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Ceramic circuit cyanide-free copper plating solution, preparation method and electroplating process

A cyanide-free copper plating and solution technology is applied in the field of electroplating process and ceramic circuit cyanide-free copper plating solution, which can solve problems such as toxicity and environmental pollution, and achieve the effects of low porosity, good plating solution stability and low preparation cost.

Inactive Publication Date: 2020-04-03
CETC GUOJI SOUTHERN GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Cyanide copper plating has been gradually banned because it contains cyanide, and the plating solution is highly toxic and will cause great pollution to the environment.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] This embodiment is aimed at the copper plating of alumina ceramic circuit, and the electroplating process includes the following contents:

[0033] Degreasing: remove oil stains, fingerprints, stains and other pollutants on the surface of ceramic circuits;

[0034] Washing with tap water: remove the solution remaining in the degreasing process;

[0035] Hydrochloric acid activation: use 50% hydrochloric acid to remove the oxide layer existing on the substrate material, exposing the fresh substrate to be plated;

[0036] Washing with pure water: remove the residual solution during the activation process, and avoid the possibility of bringing chloride ions into the plating solution after washing with tap water;

[0037] Pre-plating copper: high-current impact copper plating to improve the bonding force between the substrate and the subsequent copper plating layer.

[0038] Washing with pure water: remove the solution remaining in the pre-plating process, avoiding the po...

Embodiment 2

[0041] This embodiment copper-plates aluminum nitride ceramic circuit, electroplating process, comprises the following contents:

[0042] Degreasing: remove oil stains, fingerprints, stains and other pollutants on the surface of ceramic circuits;

[0043] Washing with tap water: remove the solution remaining in the degreasing process;

[0044] Hydrochloric acid activation: use 50% hydrochloric acid to remove the oxide layer existing on the substrate material, exposing the fresh substrate to be plated;

[0045] Washing with pure water: remove the residual solution during the activation process, and avoid the possibility of bringing chloride ions into the plating solution after washing with tap water;

[0046] Pre-plating copper: high-current impact copper plating to improve the bonding force between the substrate and the subsequent copper plating layer.

[0047] Washing with pure water: remove the solution remaining in the pre-plating process, avoiding the possibility of brin...

Embodiment 3

[0050] This embodiment includes the following contents to the printed circuit-PCB copper plating and electroplating process:

[0051] Degreasing: remove oil stains, fingerprints, stains and other pollutants on the surface of ceramic circuits;

[0052] Washing with tap water: remove the solution remaining in the degreasing process;

[0053] Hydrochloric acid activation: use 50% hydrochloric acid to remove the oxide layer existing on the substrate material, exposing the fresh substrate to be plated;

[0054]Washing with pure water: remove the residual solution during the activation process, and avoid the possibility of bringing chloride ions into the plating solution after washing with tap water;

[0055] Pre-plating copper: high-current impact copper plating to improve the bonding force between the substrate and the subsequent copper plating layer.

[0056] Washing with pure water: remove the solution remaining in the pre-plating process, avoiding the possibility of bringing ...

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PUM

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Abstract

The invention discloses a ceramic circuit cyanide-free copper plating solution, a preparation method and an electroplating process. The cyanide-free copper plating solution mainly includes 15-20 g / L of copper chloride, 30-50 g / L of basic copper carbonate, 5-8 g / L of sodium ethylenediamine teramethylene phosphonate, 18-25 g / L of seignette salt, 280-320 g / L of citric acid, 15-18 g / L of sodium bicarbonate, 0.02-0.03 g / L of selenium dioxide and an appropriate amount of potassium hydroxide. The ceramic circuit cyanide-free copper plating solution can be used for cyanide-free copper plating, is green and environment-friendly, cheap in selected raw material and low in preparation cost; and the copper plating layer obtained by plating on a ceramic circuit substrate through the copper plating formula solution is meticulous, uniform, low in porosity and good in binding force.

Description

technical field [0001] The invention belongs to the technical field of ceramic circuit plating, in particular to a cyanide-free copper plating solution for ceramic circuits, a preparation method and an electroplating process. Background technique [0002] Ceramic circuit is an interconnected circuit structure made on a ceramic substrate. It has the characteristics of high interconnection density and high line precision, and can realize small hole metallization. It is used to prepare passive components such as integrated resistors, capacitors, and inductors, and High-power circuits are widely used in airborne, spaceborne, aerospace and other fields. In addition to having qualified electrical properties, ceramic circuits should also meet the technical requirements of subsequent assembly processes. Metal copper has the characteristics of low resistivity, high reliability, small interconnect size, high density, and high anti-migration ability. Its resistivity is smaller than th...

Claims

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Application Information

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IPC IPC(8): C25D3/38C25D5/54
CPCC25D3/38C25D5/54
Inventor 孙林张超檀晓海程凯
Owner CETC GUOJI SOUTHERN GRP CO LTD
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