High-strength cracking-resistant liquid pouring sealant and preparation method thereof

A high-strength, potting glue technology, used in adhesives, epoxy resin glue, polymer adhesive additives, etc., can solve problems such as easy cracking, high stress of epoxy cured products, and body cracking.

Pending Publication Date: 2020-06-05
SICHUAN DONGFANG INSULATING MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The present invention adopts high-molecular-weight thermoplastic resin to toughen and modify low-viscosity epoxy resin, in which a large number of hydroxyl groups can participate in the reaction of epoxy groups and form an interpenetrating network structure to provide good toughness and bonding performance, and low stress with high filling content Ball silicon, so as to solve the problems of high stress of epoxy cured products, body cracking under high and low temperature impact, and easy cracking of parts in contact with metal parts

Method used

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  • High-strength cracking-resistant liquid pouring sealant and preparation method thereof
  • High-strength cracking-resistant liquid pouring sealant and preparation method thereof
  • High-strength cracking-resistant liquid pouring sealant and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] Embodiment 1: the preparation of toughened epoxy resin

[0063] Implementation steps: weigh 92-95 parts of low-viscosity epoxy resin and add it to the reaction kettle, turn on electric heating and stirring, and when the temperature rises to 145°C, slowly add 5-8 parts of large molecular weight thermoplastic resin powder and dissolve Gradually add it in the way, keep the temperature and stir until the powder is completely dissolved, and then stir for 0.5h to obtain the toughened epoxy resin. The toughened epoxy resins of Examples 1-1 to 1-4 were obtained by repeating the above steps with different raw materials.

[0064] Wherein said low-viscosity epoxy resin is selected from phenyl glycidyl ether modified epoxy resin, cardanol glycidyl ether modified epoxy resin, butyl glycidyl ether modified epoxy resin or C12-C14 alkyl glycidol One or more of ether-modified epoxy resins.

[0065] Table 1: Composition ratio of toughened epoxy resin in Examples 1-1 to 1-4:

[0066] ...

Embodiment 2

[0068]Example 2: Preparation and Application of High-Strength Crack-resistant Epoxy Potting Adhesive

[0069] Implementation steps:

[0070] (1) Preparation of component A

[0071] Add 8-15 parts of toughened liquid epoxy resin, 10-12 parts of epoxy resin, 0.1-5 parts of epoxy reactive diluent, 0.01-1 part of defoamer and 0-1 part of dye into the reaction kettle in sequence, Turn on heating and stirring at a speed of 60-200rpm, keep the temperature of the material at 95-120°C and stir for 5-20min, then slowly add 0.5-5 parts of D50 0.2-1μm, D90 1.5-5μm low-stress small particle size spherical silicon micropowder and 9 ~14 parts of D50 1~3.5μm, D90 4~15μm aluminum hydroxide, turn on the high-speed stirring and shearing emulsification for 10~30min, the speed is 1000~3000rpm, and then add 39.5~75 parts of D50 18~28μm, D9055~75μm Low-stress spherical silicon micropowder with particle size and 0-5 parts of chopped reinforcing fiber with a diameter of 3-15 μm and a length of 0.1-2...

Embodiment 4

[0130] A high-strength cracking-resistant liquid potting glue, the high-strength cracking-resistant liquid potting glue is composed of 110 parts by weight of component A and 30 parts by weight of component B (when in use);

[0131] The A component consists of 15 parts by weight of toughened liquid epoxy resin, 12 parts by weight of epoxy resin, 5 parts by weight of epoxy reactive diluent, 1 part by weight of defoamer, 14 parts by weight of aluminum hydroxide, (low stress) 80 parts by weight of spherical silica powder and 5 parts by weight of reinforced chopped fibers are mixed;

[0132] The B component is composed of 25 parts by weight of an acid anhydride curing agent and 1 part by weight of an accelerator.

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Abstract

The invention discloses a high-strength cracking-resistant liquid pouring sealant and a preparation method thereof. The high-strength cracking-resistant liquid pouring sealant is prepared by mixing 70-110 parts by weight of a component A and 10-30 parts by weight of a component B, wherein the component A is formed by mixing toughened liquid epoxy resin, epoxy resin, an epoxy reactive diluent, a defoaming agent, aluminum hydroxide, spherical silica powder and reinforced chopped fibers; the component B is formed by mixing an anhydride curing agent and an accelerant; the preparation method comprises the following steps: preparing the toughened liquid epoxy resin, adding other materials, uniformly dispersing to prepare the component A, and directly and uniformly mixing the component B. The pouring sealant disclosed by the invention is moderate in viscosity and convenient to use, has the characteristics of high bonding strength, low thermal expansion coefficient, low stress, high strength,excellent insulativity, excellent high and low temperature impact resistance and the like after being heated and cured, and is suitable for insulating packaging of power electronic containers relatedto large steel, copper and other special metal materials.

Description

technical field [0001] The invention belongs to organic polymer materials and preparation thereof, and relates to a high-strength cracking-resistant liquid potting glue and a preparation method thereof. The high-strength cracking-resistant liquid potting glue of the present invention is an epoxy potting glue with high strength, low thermal expansion coefficient, and excellent high and low temperature impact resistance, and can be widely used in electronics, electricity, military industry, medical treatment, aviation, high-speed rail, etc. It is especially suitable for the insulation packaging of power electronic containers related to special metal materials such as large steel and copper. Background technique [0002] Epoxy potting glue is mainly used to strengthen the integrity of electronic components, increase the insulation between internal components and circuits, and improve the resistance to external shock and vibration, so as to achieve insulation protection, confide...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/08C09J11/04
CPCC08K2003/2227C08K2201/004C08K2201/005C08K2201/014C08L2203/206C08L2205/025C08L2205/03C09J11/04C09J11/08C09J163/00C08L63/00C08L101/06C08K13/06C08K7/18C08K3/22C08K7/14
Inventor 赵小红易强周友
Owner SICHUAN DONGFANG INSULATING MATERIAL
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