A kind of high thermal conductivity composite material and its preparation and application

A composite material and high thermal conductivity technology, applied in heat exchange materials, modification through conduction heat transfer, cooling/ventilation/heating transformation, etc., can solve the problems of poor thermal conductivity, large interface thermal resistance, etc., and achieve good heat transfer Orientation alignment, lower interface thermal resistance, and high heat transfer efficiency
CN111117063BActive Publication Date: 2021-09-21SOUTH CHINA UNIV OF TECH
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SOUTH CHINA UNIV OF TECH
Publication Date
2021-09-21
Patent Text Reader

Abstract

The invention discloses a high thermal conductivity composite material and its preparation and application, belonging to the field of thermal conductivity composite materials. The invention mixes two-dimensional nanomaterials, liquid metal and cellulose nanofibers in water, then puts the mixed solution in an ultrasonic cell breaker, performs ultrasonic treatment on the mixed solution, and finally centrifuges and dries to obtain the thermally conductive filler. Subsequently, the obtained thermally conductive filler is dispersed in the polymer matrix to prepare a high thermally conductive composite material. The high thermal conductivity composite material of the present invention has good mechanical properties, excellent thermal conductivity and excellent flexibility, and has a wide range of applications in heat dissipation of electronic components, heat dissipation of printed electronics, and heat dissipation of 5G communication equipment.
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Description

technical field

[0001] The invention relates to the field of thermally conductive composite materials, in particular to a high thermally conductive composite material and its preparation and application. Background technique

[0002] With the development of modern electronic components, integration, miniaturization, and functionalization have become the development trend of advanced electronic components in the future. At the same time, this development trend also puts forward higher requirements for the heat dissipation generated by electronic components. The use of thermally conductive composite materials to dissipate heat from electronic components is currently the most commonly used and most effective method for electronic components. Therefore, in order to better adapt to the development trend of electronic components, it is necessary to develop composite materials with higher thermal conductivity.

[0003] At present, with the development of nanomaterials, especially...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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