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Resin film and manufacturing method thereof

A manufacturing method and resin film technology, which can be used in instruments, electrical digital data processing, identification devices, etc., can solve problems such as lack of material properties, and achieve the effect of excellent optical properties, damage and other defect suppression

Pending Publication Date: 2019-12-31
SUMITOMO CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In recent years, image display devices have been required to be thinner, lighter, and more flexible, but conventionally used glass substrates or glass front panels do not have sufficient material properties to meet the aforementioned requirements.

Method used

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  • Resin film and manufacturing method thereof
  • Resin film and manufacturing method thereof
  • Resin film and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0193] The solvent used in the preparation of the varnish is not particularly limited as long as it can dissolve the aforementioned resin. Examples of the solvent include amide solvents such as N,N-dimethylacetamide (DMAc) and N,N-dimethylformamide; γ-butyrolactone (GBL), γ-valerolactone Isolactone-based solvents; sulfur-containing solvents such as dimethyl sulfone, dimethyl sulfoxide, and sulfolane; carbonate-based solvents such as ethylene carbonate and 1,2-propylene carbonate; and combinations thereof. Among these, amide-based solvents or lactone-based solvents are preferable. These solvents can be used individually or in combination of 2 or more types. In addition, water, alcohol-based solvents, ketone-based solvents, acyclic ester-based solvents, ether-based solvents, and the like may be contained in the varnish. The solid content concentration of the varnish is preferably 1 to 25% by mass, more preferably 5 to 20% by mass.

[0194] In the coating step, the varnish is ...

Embodiment

[0265] Hereinafter, the present invention will be described in further detail through examples. Unless otherwise stated, "%" and "part" in an example mean mass % and a mass part. In the examples, the measurement method and evaluation method of each item were performed by the following methods.

[0266] (thickness of resin film)

[0267] Using a micrometer ("ID-C112XBS" manufactured by Mitutoyo Corporation), the thickness of the resin film at 10 or more places was measured, and the average value was computed.

[0268] (Total light transmittance and haze of resin film)

[0269] According to JIS K 7361-1: 1997 and JIS K 7136: 2000, the total light transmittance and haze of the resin film were measured using a fully automatic direct-reading haze computer HGM-2DP manufactured by Suga Test Instruments Co., Ltd., respectively. The resin films of Examples and Comparative Examples were cut into a size of 30 mm×30 mm to prepare measurement samples. In Table 2, the total light transm...

manufacture example 1

[0298] <Manufacturing Example 1: Manufacture of Polyimide-Based Resin 1)

[0299] Under a nitrogen atmosphere, 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl (TFMB) 45g (140.52mmol) and N were added to a 1L detachable flask equipped with a stirring blade, 768.55 g of N-dimethylacetamide (DMAc), and TFMB was dissolved in DMAc while stirring at room temperature. Next, 18.92 g (42.58 mmol) of 4,4'-(hexafluoroisopropylidene)diphthalic dianhydride (6FDA) was added to the flask, and stirred at room temperature for 3 hours. Then, 4,4'-oxybis(benzoyl chloride) (OBBC) 4.19 g (14.19 mmol), followed by terephthaloyl dichloride (TPC) 17.29 g (85.16 mmol) were added to the flask, at room temperature Stirring was carried out for 1 hour. Next, 4.63 g (49.68 mmol) of 4-picoline and 13.04 g (127.75 mmol) of acetic anhydride were added to the flask, and stirred at room temperature for 30 minutes, then the temperature was raised to 70° C. using an oil bath, and further stirred for 3.5 hours. ...

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Abstract

The present invention addresses the problem of providing: a resin film which has optical properties required for a front panel, while being suppressed in defects such as damage due to rattling of thefilm during production; and a method for producing the resin film. The invention provides a resin film. The resin film contains at least one of a polyimide resin or a polyamide resin, and the center point in the width direction of the film is set as TDc; the in-plane phase difference value R (TDc) of TDc and the in-plane phase difference value R (TD80) of TD80, which are measured at a wavelength of 590 nm, satisfy formula (1), where TD80 is the point of 80% of the length from the center point in the width direction to the end portion with the center point being 0%. R (TDc) / R (TD80)>=0.35 (1).

Description

technical field [0001] The present invention relates to a resin film containing at least any one of polyimide-based resin and polyamide-based resin, and a method for producing the same. Background technique [0002] In recent years, image display devices have been required to be thinner, lighter, and more flexible. However, conventionally used glass substrates and glass front panels do not have sufficient material properties to meet the aforementioned requirements. Therefore, the development of materials or substrates that replace glass is being advanced. One of them includes a resin film containing polyimide resin. From the viewpoint of flexibility, transparency, and heat resistance, resin films containing polyimide resins have been used in various applications. (Patent Document 1). [0003] prior art literature [0004] patent documents [0005] Patent Document 1: Japanese Patent Laid-Open No. 2009-286826 Contents of the invention [0006] The problem to be solved ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18B29C35/04B29C35/06B29C35/08G09F9/30C08L79/08
CPCC08J5/18B29C35/045B29C35/06B29C35/08G09F9/301C08J2379/08B29C2035/046C08J7/08G06F3/041G06F2203/04102C08J2377/00
Inventor 大松一喜永田诚
Owner SUMITOMO CHEM CO LTD
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