High-strength cracking-resistant liquid pouring sealant and preparation method thereof
A high-strength, potting glue technology, used in adhesives, epoxy resin glue, polymer adhesive additives, etc., can solve problems such as easy cracking, high stress of epoxy cured products, and body cracking.
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Embodiment 1
[0062] Embodiment 1: the preparation of toughened epoxy resin
[0063] Implementation steps: weigh 92-95 parts of low-viscosity epoxy resin and add it to the reaction kettle, turn on electric heating and stirring, and when the temperature rises to 145°C, slowly add 5-8 parts of large molecular weight thermoplastic resin powder and dissolve Gradually add it in the way, keep the temperature and stir until the powder is completely dissolved, and then stir for 0.5h to obtain the toughened epoxy resin. The toughened epoxy resins of Examples 1-1 to 1-4 were obtained by repeating the above steps with different raw materials.
[0064] Wherein said low-viscosity epoxy resin is selected from phenyl glycidyl ether modified epoxy resin, cardanol glycidyl ether modified epoxy resin, butyl glycidyl ether modified epoxy resin or C12-C14 alkyl glycidol One or more of ether-modified epoxy resins.
[0065] Table 1: Composition ratio of toughened epoxy resin in Examples 1-1 to 1-4:
[0066] ...
Embodiment 2
[0068]Example 2: Preparation and Application of High-Strength Crack-resistant Epoxy Potting Adhesive
[0069] Implementation steps:
[0070] (1) Preparation of component A
[0071] Add 8-15 parts of toughened liquid epoxy resin, 10-12 parts of epoxy resin, 0.1-5 parts of epoxy reactive diluent, 0.01-1 part of defoamer and 0-1 part of dye into the reaction kettle in sequence, Turn on heating and stirring at a speed of 60-200rpm, keep the temperature of the material at 95-120°C and stir for 5-20min, then slowly add 0.5-5 parts of D50 0.2-1μm, D90 1.5-5μm low-stress small particle size spherical silicon micropowder and 9 ~14 parts of D50 1~3.5μm, D90 4~15μm aluminum hydroxide, turn on the high-speed stirring and shearing emulsification for 10~30min, the speed is 1000~3000rpm, and then add 39.5~75 parts of D50 18~28μm, D9055~75μm Low-stress spherical silicon micropowder with particle size and 0-5 parts of chopped reinforcing fiber with a diameter of 3-15 μm and a length of 0.1-2...
Embodiment 4
[0130] A high-strength cracking-resistant liquid potting glue, the high-strength cracking-resistant liquid potting glue is composed of 110 parts by weight of component A and 30 parts by weight of component B (when in use);
[0131] The A component consists of 15 parts by weight of toughened liquid epoxy resin, 12 parts by weight of epoxy resin, 5 parts by weight of epoxy reactive diluent, 1 part by weight of defoamer, 14 parts by weight of aluminum hydroxide, (low stress) 80 parts by weight of spherical silica powder and 5 parts by weight of reinforced chopped fibers are mixed;
[0132] The B component is composed of 25 parts by weight of an acid anhydride curing agent and 1 part by weight of an accelerator.
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