23results about How to "Extended heat conduction path" patented technology

The invention relates to the technical field of circuit board preparation, and discloses a multilayer composite circuit board preparation method and a multilayer composite circuit board, and the method comprises the steps: mixing ceramic-based powder with nano metal particles, and carrying out sintering to form a heat-conducting microporous ceramic material with a continuous heat-conducting network and a microporous structure; a plurality of heat-conducting microporous ceramic materials are laminated and then pressed into a composite substrate through vacuum hot pressing, and through heat-conducting through holes are formed in the composite substrate; the composite substrates with the heat conduction through holes are stacked, a micropore layer used for heat conduction and shock absorption is arranged between every two adjacent composite substrates, and the stacked composite substrates and the micropore layers are subjected to vacuum hot pressing to form a multi-layer structure. According to the multi-layer composite circuit board preparation method and the multi-layer composite circuit board, through the continuous heat conduction network, the micropore structure and the micropore layer, the heat conduction performance is remarkably improved, thermal stress and mechanical stress are effectively released through the elastic characteristic of the micropore structure, and the overall stability of the multi-layer composite circuit board is enhanced.

The utility model provides a battery and a power utilization device, and relates to the technical field of batteries, the battery comprises: a housing assembly, which comprises a housing and a cover plate, one end of the housing along the axial direction is provided with an opening, and the cover plate seals the opening; the electrode assembly is arranged in the inner cavity of the shell, and a tab is arranged at one end, facing the cover plate, of the electrode assembly; wherein the tab is electrically connected with the cover plate, a first heat conduction structure and a second heat conduction structure are arranged between the tab and the cover plate, and the first heat conduction structure and the second heat conduction structure are arranged at intervals in the radial direction of the cover plate; the first heat conduction structure and the second heat conduction structure transmit heat generated on the electrode assembly to the cover plate. According to the battery disclosed by the utility model, at least two heat conduction structures are arranged between the cover plate and the electrode assembly, so that a heat conduction path is increased, and the heat dissipation efficiency of the battery can be improved.

The utility model relates to the field of heat dissipation equipment, in particular to a heat exchange plate and a phase-change high-power water-cooling VC structural member thereof, the phase-change high-power water-cooling VC structural member comprises a water-cooling module and a VC module, the water-cooling module comprises a water-cooling upper cover and a heat exchange plate, the water-cooling upper cover covers the heat exchange plate, a condensation cavity is formed between the water-cooling upper cover and the heat exchange plate, and the VC module is arranged in the condensation cavity. The water-cooling upper cover is connected with a liquid inlet and outlet connector, and the bottom face of the heat exchange plate is connected with the VC module. The heat exchange plate comprises a heat exchange bottom plate, a heat dissipation column module is arranged on the surface of the heat exchange bottom plate, the heat dissipation column module comprises a plurality of heat dissipation columns, and the heat dissipation columns are arranged in an inclined array mode. The design of the heat dissipation column modules arranged in an inclined array mode is adopted, and the heat dissipation efficiency is remarkably improved. And by reducing the flow resistance, the subsequent heat dissipation water flow can be more quickly and uniformly dissipated into the corresponding heat dissipation cavity, and the problem of local overheating is effectively avoided.

The application discloses a preparation method of anisotropic glass fiber aerogel, which comprises the following steps: preparing a glass fiber dispersion solution; preparing an aluminum dihydrogen phosphate solution; preparing a polyvinyl alcohol solution; uniformly mixing the three solutions, pouring into a customized mold, freezing until complete solidification, and then performing freeze drying to obtain the glass fiber aerogel. Due to the influence of multiple temperature gradients on the aerogel, ice crystals grow vertically along the temperature gradient to form lamellas, and different cold surfaces interact to cause them to grow along the radial plane to the center of the square mold, finally forming an array radiation structure composed of four cones. The glass fiber aerogel prepared through the synergistic cooperation of the freeze casting technology and the aluminum dihydrogen phosphate has anisotropy and highly ordered lamellas, and therefore exhibits good low thermal conductivity.

The utility model relates to the technical field of heating plate, especially infrared heating plate with detachable lamp pearl, it includes: the heat dissipation base plate and a plurality of lamp pearl module, the heat dissipation base plate inside is embedded with the power bus, and the corresponding lamp pearl module is opened with a plurality of installation stations for installing lamp pearl module, every installation station all is provided with the connecting terminal, and every connecting terminal all is electrically connected with the power bus, lamp pearl module includes module shell, infrared luminophore and connecting interface, infrared luminophore installs in module shell inside, and connecting interface sets up in module shell back and is matched with the connecting terminal in installation station, detachable locking assembly is set up in module shell and is used for with lamp pearl module detachable fixed connection in installation station, makes module shell and the installation surface in installation station tight contact simultaneously. The present application has can solve the problem of lamp pearl quick replacement and maintenance, and improve the effect of heat dissipation and heat uniformity.

The utility model discloses an optical fiber exchange box heat radiation structure with air cooling diversion, which relates to the technical field of optical fiber communication box cooling, and comprises a heat radiation air cooling diversion assembly and a heat radiation fan which are arranged at one end of an optical fiber exchange box body, and the upper edge of the optical fiber exchange box body is provided with a plurality of fixing assemblies; the heat dissipation air-cooling diversion assembly comprises a plurality of heat dissipation fins and a plurality of diversion air-cooling plates, the end faces of the heat dissipation fins are of U-shaped structures, the plurality of heat dissipation fins are fixedly connected to one end of the optical fiber exchange box body, and the plurality of diversion air-cooling plates are symmetrically distributed between the output end of the heat dissipation fan and the plurality of heat dissipation fins; in the technical scheme provided by the utility model, through the synergistic effect of the U-shaped radiating fins and the flow guide air cooling plate, the surface area is increased, and the heat conduction path is optimized; the flow guide air cooling plates are symmetrically distributed between the cooling fan and the cooling fins, airflow disturbance is enhanced through surface through holes, and the heat exchange efficiency is improved.

The present invention proposes a low-temperature composite insulation layer, a preparation method thereof, and an application in a vehicle-mounted low-temperature hydrogen storage tank. The composite insulation layer includes a hollow microsphere layer and a multi-layer insulation layer; the hollow microsphere layer includes a support body and a hollow microsphere powder; the hollow microsphere powder is filled inside the support body to form a hollow microsphere layer; the multi-layer insulation layer includes at least one of a uniform density multi-layer insulation material layer, a variable density multi-layer insulation material layer, a uniform density integrated insulation film, and a variable density integrated insulation film. The composite insulation layer is a composite of a hollow microsphere layer and a multi-layer insulation layer, giving full play to the advantages of the two insulation layers. In a high vacuum, the point-contact hollow microspheres can extend the solid heat conduction path and minimize solid heat transfer. The multi-layer insulation layer can effectively block radiation heat transfer. The two are combined to form a composite insulation layer, which has better insulation performance.

The utility model relates to an electric cooker NTC and double fuse internal and external split type connection structure, which relates to the technical field of electronic component connection, and comprises an outer shell and an inner slide block, and the outer shell and the inner slide block are provided with the same connection mechanism; the connecting mechanism comprises a connecting part A and a connecting part B which are used for connecting the outer shell and the inner sliding block. According to the internal and external split type connecting structure of the NTC and the double fuses of the electric cooker, a connecting mechanism on the outer shell and the inner sliding block comprises a limiting block, an arc-shaped groove, a semi-ring groove, a ring piece and the like, enough creepage distance is provided, the phenomenon of electric leakage can be effectively prevented even in a high-humidity or polluted environment, and the service life of the electric cooker is prolonged. The insulation performance of the whole circuit system is improved, so that the insulation performance of the whole circuit is improved, stricter UL safety specification requirements can be met, and the problems of poor insulation performance and insufficient creepage distance of some left-right split structures in the market are solved.

The application relates to the technical field of heating equipment, and particularly discloses a thick-film heating assembly and a vehicle heater. The thick-film heating assembly comprises a heating core body, the heating core body has a first surface, a first side surface and a second side surface, the first side surface and the second side surface are connected to the two sides of the first surface, a plurality of flow channels are formed in the heating core body, the plurality of flow channels are arranged at intervals along a first direction, and the flow channels penetrate through the first side surface and the second side surface; a heating film is arranged on the first surface; a water inlet pipe is connected to the first side surface and communicates with the plurality of flow channels, and a water inlet cavity is formed in the water inlet pipe; a water outlet pipe is connected to the second side surface and communicates with the plurality of flow channels; and the minimum cross-sectional area of the water inlet cavity along a radial direction is greater than the maximum cross-sectional area of each flow channel along the first direction.

The invention relates to the technical field of electric welding machine control systems, and provides an efficient system based on a silicon carbide enhanced electric welding machine, which comprises a silicon carbide energy efficiency terminal, a silicon carbide thermal control terminal and an intelligent welding control terminal, the silicon carbide energy efficiency terminal is used for managing input, conversion and output of current and voltage, and a silicon carbide material is used for providing high-frequency current according to the welding requirement of the electric welding machine. The silicon carbide thermal control terminal is used for optimizing the heat dissipation performance of the system through a silicon carbide material and implementing temperature management; and the intelligent welding control terminal is used for regulating and controlling the welding current and voltage and managing the welding process. The silicon carbide enhanced electric welding machine has the effect of improving the working efficiency of the silicon carbide enhanced electric welding machine.

The utility model provides a kind of armoured tungsten-rhenium thermocouple, belong to temperature measurement technical field, this armoured tungsten-rhenium thermocouple, including armoured protection pipe, the tungsten-rhenium electrode being arranged in armoured protection pipe inside, insulation material being filled between armoured protection pipe and tungsten-rhenium electrode, terminal box and sealing assembly being arranged in armoured protection pipe one end, pass through double sealing structure, construct full-closed protection system, can effectively resist the invasion of high-temperature molten gas in metallurgical furnace, strong corrosive medium in chemical reaction kettle, make tungsten-rhenium electrode and alumina ceramic insulation layer exempt from corrosion, compared with traditional thermocouple service life improves 2-3 times.Simultaneously, spring-like elastic support piece and ceramic powder insulation layer form double anti-vibration structure.

The present invention relates to the field of printing technology, and in particular to a structural part with insulation and heat dissipation and its printing process, comprising a substrate layer, a graphite layer and a surface layer arranged in sequence from bottom to top, the substrate layer is made of PA, and the surface layer is made of PI material; the bottom layer is made of PA material, the middle layer is a graphite film, and the top layer is made of PI material; through the excellent insulation and puncture resistance of PA itself, when in contact with the device conductor, it can effectively play the role of insulation and puncture resistance. Relying on the efficient thermal conductivity of the graphite layer, the product has the heat dissipation effect of quickly diffusing a single point heat source. In addition, the thermal composite technology is used to tightly combine the substrate layer and the graphite layer, which not only ensures the integrity of the structure, but also simplifies the production process and improves production efficiency.

The invention belongs to the technical field of semiconductors, and discloses a metal substrate of a composite heat conduction material and a manufacturing process thereof, and the manufacturing process comprises the following steps: sequentially laminating a copper foil layer, an insulating layer and a metal heat dissipation substrate into a metal copper-clad plate in a thermocompression bonding manner, and forming a mounting hole in a high-heating area, corresponding to an electronic element, on the metal copper-clad plate, an adjustable heat dissipation assembly is manufactured; the adjustable heat dissipation assembly comprises a heat dissipation block and an adjustable heat dissipation connection structure. The adjustable heat dissipation assembly is mounted in the mounting hole of the metal copper-clad plate for tight connection; a space between the heat dissipation block and the electronic component base is filled with a heat dissipation medium with high heat conduction performance, and a layer of high heat conduction film is added between the heat dissipation block and the electronic component base; by means of the adjustable heat dissipation assembly, flexible adjustment is achieved according to the specific size and position of the electronic element, meanwhile, the heat conduction path is further optimized through the arrangement of the heat dissipation medium and the high-heat-conduction film, the heat dissipation performance of the metal substrate is improved, and stable operation of the high-power electronic element is ensured.

The utility model belongs to the technical field of plate processing, and discloses a numerical control modeling cutting saw and a plate, which comprises a rack, a lifting cutting gantry assembly used for cutting inner core materials of the plate, a reciprocating walking platform assembly used for carrying the inner core materials of the plate, and a numerical control table used for controlling the lifting cutting gantry assembly and the reciprocating walking platform to cooperatively work, the lifting cutting gantry assembly is fixedly connected to the rack, the reciprocating walking platform assembly is erected at the bottom of the lifting cutting gantry assembly, and the numerical control table is arranged on the side of the rack. According to the numerical control modeling cutting saw, complex curve cutting is achieved through servo control and a multi-axis linkage system; the plate adopts an S-shaped wave splicing structure, so that the contact area is increased, the compressive strength is improved, the heat conductivity coefficient is reduced, and the plate has high strength and excellent heat preservation performance.

The utility model discloses a high-efficiency heat dissipation sealing and stress dispersion structure of an underwater robot power system, which adopts an independent shaft sleeve to be connected with a motor shaft, realizes axial and angular fine adjustment space through a key groove design in clearance fit, and effectively reduces potential damage of vibration to a sealing structure. In terms of heat dissipation, the aluminum alloy motor support is adopted, the shape of the aluminum alloy motor support is matched with the outer wall of the motor and the inner wall of the movement shell, and a heat conduction path is optimized. And by filling the heat conduction material, the heat conduction efficiency of the motor is further improved, and the efficient heat dissipation of the machine core shell is ensured. The heat dissipation performance is improved, the influence of vibration on the transmission structure is reduced through the stress dispersion design, and therefore the service life of the underwater robot is prolonged.

The invention discloses a microcomputer assembling method, and relates to the technical field of computers, and the microcomputer assembling method comprises the following steps: assembling a mainboard and a connecting column into a whole; one end of the connecting column is fixed at a preset position so as to realize connection between the mainboard and the bottom shell; the top shell and the side shell are detachably connected to the top wall and the side wall of the microcomputer respectively; according to the scheme, the mainboard and the connecting column are assembled into a whole, so that the assembly process is simplified, and the complexity during assembly is reduced. One end of the connecting column is fixed at the preset position of the bottom shell, so that the stability of the mainboard is ensured, the structural rigidity of the whole microcomputer is improved, the mainboard is not easy to shift when subjected to external force, and the stability of the mainboard is improved; besides, the top shell and the side shell are arranged in a split mode and detachably connected to the top wall and the side wall of the microcomputer, so that a user can conveniently modify and design the shell structure around the microcomputer according to preferences, the user can conveniently disassemble and assemble the shell structure, and playability of the microcomputer is improved.

The utility model relates to an SOP32 plastic package structure, which comprises a slide island, a connecting rib and a plastic package body, a chip is arranged on the slide island, two bending sections are symmetrically arranged at the left end and the right end of the slide island, and when the slide island, outer pins, the chip and the connecting rib are placed in a mold to be filled with plastic package materials for plastic package, the plastic package body is plastically packaged on the outer sides of the slide island, the connecting rib and part of the outer pins. The connecting rib comprises a bending section and a stabilizing section, the stabilizing section is arranged at one end, far away from the slide island, of the bending section, the lower surface of the stabilizing section is of a wave-shaped structure extending along the length direction of the slide island when the plastic packaging material is filled and closed, and the plastic packaging material wraps the connecting rib along the wave-shaped stabilizing section, so that the contact area between the connecting rib and the plastic packaging body is increased; the bonding strength of the chip carrying island and the plastic package body is improved, and the service life of the chip plastic package body is prolonged.

The invention discloses a preparation method of a heat insulation layer for heat insulation of a display module lamp drive, a heat insulation PCB substrate and a heat insulation COB module, and belongs to the technical field of display module heat insulation. Gamma-aminopropyltriethoxysilane is used as a coupling agent, fumed silica is subjected to ultrasonic dispersion treatment in an ethanol solution of the gamma-aminopropyltriethoxysilane, the pretreated fumed silica is mixed with a binder and an additive according to a certain proportion to form a heat insulation material, and then a heat insulation layer is formed on the surface of a base plate; the heat insulation PCB substrate and the heat insulation COB module are provided with the heat insulation layer; by optimizing the preparation process of the heat insulation layer and the combination mode of the heat insulation layer and the display module, high-precision installation and a good sealing effect of the heat insulation layer are achieved, and the heat insulation effect is further enhanced.

The application discloses a heat preservation outer partition wall based on a heat reflection film and a layered cross-keel composite structure, which comprises a layered cross-keel framework, an outer decorative plate and an inner decorative plate; the layered cross-keel framework comprises n layers of keel units and n-1 layers of heat reflection films embedded between the keel units, and each layer of the keel units is provided with peripheral keels arranged along the periphery of the wall body. The heat preservation outer partition wall is characterized in that the layered cross-keel framework and the heat reflection film are combined to effectively block the heat transfer from the three aspects of conduction, convection and radiation; the arrangement mode of the cross-keel reduces the heat conduction area and prolongs the conduction path; the heat reflection films and the inner and outer decorative plates form closed air interlayer spaces, thereby blocking the air convection; the heat reflection film plays a certain hysteresis effect on the radiation heat transfer, thereby enhancing the heat preservation effect and playing a certain sound absorption effect; and the heat preservation outer partition wall is suitable for the field of outer walls.

The utility model discloses a kind of glass electric melting furnace composite heat preservation structures, including glass electric melting furnace main body, the glass electric melting furnace main body is sequentially arranged from inside to outside working layer, transition layer, heat insulation layer and outer protective layer composition;The working layer is made of electric melting zirconia corundum brick, the transition layer is made of light mullite brick, the heat insulation layer is made of microporous heat insulation plate and ceramic fiber module, the ceramic fiber module covers in microporous heat insulation plate outside, the outer protective layer is made of galvanized steel sheet, by galvanized steel sheet play to the effect of moisture-proof and corrosion-proof, the ceramic fiber module is fixed in the inner side of outer protective layer by stainless steel anchor, air passage is arranged between the outer protective layer and heat insulation layer.The utility model effectively reduces the temperature of glass electric melting furnace main body surface, and reduces heat loss, realizes the integrated effect of heat insulation, heat preservation and sealing.

This invention provides a high-efficiency heat dissipation power packaging structure with a pressure-resistant insulating film, belonging to the field of semiconductor technology. The high-efficiency heat dissipation power packaging structure with a pressure-resistant insulating film includes a thermally conductive carrier plate and a molding compound, with a chip disposed on the thermally conductive carrier plate. An insulating film formed by sputtering is disposed on the side of the thermally conductive carrier plate opposite to the chip, and the molding compound covers the periphery of the thermally conductive carrier plate. This structure can reduce the manufacturing difficulty of power components and improve the heat dissipation efficiency of power components by utilizing the sputtered insulating film; furthermore, the insulating film allows for a smaller and thinner overall packaging structure.

The invention relates to the technical field of solar cells, and particularly discloses a high-efficiency crystalline silicon solar cell with a composite back reflection structure and a preparation method thereof, and the high-efficiency crystalline silicon solar cell comprises a silicon substrate, and a passivation layer, a back reflection dielectric layer and a metal electrode which are sequentially formed on the back surface of the silicon substrate. Wherein the metal electrode is of a composite electrode structure and comprises a basic conductive grid line and a high-reflection covering layer. According to the invention, a base metal slurry printing and backflow or electroplating sputtering or evaporation step is added after the existing standard process, and the step is mature in process and universal in equipment. The base metal is cheap and non-toxic metal, the increased material cost is extremely low, but the brought optical, electrical and reliable benefits are remarkable, and the cost performance is high.

The utility model discloses a kind of semiconductor discrete devices, it is related to semiconductor discrete device technical field, including device substrate, buffer layer, device source, device drain, channel assembly, gate layer, ohmic electrode layer, electrode cap and pin assembly, device substrate adopts high-purity single crystal silicon, top epitaxial gallium nitride film, the high and low doping silicon carbide layer of combination channel assembly, heat generation is controlled from bottom layer, electrode cap adopts copper material, pin assembly is mechanically interlocked with electrode cap by fitting structure, cooperate installation slot opening heat-conducting material, connecting pin recess filling solder and air cavity design, shorten heat conduction path, strengthen heat conduction and radiation, the device is synergized through multilayer heat conduction path and multiple heat dissipation mode, effectively improve overall heat dissipation performance, avoid the problem such as the increase of on-resistance caused by excessively high temperature, reliability decline, ensure that device maintains good performance in work.