A kind of rubber-less mica tape and preparation method thereof

Abstract

The invention discloses a glue-less mica tape, which strengthens the mica paper layer through non-alkali glass fiber cloth, and applies glue on the surface of the non-alkali glass fiber cloth, and passes through the intermediate position in the glue layer The aramid fiber is reinforced and toughened, and the surface of the adhesive layer is provided with parallel polyimide film strips, and then mica paper is arranged on the surface of the parallel polyimide film strips and heat-pressed, and after heat-pressed, the mica paper The surface is then sealed by nano-scale inorganic oxide particles and epoxy resin adhesive layer filled with hexagonal boron nitride. The present invention can significantly reduce the amount of glue used in the mica tape, which is controlled below 15%, and can effectively reduce the dielectric loss of the mica tape and increase the breakdown voltage while maintaining better physical strength and thermal stability. Therefore, the present invention Mica tape is suitable for the insulation structure of high voltage motors.

Description

technical field [0001] The invention relates to the field of insulating mica products, in particular to a rubber-less mica tape with better physical properties and a preparation method thereof. Background technique [0002] Mica tape is generally a composite material composed of mica paper, reinforcing material (glass cloth or film), and adhesive. It is widely used in the industry as insulating materials in cables and large-scale electromechanical equipment. It has high electrical strength and low dielectric loss. It has high electrical properties of surface resistance and volume resistance, and also has excellent properties such as high insulation, anti-corona, acid and alkali resistance, radiation resistance, chemical stability, high elasticity, high peelability, shear resistance and high tensile strength. Physical and chemical properties. [0003] However, with the integrated development of large motors, especially the increasing voltage level and stand-alone capacity of...

AI Technical Summary

Problems solved by technology

The key factors to improve the performance of the mica tape are to increase the mica quantification of the mica tape, reduce the glue content, and choose suitable fillers or modified resins. For the mainstream at home and abroad, the advanced VPI insulation system with less glue is used, and the main insulation material uses less Glued glass cloth reinforced mica tape and epoxy resin modified or ordinary linear polyester resin, the heat resistance grade can reach F grade, but the thermal conductivity is low, the bonding strength is not high enough, and the compatibility is poor. The mica tape has low mica weight, easy to drop powder, low breakdown voltage, high dielectric loss, and other electromechanical properties such as air permeability and heat resistance index are also unsatisfactory, which cannot meet the growing application needs of the industry.

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