A kind of low thermal conductivity thermal insulation material and preparation method thereof

Abstract

A heat insulating material with low thermal conductivity and a preparation method thereof, comprising the following raw materials in parts by mass: fumed white carbon black: 60-70 parts; ordinary white carbon black: 10-20 parts; silicon carbide: 10-15 parts; fiber : 5‑10 servings. This application uses fumed white carbon black and ordinary white carbon black for combined use, so that the characteristics of good thickening and difficult moisture absorption of fumed white carbon black can be brought into play, and at the same time, the characteristics of ordinary white carbon black with multiple hydroxyl groups can be played Composite better with fibers, but its low content can suppress the hygroscopic characteristics; while silicon carbide has radiation resistance and wear resistance, silicon carbide itself is used as an intermediate substance in heat insulation materials, and gas phase white carbon Black and ordinary silica and fiber are filled in it, so that it can have relatively high strength under the premise of ensuring low thermal conductivity.

Description

technical field [0001] The application relates to a heat insulating material with low thermal conductivity and a preparation method thereof. Background technique [0002] With the inevitable trend of energy saving and consumption reduction in the industrial field, the trend of using low thermal conductivity refractory products in industrial kilns and high temperature equipment is becoming more and more obvious. Traditional heat insulation refractory materials generally include ceramic fiberboard or calcium silicate Because its thermal insulation performance is difficult to meet the thermal insulation needs of places with strict requirements on thermal insulation space and thickness, that is, the coordination between thermal insulation thickness and thermal insulation capacity cannot be achieved, so nano-scale thermal insulation panels with ultra-low thermal conductivity came into being. pregnancy. The current molding process of nano heat insulation board materials is mostly...

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Problems solved by technology

[0002] With the inevitable trend of energy saving and consumption reduction in the industrial field, the trend of using low thermal conductivity refractory products in industrial kilns and high temperature equipment is becoming more and more obvious. Traditional heat insulation refractory materials generally include ceramic fiberboard or calcium silicate Because its thermal insulation performance is difficult to meet the thermal insulation needs of places with strict requirements on thermal insulation space and thickness, that is, the coordination between thermal insulation thickness and thermal insulation capacity cannot be achieved, so nano-scale thermal insulation panels with ultra-low thermal conductivity came into being. pregnancy

The current molding process of nano heat insulation board materials is mostly dry powder compression molding, but the products produced by it have low strength, large thickness deviation, and some will have the problem of delamination and falling off, and there are still high breakage rates during use. Inconvenient transportation and installation

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