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Honeycomb-like solid-liquid composite heat dissipation material for CPU heat dissipation, and manufacturing method thereof

A technology of compounding heat-dissipating materials and heat-dissipating materials is applied in the field of heat-dissipating materials for electrical devices, which can solve problems such as affecting heat-dissipating performance, aging, and drying, and achieve the effects of increasing specific surface area, eliminating internal stress and stabilizing structure.

Inactive Publication Date: 2020-01-14
ZHUIXIN DIGITAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, any radiator on the market only uses one or two heat transfer methods, namely contact heat transfer and heat convection. At the same time, it has a relatively complex structure and high material cost, which restricts high performance. CPU usage and promotion
In addition, the bottom of all heat sinks is coated with silicone grease to complete the contact between the heat dissipation material and the CPU, but the heat transfer performance of the silicone grease itself is average, and it will dry out and age as the working time at high temperatures increases. , affecting the overall cooling performance

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] ①Pre-preparation: Prepare 480g of vinylidene fluoride, 320g of trifluoroethylene, 270g of methyl methacrylate, 160g of vinyl acetate, 280g of ethylene, 2g of azobisisobutyronitrile initiator, 220g of graphite powder, and 1.4g of gull gum; Prepare a cylinder with ventilation holes arranged evenly and densely at the bottom according to the grid gap of 1mm-1.5mm, with a hole diameter of 0.3mm-0.5mm, a spray angle of 60° to the bottom surface, and a spray angle distributed clockwise along the tangential direction of the circle where the pores are located. Shaped glass heating vessel;

[0029] ②Mix 0.6g of azobisisobutyronitrile initiator with all methyl methacrylate, vinyl acetate and graphite powder and stir evenly to obtain mixture A, then put mixture A into a stainless steel autoclave, vacuumize and fill Inject nitrogen, increase the pressure to 3.6MPa, heat to 55°C-60°C, and continue to stir at a stirring rate of 130rpm / min to obtain a pool to be reacted;

[0030] ③Con...

Embodiment 2

[0037] The whole is consistent with Example 1, the difference is:

[0038] ①Pre-preparation: Prepare 500g of vinylidene fluoride, 300g of trifluoroethylene, 250g of methyl methacrylate, 150g of vinyl acetate, 250g of ethylene, 1.5g of azobisisobutyronitrile initiator, 200g of graphite powder, and 1g of gull gum; Prepare a cylinder with ventilation holes arranged evenly and densely at the bottom according to the grid gap of 1mm-1.5mm, with a hole diameter of 0.3mm-0.5mm, a spray angle of 60° to the bottom surface, and a spray angle distributed clockwise along the tangential direction of the circle where the pores are located. Shaped glass heating vessel;

[0039] ②Mix 0.5g of azobisisobutyronitrile initiator with all methyl methacrylate, vinyl acetate and graphite powder and stir evenly to obtain mixture A, then put mixture A into a stainless steel autoclave, vacuumize and fill Inject nitrogen, increase the pressure to 3.5MPa, heat to 55°C-60°C, and continue to stir at a stirr...

Embodiment 3

[0041] The whole is consistent with Example 1, the difference is:

[0042] ① Pre-preparation: Prepare 400g of vinylidene fluoride, 400g of trifluoroethylene, 300g of methyl methacrylate, 180g of vinyl acetate, 300g of ethylene, 2.5g of azobisisobutyronitrile initiator, 250g of graphite powder, and 2g of gull gum; Prepare a cylinder with ventilation holes arranged evenly and densely at the bottom according to the grid gap of 1mm-1.5mm, with a hole diameter of 0.3mm-0.5mm, a spray angle of 60° to the bottom surface, and a spray angle distributed clockwise along the tangential direction of the circle where the pores are located. Shaped glass heating vessel;

[0043] ②Mix 0.7g of azobisisobutyronitrile initiator with all methyl methacrylate, vinyl acetate and graphite powder and stir evenly to obtain mixture A, then put mixture A into a stainless steel autoclave, vacuumize and fill Inject nitrogen, increase the pressure to 3.8MPa, heat to 55°C-60°C, and continue stirring at a sti...

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PUM

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Abstract

The invention discloses a honeycomb-like solid-liquid composite heat dissipation material for CPU heat dissipation, and a manufacturing method thereof, wherein the heat dissipation material comprisestwo parts, the matrix part comprises 55-80 parts by weight of a P(VDF-TrFE) copolymer with multiple honeycomb-like through holes inside, the filler part comprises a blend cured inside the matrix part,and the blend comprises: 15-20 parts by weight of polymethyl methacrylate, 25-35 parts by weight of ethylene-vinyl acetate and 15-25 parts by weight of graphite powder. According to the invention, the material does not require adhesives, and has characteristics of large specific surface area, rapid heat dissipation, multiple heat dissipation mode coexisting, weather resistance, oxidation resistance and cracking resistance.

Description

technical field [0001] The invention relates to the technical field of heat dissipation materials for electrical devices, in particular to a method for manufacturing a honeycomb solid-liquid composite heat dissipation material for CPU heat dissipation. Background technique [0002] CPU radiators in the prior art can be classified into three types according to their heat dissipation methods: air cooling, heat pipe cooling and water cooling. [0003] Among them, the air-cooled radiator is the most common type of radiator now, including a cooling fan and a heat sink generally made of aluminum. The principle is to transfer the heat generated by the CPU to the heat sink, and then take the heat away through the fan. . Heat pipe radiator is a heat transfer element with extremely high thermal conductivity, which transfers heat through the evaporation and condensation of liquid in a fully enclosed vacuum tube. Most of these fans are "air-cooled + heat pipe", which has the advantage...

Claims

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Application Information

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IPC IPC(8): C08F214/22C08F220/14C08F214/20C08F218/08C08F2/44C08K3/04C09K5/14
CPCC08F2/44C08F210/02C08F214/20C08F214/22C08F218/08C08F220/14C08K3/04C09K5/14
Inventor 张敬敏
Owner ZHUIXIN DIGITAL TECH CO LTD