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A modified thin film and method for depositing a transition layer containing Ti and titanium-doped diamond-like carbon on the surface of a substrate

A technology of surface deposition and transition layer, which is applied in the direction of plating, coating, and metal material coating process of superimposed layers to achieve the effect of improving the bonding force

Active Publication Date: 2022-03-29
INST OF OCEANOLOGY - CHINESE ACAD OF SCI
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  • Claims
  • Application Information

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Problems solved by technology

[0003] For the above-mentioned problems encountered in depositing a DLC film on a copper substrate, the object of the present invention is to provide a modified thin film and method for depositing a Ti-containing transition layer and a titanium-doped diamond-like carbon on the substrate surface

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  • A modified thin film and method for depositing a transition layer containing Ti and titanium-doped diamond-like carbon on the surface of a substrate
  • A modified thin film and method for depositing a transition layer containing Ti and titanium-doped diamond-like carbon on the surface of a substrate
  • A modified thin film and method for depositing a transition layer containing Ti and titanium-doped diamond-like carbon on the surface of a substrate

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Embodiment 1

[0031] A preparation method for depositing a Ti transition layer and a titanium-doped diamond-like carbon film on a copper substrate, the method steps are as follows:

[0032] (1) Cut industrial pure copper (thickness 2cm) into 10mm×10mm samples. Firstly, the sample is ground with 600#, 800#, 1000#, 2000# sandpaper step by step, and then the surface is polished to a mirror effect with W5, W3.5 diamond scrub.

[0033] (2) Using acetone, absolute ethanol, and deionized water to ultrasonically clean the above-mentioned polished copper substrate for 10 minutes in sequence;

[0034] (2) The copper substrate after cleaning is blown dry with nitrogen, and directly puts into a vacuum chamber;

[0035] (3) The vacuum is pumped to the substrate vacuum 3.0×10 -3 After Pa, feed argon gas with a flow rate of 20 sccm, turn on the microwave source, and when the power reaches 850W, add a negative bias voltage of 400V on the substrate table and feed cooling water, so that the argon ions, und...

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Abstract

The invention belongs to the field of material surface modification, in particular to a modification film and method for depositing a Ti-containing transition layer and titanium-doped diamond-like carbon on the surface of a substrate. A modified thin film containing Ti transition layer and titanium-doped diamond-like carbon was deposited on the surface of the substrate by combining plasma-enhanced unbalanced magnetron sputtering physical vapor deposition (PEUMS‑PVD) and plasma-enhanced chemical vapor deposition (PECVD). The modified film of the invention has a dense surface, good wear resistance and corrosion resistance, is especially suitable for marine atmospheric corrosion environments, and has a good protective effect on precision instruments, miniature radiators, etc. in the marine atmospheric environment.

Description

technical field [0001] The invention belongs to the field of material surface modification, in particular to a modification film and method for depositing a Ti-containing transition layer and titanium-doped diamond-like carbon on the surface of a substrate. Background technique [0002] Copper is a commonly used conductive and thermally conductive material, but it has disadvantages such as low strength, easy oxidation, easy wear, and poor corrosion resistance during application. Diamond-like carbon (DLC) films have many excellent properties, including high hardness, high wear resistance, low coefficient of friction, and excellent chemical inertness. Using the DLC film as the protective layer of the copper substrate can not only improve the surface hardness and chemical inertness of the copper substrate, but also not reduce the thermal conductivity of the substrate. However, it is very difficult to grow DLC film on copper substrate directly by chemical vapor deposition metho...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C28/00C23C14/02C23C14/06C23C14/35C23C16/26C23C16/50
CPCC23C28/322C23C28/343C23C14/35C23C14/0605C23C14/025C23C16/50C23C16/26
Inventor 王静王宁侯保荣戈成岳李红玲
Owner INST OF OCEANOLOGY - CHINESE ACAD OF SCI