41results about How to "Extended heat conduction path" patented technology

The invention belongs to the technical field of polymer plastic materials, and particularly relates to a high-temperature-resistant anti-corrosion polytetrafluoroethylene material and a preparation method thereof. The polytetrafluoroethylene is prepared from the following raw materials in parts by weight: 50 to 60 parts of polytetrafluoroethylene, 5 to 10 parts of fluorinated modified graphene oxide, 3 to 5 parts of aluminum powder, 5 to 8 parts of modified silicon carbide fiber, 3 to 5 parts of silane modified nano silicon dioxide, 2 to 3 parts of polyphenylene sulfide, 2 to 3 parts of polyimide, 0.5 to 0.8 part of dispersing agent and 0.5 to 1 part of antioxidant. The heat conduction performance and the interface bonding force are improved through the fluorinated modified graphene oxide, the impact resistance and the wear resistance are enhanced through the silicon carbide fibers, and the corrosion resistance and the wear resistance are improved through the aluminum powder; silane modified silicon dioxide enhances the mechanical property of the composite material by improving the dispersity of the filler, and PPS and PI interact with the surface of the filler through polar groups in molecular chains, so that the interface strength is improved, and the toughness and the thermal stability are improved.

The invention provides a ceramic rigid-flex circuit substrate and a preparation method thereof, and the method comprises the specific steps: S1, cleaning a ceramic substrate, and arranging a brazing metal transition layer on the surface of the ceramic substrate; s2, low-melting-point brazing filler metal is sprayed to the surface of the brazing metal transition layer of the ceramic substrate, and a multi-layer flexible circuit board is attached to the surface, sprayed with the low-melting-point brazing filler metal, of the aluminum nitride ceramic substrate to obtain an attached plate; and S3, placing the laminated board in a vacuum or protective atmosphere for welding to obtain the ceramic rigid-flex circuit substrate. The ceramic substrate is adopted, the brazing metal transition layer is introduced to the surface of the ceramic substrate, the welding process of the flexible circuit board and the ceramic substrate is optimized, the problems that heat conduction is difficult, interface thermal resistance is large and uneven or bonding strength is insufficient are effectively solved, and the overall performance and quality of a product are improved.

The invention relates to the technical field of circuit board preparation, and discloses a multilayer composite circuit board preparation method and a multilayer composite circuit board, and the method comprises the steps: mixing ceramic-based powder with nano metal particles, and carrying out sintering to form a heat-conducting microporous ceramic material with a continuous heat-conducting network and a microporous structure; a plurality of heat-conducting microporous ceramic materials are laminated and then pressed into a composite substrate through vacuum hot pressing, and through heat-conducting through holes are formed in the composite substrate; the composite substrates with the heat conduction through holes are stacked, a micropore layer used for heat conduction and shock absorption is arranged between every two adjacent composite substrates, and the stacked composite substrates and the micropore layers are subjected to vacuum hot pressing to form a multi-layer structure. According to the multi-layer composite circuit board preparation method and the multi-layer composite circuit board, through the continuous heat conduction network, the micropore structure and the micropore layer, the heat conduction performance is remarkably improved, thermal stress and mechanical stress are effectively released through the elastic characteristic of the micropore structure, and the overall stability of the multi-layer composite circuit board is enhanced.

The utility model provides a battery and a power utilization device, and relates to the technical field of batteries, the battery comprises: a housing assembly, which comprises a housing and a cover plate, one end of the housing along the axial direction is provided with an opening, and the cover plate seals the opening; the electrode assembly is arranged in the inner cavity of the shell, and a tab is arranged at one end, facing the cover plate, of the electrode assembly; wherein the tab is electrically connected with the cover plate, a first heat conduction structure and a second heat conduction structure are arranged between the tab and the cover plate, and the first heat conduction structure and the second heat conduction structure are arranged at intervals in the radial direction of the cover plate; the first heat conduction structure and the second heat conduction structure transmit heat generated on the electrode assembly to the cover plate. According to the battery disclosed by the utility model, at least two heat conduction structures are arranged between the cover plate and the electrode assembly, so that a heat conduction path is increased, and the heat dissipation efficiency of the battery can be improved.

The invention relates to the technical field of printing, in particular to a structural member with insulation and heat dissipation functions and a printing process thereof.The structural member comprises a base material layer, a graphite layer and a surface layer which are sequentially arranged from bottom to top, the base material layer is made of PA, and the surface layer is made of PI materials; the lowermost layer is made of a PA material, the middle layer is a graphite film, and the uppermost layer is made of a PI material; due to the excellent insulating and puncture-resistant performance of PA, when PA is in contact with a device conductor, the insulating and puncture-resistant functions can be effectively achieved. By means of the efficient heat conductivity coefficient of the graphite layer, the product has the heat dissipation effect of rapidly diffusing a single-point heat source. And the base material layer and the graphite layer are tightly combined by adopting a thermal compounding technology, so that the integrity of the structure is ensured, the production process is simplified, and the production efficiency is improved.

The invention relates to the technical field of heat conduction and heat dissipation materials, and particularly discloses an efficient heat dissipation graphite material for LED large-screen display and a preparation method of the efficient heat dissipation graphite material. The efficient heat dissipation graphite material for LED large screen display comprises a graphene layer and a thin film coating, and the graphene layer comprises the following raw materials: 50-60 parts of graphite powder, 1-2 parts of nano silver, 25-30 parts of modified nano carbon fibers, 10-15 parts of modified sodium alginate, 3-6 parts of sodium carboxymethyl cellulose, 5-8 parts of a heat conduction agent and 3-5 parts of a plasticizer. The graphite material prepared by the invention has relatively good mechanical properties, heat dissipation performance and corrosion resistance, can meet high requirements of LED large screen display on heat dissipation performance, is widely applied to a heat dissipation system of LED large screen display, effectively reduces the temperature of an LED large screen, improves the display effect and prolongs the service life.

The invention discloses a three-terminal fuse and a preparation method, the three-terminal fuse comprises a substrate and a shell, a certain space is formed between the substrate and the shell, and an electrode, a heating body layer, an insulating medium layer, a surface electrode, an alloy melt and a cosolvent layer are arranged in the space; the electrodes comprise a first electrode, a second electrode, a third electrode and a fourth electrode which are not in contact with one another, the first electrode, the second electrode and the third electrode extend from the first end face of the substrate to the second end face of the substrate, and the fourth electrode is only located on the first end face; two sides of the heating body layer are respectively connected with the third electrode and the fourth electrode; the insulating medium layer is formed on the heating body layer by an aluminum nitride material in a magnetron sputtering manner; the surface electrode is formed on the insulating dielectric layer by a metal material in a magnetron sputtering manner, and one side of the surface electrode is connected with the fourth electrode; the alloy melt is arranged on the surface electrode; and the cosolvent layer is arranged on the alloy melt. The three-terminal fuse provided by the invention can realize the functions of overcharge voltage protection and overcurrent protection.

The preparation method comprises the following specific steps: firstly, loading carbon nanoparticles and SiO2 nanoparticles on the surface of BNNS to obtain 1-BNNS / C / SiO2, then preparing a porous hollow SiO2 coated BNNS / C composite material (2-BNNS / C / SiO2), and mixing double-structure BNNS / C / SiO2 as a polyurethane filler to obtain the wave-absorbing and heat-conducting super-hydrophobic anticorrosive coating. The coating consists of a polyurethane matrix and two BNNS / C / SiO2 composite materials with different structures, and the structure of the 1-BNNS / C / SiO2 composite material is as follows: carbon nanoparticles are uniformly loaded on the surface of BNNS, and then SiO2 microspheres are uniformly grown on the surface of the BNNS; the structure of the 2-BNNS / C / SiO2 composite material is as follows: BNNS uniformly loaded with carbon nanoparticles is wrapped by porous and mesoporous SiO2 microspheres. According to the prepared wave-absorbing and heat-conducting type super-hydrophobic anticorrosive coating, the tight attachment of the carbon nanoparticles and the SiO2 nanoparticles on the surface of the BNNS is fully utilized, and an efficient conductive network and a heat conduction path are constructed. And the BNNS and the porous SiO2 microspheres can optimize impedance and enhance wave absorption.

The utility model relates to the field of heat dissipation equipment, in particular to a heat exchange plate and a phase-change high-power water-cooling VC structural member thereof, the phase-change high-power water-cooling VC structural member comprises a water-cooling module and a VC module, the water-cooling module comprises a water-cooling upper cover and a heat exchange plate, the water-cooling upper cover covers the heat exchange plate, a condensation cavity is formed between the water-cooling upper cover and the heat exchange plate, and the VC module is arranged in the condensation cavity. The water-cooling upper cover is connected with a liquid inlet and outlet connector, and the bottom face of the heat exchange plate is connected with the VC module. The heat exchange plate comprises a heat exchange bottom plate, a heat dissipation column module is arranged on the surface of the heat exchange bottom plate, the heat dissipation column module comprises a plurality of heat dissipation columns, and the heat dissipation columns are arranged in an inclined array mode. The design of the heat dissipation column modules arranged in an inclined array mode is adopted, and the heat dissipation efficiency is remarkably improved. And by reducing the flow resistance, the subsequent heat dissipation water flow can be more quickly and uniformly dissipated into the corresponding heat dissipation cavity, and the problem of local overheating is effectively avoided.

The application discloses a preparation method of anisotropic glass fiber aerogel, which comprises the following steps: preparing a glass fiber dispersion solution; preparing an aluminum dihydrogen phosphate solution; preparing a polyvinyl alcohol solution; uniformly mixing the three solutions, pouring into a customized mold, freezing until complete solidification, and then performing freeze drying to obtain the glass fiber aerogel. Due to the influence of multiple temperature gradients on the aerogel, ice crystals grow vertically along the temperature gradient to form lamellas, and different cold surfaces interact to cause them to grow along the radial plane to the center of the square mold, finally forming an array radiation structure composed of four cones. The glass fiber aerogel prepared through the synergistic cooperation of the freeze casting technology and the aluminum dihydrogen phosphate has anisotropy and highly ordered lamellas, and therefore exhibits good low thermal conductivity.

The utility model relates to the technical field of heating plate, especially infrared heating plate with detachable lamp pearl, it includes: the heat dissipation base plate and a plurality of lamp pearl module, the heat dissipation base plate inside is embedded with the power bus, and the corresponding lamp pearl module is opened with a plurality of installation stations for installing lamp pearl module, every installation station all is provided with the connecting terminal, and every connecting terminal all is electrically connected with the power bus, lamp pearl module includes module shell, infrared luminophore and connecting interface, infrared luminophore installs in module shell inside, and connecting interface sets up in module shell back and is matched with the connecting terminal in installation station, detachable locking assembly is set up in module shell and is used for with lamp pearl module detachable fixed connection in installation station, makes module shell and the installation surface in installation station tight contact simultaneously. The present application has can solve the problem of lamp pearl quick replacement and maintenance, and improve the effect of heat dissipation and heat uniformity.

The utility model discloses an optical fiber exchange box heat radiation structure with air cooling diversion, which relates to the technical field of optical fiber communication box cooling, and comprises a heat radiation air cooling diversion assembly and a heat radiation fan which are arranged at one end of an optical fiber exchange box body, and the upper edge of the optical fiber exchange box body is provided with a plurality of fixing assemblies; the heat dissipation air-cooling diversion assembly comprises a plurality of heat dissipation fins and a plurality of diversion air-cooling plates, the end faces of the heat dissipation fins are of U-shaped structures, the plurality of heat dissipation fins are fixedly connected to one end of the optical fiber exchange box body, and the plurality of diversion air-cooling plates are symmetrically distributed between the output end of the heat dissipation fan and the plurality of heat dissipation fins; in the technical scheme provided by the utility model, through the synergistic effect of the U-shaped radiating fins and the flow guide air cooling plate, the surface area is increased, and the heat conduction path is optimized; the flow guide air cooling plates are symmetrically distributed between the cooling fan and the cooling fins, airflow disturbance is enhanced through surface through holes, and the heat exchange efficiency is improved.

The present invention proposes a low-temperature composite insulation layer, a preparation method thereof, and an application in a vehicle-mounted low-temperature hydrogen storage tank. The composite insulation layer includes a hollow microsphere layer and a multi-layer insulation layer; the hollow microsphere layer includes a support body and a hollow microsphere powder; the hollow microsphere powder is filled inside the support body to form a hollow microsphere layer; the multi-layer insulation layer includes at least one of a uniform density multi-layer insulation material layer, a variable density multi-layer insulation material layer, a uniform density integrated insulation film, and a variable density integrated insulation film. The composite insulation layer is a composite of a hollow microsphere layer and a multi-layer insulation layer, giving full play to the advantages of the two insulation layers. In a high vacuum, the point-contact hollow microspheres can extend the solid heat conduction path and minimize solid heat transfer. The multi-layer insulation layer can effectively block radiation heat transfer. The two are combined to form a composite insulation layer, which has better insulation performance.

The utility model provides a urea sensor with a urea solution heating structure and a urea box assembly, the urea sensor with the urea solution heating structure comprises a heating main body and a detection device, and a first urea solution filling channel communicated with the outside is arranged in the heating main body along the axial direction of the heating main body; the detection device is arranged on the heating main body in a penetrating mode and faces the first urea solution filling channel, a fluid channel which is bent and extends back and forth is further formed in the heating main body in the axial direction of the heating main body, and the fluid channel is arranged around the first urea solution filling channel and the detection device in the circumferential direction of the heating main body; a cooling liquid inlet and a cooling liquid outlet are formed in the outer side of the heating body, the cooling liquid inlet is communicated with one end of the fluid channel, and the cooling liquid outlet is communicated with the other end of the fluid channel. The urea sensor with the urea solution heating structure has the advantage of being high in urea solution heating and unfreezing efficiency, and meanwhile it is guaranteed that an SCR system operates rapidly and effectively.

The utility model relates to an electric cooker NTC and double fuse internal and external split type connection structure, which relates to the technical field of electronic component connection, and comprises an outer shell and an inner slide block, and the outer shell and the inner slide block are provided with the same connection mechanism; the connecting mechanism comprises a connecting part A and a connecting part B which are used for connecting the outer shell and the inner sliding block. According to the internal and external split type connecting structure of the NTC and the double fuses of the electric cooker, a connecting mechanism on the outer shell and the inner sliding block comprises a limiting block, an arc-shaped groove, a semi-ring groove, a ring piece and the like, enough creepage distance is provided, the phenomenon of electric leakage can be effectively prevented even in a high-humidity or polluted environment, and the service life of the electric cooker is prolonged. The insulation performance of the whole circuit system is improved, so that the insulation performance of the whole circuit is improved, stricter UL safety specification requirements can be met, and the problems of poor insulation performance and insufficient creepage distance of some left-right split structures in the market are solved.

The application relates to the technical field of heating equipment, and particularly discloses a thick-film heating assembly and a vehicle heater. The thick-film heating assembly comprises a heating core body, the heating core body has a first surface, a first side surface and a second side surface, the first side surface and the second side surface are connected to the two sides of the first surface, a plurality of flow channels are formed in the heating core body, the plurality of flow channels are arranged at intervals along a first direction, and the flow channels penetrate through the first side surface and the second side surface; a heating film is arranged on the first surface; a water inlet pipe is connected to the first side surface and communicates with the plurality of flow channels, and a water inlet cavity is formed in the water inlet pipe; a water outlet pipe is connected to the second side surface and communicates with the plurality of flow channels; and the minimum cross-sectional area of the water inlet cavity along a radial direction is greater than the maximum cross-sectional area of each flow channel along the first direction.

The invention relates to the technical field of electric welding machine control systems, and provides an efficient system based on a silicon carbide enhanced electric welding machine, which comprises a silicon carbide energy efficiency terminal, a silicon carbide thermal control terminal and an intelligent welding control terminal, the silicon carbide energy efficiency terminal is used for managing input, conversion and output of current and voltage, and a silicon carbide material is used for providing high-frequency current according to the welding requirement of the electric welding machine. The silicon carbide thermal control terminal is used for optimizing the heat dissipation performance of the system through a silicon carbide material and implementing temperature management; and the intelligent welding control terminal is used for regulating and controlling the welding current and voltage and managing the welding process. The silicon carbide enhanced electric welding machine has the effect of improving the working efficiency of the silicon carbide enhanced electric welding machine.

The utility model provides a kind of armoured tungsten-rhenium thermocouple, belong to temperature measurement technical field, this armoured tungsten-rhenium thermocouple, including armoured protection pipe, the tungsten-rhenium electrode being arranged in armoured protection pipe inside, insulation material being filled between armoured protection pipe and tungsten-rhenium electrode, terminal box and sealing assembly being arranged in armoured protection pipe one end, pass through double sealing structure, construct full-closed protection system, can effectively resist the invasion of high-temperature molten gas in metallurgical furnace, strong corrosive medium in chemical reaction kettle, make tungsten-rhenium electrode and alumina ceramic insulation layer exempt from corrosion, compared with traditional thermocouple service life improves 2-3 times.Simultaneously, spring-like elastic support piece and ceramic powder insulation layer form double anti-vibration structure.

The present invention discloses a silicon carbide single crystal growth device, comprising a working chamber, a lifting connecting rod passing through the working chamber, a first driving mechanism for driving the lifting of the connecting rod, a crucible arranged in the working chamber, and a heating mechanism for heating the crucible; the crucible comprises a crucible cover fixed to the bottom of the connecting rod, and a crucible body detachably connected to the bottom of the crucible cover; the connecting rod comprises a rod body, a first channel provided on the rod body for passing in and out a refrigerant, and a second channel provided on the rod body for passing in a process gas; the first channel and the second channel are separated from each other, and the second channel is connected to the working chamber; the connecting rod is used to cool the crucible cover by means of a refrigerant and / or a process gas; and the working chamber also comprises an air outlet. The present invention provides a silicon carbide single crystal growth device, which optimizes the heat conduction path, so that heat is transmitted only through the crucible cover, and it is easier to achieve the temperature field requirement of high at the bottom and low at the top, thereby improving the growth quality of the silicon carbide single crystal.

The present invention relates to the field of printing technology, and in particular to a structural part with insulation and heat dissipation and its printing process, comprising a substrate layer, a graphite layer and a surface layer arranged in sequence from bottom to top, the substrate layer is made of PA, and the surface layer is made of PI material; the bottom layer is made of PA material, the middle layer is a graphite film, and the top layer is made of PI material; through the excellent insulation and puncture resistance of PA itself, when in contact with the device conductor, it can effectively play the role of insulation and puncture resistance. Relying on the efficient thermal conductivity of the graphite layer, the product has the heat dissipation effect of quickly diffusing a single point heat source. In addition, the thermal composite technology is used to tightly combine the substrate layer and the graphite layer, which not only ensures the integrity of the structure, but also simplifies the production process and improves production efficiency.

The invention belongs to the technical field of semiconductors, and discloses a metal substrate of a composite heat conduction material and a manufacturing process thereof, and the manufacturing process comprises the following steps: sequentially laminating a copper foil layer, an insulating layer and a metal heat dissipation substrate into a metal copper-clad plate in a thermocompression bonding manner, and forming a mounting hole in a high-heating area, corresponding to an electronic element, on the metal copper-clad plate, an adjustable heat dissipation assembly is manufactured; the adjustable heat dissipation assembly comprises a heat dissipation block and an adjustable heat dissipation connection structure. The adjustable heat dissipation assembly is mounted in the mounting hole of the metal copper-clad plate for tight connection; a space between the heat dissipation block and the electronic component base is filled with a heat dissipation medium with high heat conduction performance, and a layer of high heat conduction film is added between the heat dissipation block and the electronic component base; by means of the adjustable heat dissipation assembly, flexible adjustment is achieved according to the specific size and position of the electronic element, meanwhile, the heat conduction path is further optimized through the arrangement of the heat dissipation medium and the high-heat-conduction film, the heat dissipation performance of the metal substrate is improved, and stable operation of the high-power electronic element is ensured.

The utility model belongs to the technical field of plate processing, and discloses a numerical control modeling cutting saw and a plate, which comprises a rack, a lifting cutting gantry assembly used for cutting inner core materials of the plate, a reciprocating walking platform assembly used for carrying the inner core materials of the plate, and a numerical control table used for controlling the lifting cutting gantry assembly and the reciprocating walking platform to cooperatively work, the lifting cutting gantry assembly is fixedly connected to the rack, the reciprocating walking platform assembly is erected at the bottom of the lifting cutting gantry assembly, and the numerical control table is arranged on the side of the rack. According to the numerical control modeling cutting saw, complex curve cutting is achieved through servo control and a multi-axis linkage system; the plate adopts an S-shaped wave splicing structure, so that the contact area is increased, the compressive strength is improved, the heat conductivity coefficient is reduced, and the plate has high strength and excellent heat preservation performance.

The utility model discloses a remote radiator with a T-shaped structure, which relates to the technical field of radiators, and comprises a body bottom plate and a remote end bottom plate, the top of the body bottom plate is symmetrically connected with a plurality of groups of remote end heat pipes A and a plurality of groups of remote end heat pipes B; body fins are connected to the top of the body bottom plate and located above one ends of the multiple sets of remote end heat pipes A and one ends of the multiple sets of remote end heat pipes B. Body U-shaped heat pipes are arranged in the two ends of each body fin, heat generated by a chip is conducted to the heat pipes through the body bottom plate, part of the heat is conducted to the body fins through the body U-shaped heat pipes, and the heat generated by the chip is conducted to the body fins through the body U-shaped heat pipes. Therefore, heat transfer in the vertical direction is formed. The remote heat pipe transmits a part of heat to the body fins and transmits a part of heat to the remote fins at the same time, in this way, transmission in the horizontal direction is formed, by increasing the distance between the radiator and a CPU, a heat conduction path is lengthened, the heat can be better distributed in surrounding air, and therefore the heat dissipation efficiency is improved.

The utility model discloses a high-efficiency heat dissipation sealing and stress dispersion structure of an underwater robot power system, which adopts an independent shaft sleeve to be connected with a motor shaft, realizes axial and angular fine adjustment space through a key groove design in clearance fit, and effectively reduces potential damage of vibration to a sealing structure. In terms of heat dissipation, the aluminum alloy motor support is adopted, the shape of the aluminum alloy motor support is matched with the outer wall of the motor and the inner wall of the movement shell, and a heat conduction path is optimized. And by filling the heat conduction material, the heat conduction efficiency of the motor is further improved, and the efficient heat dissipation of the machine core shell is ensured. The heat dissipation performance is improved, the influence of vibration on the transmission structure is reduced through the stress dispersion design, and therefore the service life of the underwater robot is prolonged.

The invention discloses a microcomputer assembling method, and relates to the technical field of computers, and the microcomputer assembling method comprises the following steps: assembling a mainboard and a connecting column into a whole; one end of the connecting column is fixed at a preset position so as to realize connection between the mainboard and the bottom shell; the top shell and the side shell are detachably connected to the top wall and the side wall of the microcomputer respectively; according to the scheme, the mainboard and the connecting column are assembled into a whole, so that the assembly process is simplified, and the complexity during assembly is reduced. One end of the connecting column is fixed at the preset position of the bottom shell, so that the stability of the mainboard is ensured, the structural rigidity of the whole microcomputer is improved, the mainboard is not easy to shift when subjected to external force, and the stability of the mainboard is improved; besides, the top shell and the side shell are arranged in a split mode and detachably connected to the top wall and the side wall of the microcomputer, so that a user can conveniently modify and design the shell structure around the microcomputer according to preferences, the user can conveniently disassemble and assemble the shell structure, and playability of the microcomputer is improved.

The utility model relates to an SOP32 plastic package structure, which comprises a slide island, a connecting rib and a plastic package body, a chip is arranged on the slide island, two bending sections are symmetrically arranged at the left end and the right end of the slide island, and when the slide island, outer pins, the chip and the connecting rib are placed in a mold to be filled with plastic package materials for plastic package, the plastic package body is plastically packaged on the outer sides of the slide island, the connecting rib and part of the outer pins. The connecting rib comprises a bending section and a stabilizing section, the stabilizing section is arranged at one end, far away from the slide island, of the bending section, the lower surface of the stabilizing section is of a wave-shaped structure extending along the length direction of the slide island when the plastic packaging material is filled and closed, and the plastic packaging material wraps the connecting rib along the wave-shaped stabilizing section, so that the contact area between the connecting rib and the plastic packaging body is increased; the bonding strength of the chip carrying island and the plastic package body is improved, and the service life of the chip plastic package body is prolonged.

The invention discloses a preparation method of a heat insulation layer for heat insulation of a display module lamp drive, a heat insulation PCB substrate and a heat insulation COB module, and belongs to the technical field of display module heat insulation. Gamma-aminopropyltriethoxysilane is used as a coupling agent, fumed silica is subjected to ultrasonic dispersion treatment in an ethanol solution of the gamma-aminopropyltriethoxysilane, the pretreated fumed silica is mixed with a binder and an additive according to a certain proportion to form a heat insulation material, and then a heat insulation layer is formed on the surface of a base plate; the heat insulation PCB substrate and the heat insulation COB module are provided with the heat insulation layer; by optimizing the preparation process of the heat insulation layer and the combination mode of the heat insulation layer and the display module, high-precision installation and a good sealing effect of the heat insulation layer are achieved, and the heat insulation effect is further enhanced.

The invention discloses a triangular step array based on a large-aperture annular cavity VCSEL and a preparation method, and belongs to the technical field of semiconductor laser. The structure sequentially comprises a p-surface electrode, a passivation layer, an ohmic contact layer, a p-DBR reflector, an oxidation limiting layer, an active region, an n-DBR reflector, a substrate and an n-surface electrode from top to bottom. A unit device in the vertical cavity surface emitting laser array adopts a large-aperture multi-ring-cavity structure, so that the problems of non-uniform carrier distribution, non-uniform beam intensity distribution and the like of the large-aperture unit device in the VCSEL array are solved; each unit device of the vertical cavity surface emitting laser array is expanded and arranged on the basis of an isosceles right triangle to form a large-aperture triangular step array, and the array far field is in Gaussian distribution.

The application discloses a heat preservation outer partition wall based on a heat reflection film and a layered cross-keel composite structure, which comprises a layered cross-keel framework, an outer decorative plate and an inner decorative plate; the layered cross-keel framework comprises n layers of keel units and n-1 layers of heat reflection films embedded between the keel units, and each layer of the keel units is provided with peripheral keels arranged along the periphery of the wall body. The heat preservation outer partition wall is characterized in that the layered cross-keel framework and the heat reflection film are combined to effectively block the heat transfer from the three aspects of conduction, convection and radiation; the arrangement mode of the cross-keel reduces the heat conduction area and prolongs the conduction path; the heat reflection films and the inner and outer decorative plates form closed air interlayer spaces, thereby blocking the air convection; the heat reflection film plays a certain hysteresis effect on the radiation heat transfer, thereby enhancing the heat preservation effect and playing a certain sound absorption effect; and the heat preservation outer partition wall is suitable for the field of outer walls.

The invention discloses bionic intestinal villus aerogel as well as a preparation method and application thereof. The aerogel comprises an aerogel skeleton with a layered structure, and a bionic villus structure is grafted on the layered structure; the invention relates to a carbon-based composite material which comprises the following components in parts by mass: 1-1.5 parts of a carbon source, 1.5-2.5 parts of a cross-linking agent, 0.2-0.5 part of a catalyst and 0.5-1 part of a phytic acid-polyethyleneimine ligand. The preparation method comprises the following steps: adjusting a polyethyleneimine ligand aqueous solution to be acidic, adding a phytic acid aqueous solution, stirring to generate white precipitate, washing and freeze-drying to obtain a ligand, and grinding to obtain powder; the preparation method comprises the following steps: dissolving a carbon source, sequentially adding a cross-linking agent and a catalyst, stirring to form a gel precursor, adding ligand powder, stirring, and directionally freeze-drying to obtain the composite material. The bio-based electrolyte ligand is grafted into an aerogel system with a layered structure through an in-situ polymerization method to construct the bionic intestinal villus type composite aerogel, so that the flame-retardant and heat-insulating properties are enhanced, and meanwhile, the antibacterial property is remarkably improved.