Cleaning method of target material

Abstract

The invention provides a cleaning method of a target material. The cleaning method of the target material comprises the following steps that (1), a cleaning agent is coated on the surface of the target material, and brushing is carried out; (2), the brushed target material is ultrasonically cleaned; and (3), inert gas is used to blow-dry water on the surface of the target material after ultrasoniccleaning, and then vacuum drying treatment is carried out to obtain the cleaned target material. According to the cleaning method of the target material, the target material does not need to be cleaned by using a high-pressure water gun, the cleaning method is simple, the consumption of the cleaning agent is low, the cleaning cost is reduced, moreover, the amount of waste liquid generated throughthe cleaning method is small, and the pressure of waste liquid treatment is favorably reduced.

Description

technical field

[0001] The invention relates to the technical field of microelectronics, relates to a method for producing a target, and in particular to a method for cleaning a target. Background technique

[0002] PVD coating technology refers to the use of physical methods to vaporize the material source-solid or liquid surface into gaseous atoms, molecules or parts of ionization into ions, and through the low-pressure gas (or plasma) process, deposit a certain special function on the surface of the substrate. thin film technology. The main methods of physical vapor deposition include vacuum evaporation, sputtering coating, arc plasma plating, ion coating or molecular beam epitaxy.

[0003] Sputtering coating technology uses ions to bombard the surface of the target, and the phenomenon of knocking out the atoms of the target is sputtering. The deposition of atoms generated by sputtering on the surface of the substrate is called sputter coating. Usually, gas discharge i...