Toughened epoxy adhesive capable of being reprocessed and recycled and curing method

A technology of epoxy adhesive and curing method, applied in the direction of adhesive, epoxy resin glue, adhesive type, etc., can solve the problem that the toughness of epoxy adhesive and the recyclability of reprocessing cannot be both, and achieve good toughness, The effect of good low temperature flexibility and high compatibility

Active Publication Date: 2020-04-10
NANJING INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Technical problem to be solved: This application mainly proposes a toughened epoxy adhesive that can be reprocessed and recycled and its curing method, so as to solve the problems in the prior art that the existing epoxy adhesive can not be toughened and reprocessed and recycled. Technical problem, provide an epoxy adhesive with high toughness and recyclability for reprocessing, and describe its curing method

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  • Toughened epoxy adhesive capable of being reprocessed and recycled and curing method

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Embodiment 1

[0031] A kind of curing method of the toughened epoxy adhesive that can be reprocessed and recycled comprises the steps:

[0032] Step 1: Preparation of toughening agent aromatic amine-terminated polysulfide resin: Weigh 100 g of mercapto-terminated liquid polysulfide resin with a relative molecular mass of 4000, 6.2 g of 2,2′-diaminodiphenyl disulfide, 2, Add 0.1 g of 4,6-tris(dimethylaminomethyl)phenol and 150 g of solvent dioxymethane into the reaction bottle, stir and reflux under nitrogen protection, and heat at 120°C for 24 hours to make the disulfide bond in diaminodiphenyl disulfide Fully exchange with the disulfide bond in the main chain of polysulfide resin, monitor the reaction process by TLC until the raw material point of diaminodiphenyl disulfide completely disappears, cool to 60°C, add 5g hydrogen peroxide, and react under nitrogen protection for 12 Hours, the thiol is completely oxidatively coupled, infrared spectroscopy monitors the thiol 2562cm -1 The absorp...

Embodiment 2

[0035] A kind of curing method of the toughened epoxy adhesive that can be reprocessed and recycled comprises the steps:

[0036]Step 1: Preparation of the toughening agent aromatic amine-terminated polysulfide resin: Weigh 100 g of mercapto-terminated liquid polysulfide resin with a relative molecular mass of 1000, 24.8 g of 2,2′-diaminodiphenyl disulfide, triethyl Add 0.1g of amine and 150g of solvent dioxymethane into the reaction bottle, stir and reflux under nitrogen protection, heat at 150°C, and react for 36 hours, so that the disulfide bonds in the diaminodiphenyl disulfide and the disulfide bonds in the main chain of the polysulfide resin are fully Exchange, use thin-layer chromatography TLC to monitor the reaction process until the diaminodiphenyl disulfide raw material point completely disappears, cool to 60°C, add 5g hydrogen peroxide, and react for 12 hours under nitrogen protection to completely oxidize and couple the mercapto groups. Infrared spectroscopy 2562cm...

Embodiment 3

[0039] A kind of curing method of the toughened epoxy adhesive that can be reprocessed and recycled comprises the steps:

[0040] Step 1: Preparation of toughening agent aromatic amine-terminated polysulfide resin: Weigh 100g of mercapto-terminated liquid polysulfide resin with a relative molecular weight of 4000, 6.2g and 0.1g of 4,4′-diaminodiphenyl disulfide Add triethanolamine and 150 g of solvent dioxymethane into the reaction flask, stir and reflux under nitrogen protection, heat at 130 ° C, and react for 20 hours to fully exchange the disulfide bonds in the diaminodiphenyl disulfide with the disulfide bonds in the main chain of the polysulfide resin , use thin-layer chromatography TLC to monitor the reaction process until the diaminodiphenyl disulfide raw material point completely disappears, cool to 60 °C, add 5g hydrogen peroxide, and react for 12 hours under nitrogen protection to completely oxidize and couple the mercapto groups. Infrared spectroscopy Monitor mercap...

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Abstract

The invention relates to a toughened epoxy adhesive capable of being reprocessed and recycled and a curing method. The toughened epoxy adhesive capable of being reprocessed and recycled comprises thefollowing raw material components in parts by mass: 100 parts of epoxy resin, 15-35 parts of diaminodiphenyl disulfide serving as a curing agent and 20-70 parts of aromatic amino-terminated polysulfide resin serving as a toughening agent, wherein the raw material of the toughening agent aromatic amino terminated polysulfide resin comprises the following components in parts by mass: 100 parts of sulfydryl terminated liquid polysulfide resin, 6-25 parts of diaminodiphenyl disulfide, 0.1 part of tertiary amine, 5 parts of hydrogen peroxide and 150 parts of methane dioxide as a solvent; the curingagent and the toughening agent both contain the same reversible covalent bond, so that the dynamic reversibility of the whole cross-linked structure is realized, the screenwork rearrangement is initiated to enable the epoxy adhesive to have reprocessability and recoverability, and the main performance retention rate after three cycles exceeds 90%; and the problems of environmental pollution and resource waste caused by waste high polymer materials can be effectively relieved.

Description

technical field [0001] The invention belongs to the technical field of epoxy adhesives, in particular to a toughened epoxy adhesive capable of reprocessing and recycling and a curing method. Background technique [0002] As a typical thermosetting material, epoxy adhesive has excellent tensile strength, wear resistance, medium resistance, electrical insulation and bonding performance, and is widely used in aerospace, shipbuilding, electronics, machinery and other fields. Epoxy adhesives without toughening modification have problems such as high brittleness, low elongation at break, and poor impact resistance, which limit their application range. Therefore, epoxy adhesives usually need to be used after toughening modification. [0003] At present, the toughened epoxy adhesives commonly used at home and abroad are usually obtained by curing components such as epoxy resin, curing agent and toughening agent. The molecular structure of each component is bonded in the form of irre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/08C08G59/50
CPCC08G59/504C09J11/08C09J163/00C08L81/04
Inventor 高文通韩冰全一武李承辉黄玉安赵辉蒋登超曹潇李书航陈轲余文龙徐阳梁红文
Owner NANJING INST OF TECH
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