 (Shanghai Huayi), 4 parts of electronic grade bisphenol F epoxy resin 370 (Shanghai Huayi), naphthol Type epoxy resin HP-4032 (Dainippon Ink) 2 parts, alicyclic epoxy resin TTA21 (Jiangsu Taitel) 2 parts, diluent neopentyl glycol diglycidyl ether 2 parts, latent curing NACURE-Super XC-7231 (U.S. King Industries) 0.5 parts, toughening agent NANOPOX E500 (Germany Evonik) 2 parts, wetting and dispersing agent VATIX 2017 (Beijing Etif) 0.2 parts, coupling agent SCA-E87M (Nanjing Nengdexin) Material) 0.2 parts, defoamer BYK-A530 (Beck, Germany) 0.1 parts, flake silver powder (average flake diameter 15μm) (Northwest Nonferrous Metal Research Institute) 72 parts, spherical silver powder (average particle size 3μm) (Northwest Non-ferrous Metal Research Institute) 10 copies.

[0038] According to the preparation method in Example 1, the above-mentioned ra...

Embodiment 3

[0040] This embodiment provides a conductive adhesive composition, including: 3 parts of electronic grade bisphenol A epoxy resin 328 (Shanghai Huayi), 7 parts of electronic grade bisphenol F epoxy resin JE-8672 (Shenzhen Jiadida) , Hybrid epoxy resin EGA-90 (Shanghai Huayi) 2 parts, diluent ethylene glycol diglycidyl ether 3 parts, latent curing agent TC3632 (Shenzhen Kaiji) 0.7 parts, toughening agent MX139 (Japan KANEKA) 3 parts, wetting and dispersing agent VATIX 2018 (Beijing Etfu) 0.1 part, coupling agent Silok 6634M (Guangzhou Silok) 0.1 part, defoaming agent BYK-320 (Germany BYK) 0.1 part, flaky silver powder ( Average flake diameter 10μm) (Northwest Nonferrous Metal Research Institute) 66 parts, spherical silver powder (average particle size 2μm) (Northwest Nonferrous Metal Research Institute) 15 parts.

[0041] According to the preparation method in Example 1, the above-mentioned raw materials are used to obtain a conductive adhesive composition that can be stored at ro...

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Abstract

The invention relates to a conductive adhesive composition capable of being stored at normal temperature and a preparation method thereof. The composition comprises the following components in parts by weight: 10-16 parts of epoxy resin, 2-6 parts of an epoxy diluent, 0.2-1 part of a latent curing agent, 2-5 parts of a toughening agent, 0.1-0.5 part of a wetting dispersant, 0.1-0.5 part of a coupling agent, 0.1-0.5 part of a defoaming agent and 78-82 parts of conductive silver powder. The composition can be stored for more than 12 months at normal temperature, also has the advantages of good fluidity, high bonding strength, good electrical conductivity and thermal conductivity and the like, and has a wide application prospect in the field of microelectronic packaging.

Description

Technical field [0001] The invention belongs to the field of conductive adhesive compositions and preparation methods thereof, and particularly relates to a conductive adhesive composition that can be stored at room temperature and a preparation method thereof. Background technique [0002] In the microelectronic packaging industry, lead-tin alloys are an important type of metal solder for conductive connection of integrated circuits due to their low melting point and excellent electrical and thermal conductivity. However, due to the toxicity of metallic lead, which can cause harm to human health and the natural environment, developed countries such as Europe, the United States, and Japan have gradually banned the use of lead-tin solder in electronic products. In particular, the European Union promulgated Waste Electrical and Electronic Equipment Directive (WEEE) and Restriction of Hazardous Substances (RoHS) regulations in June 2000, clearly restricting the use of lead-containin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J9/02C09J11/08C09J11/04
CPCC08K2003/0806C08K2201/011C08L2205/025C08L2205/035C09J9/02C09J11/04C09J11/08C09J163/00C08L63/00C08K13/04C08K7/00C08K3/08C08K7/18C08K3/36
Inventor 刘万双张孪秋魏毅
Owner DONGHUA UNIV