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Photosensitive composite resin for photocuring 3D printing and preparation method thereof

A 3D printing and composite resin technology, applied in the direction of additive processing, etc., to achieve the effect of improving mechanical properties, improving interface bonding performance, and improving warpage

Active Publication Date: 2020-11-10
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to overcome the defects and deficiencies of existing photosensitive composite resins such as warpage, volume shrinkage and poor mechanical properties, and to provide a light-cured 3D Photosensitive composite resins for printing, by introducing hybrid monomers containing both free radical polymerizable functional groups and cationic polymerizable functional groups, to improve the problems of warping and volume shrinkage during curing, improve the mechanical properties of photosensitive composite resins, and Graft mercapto groups and disulfide bonds on the surface of the reinforcing material to improve the interface bonding performance between the reinforcing material and the substrate, and play a role in strengthening and toughening, effectively improving the mechanical properties of the photosensitive composite resin

Method used

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  • Photosensitive composite resin for photocuring 3D printing and preparation method thereof
  • Photosensitive composite resin for photocuring 3D printing and preparation method thereof
  • Photosensitive composite resin for photocuring 3D printing and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] A photosensitive composite resin for photocuring 3D printing, made of the following components calculated in parts by mass: 50 parts of polyurethane acrylate; 20 parts of bisphenol A epoxy resin; 15 parts of glycidyl methacrylate; benzoin 1 part of dimethyl ether; 3 parts of diphenyliodohexafluorophosphate; 0.5 part of disulfide bond-mercapto modified carbon fiber; 0.5 part of silicone-propylene oxide copolymer.

[0050] The preparation method of the photosensitive composite resin for photocuring 3D printing includes the following steps:

[0051] Dry and activate 100g of carbon oxide fiber at 110°C, then uniformly disperse the carbon oxide fiber in 500mL of absolute ethanol, then add 50g of silane coupling agent containing disulfide bonds, deionized water with 15% weight of silane coupling agent, concentrated Adjust the pH of the system to 2 with hydrochloric acid, stir and reflux at 65°C for 4 hours; then add 25g of mercapto-containing silane coupling agent, continue t...

Embodiment 2

[0054] A photosensitive composite resin for photocuring 3D printing, made of the following components calculated in parts by mass: 50 parts of polyurethane acrylate, 25 parts of bisphenol A epoxy resin, 15 parts of glycidyl methacrylate, 1 - 1 part of hydroxycyclohexyl phenone, 4 parts of diphenyl iodine hexafluorophosphate, 1 part of disulfide bond-mercapto modified carbon fiber prepared in Example 1, and 1 part of silicone-propylene oxide copolymer.

[0055] The preparation method of the above-mentioned photosensitive composite resin for photocuring 3D printing is the same as that of Example 1, except that the components are replaced.

Embodiment 3

[0057] A photosensitive composite resin for photocuring 3D printing, made of the following components calculated in parts by mass: 50 parts of polyurethane acrylate, 30 parts of bisphenol A epoxy resin, 15 parts of glycidyl methacrylate, benzoin 1 part of dimethyl ether, 1 part of 1-hydroxycyclohexyl benzophenone, 6 parts of diphenyl iodine hexafluorophosphate, 5 parts of disulfide bond-mercapto modified nano-titanium dioxide, and 1.5 parts of organosilicon-propylene oxide copolymer.

[0058] The preparation method of the above-mentioned photosensitive composite resin for photocuring 3D printing is the same as that of Example 1, except that carbon fibers are replaced with nano-titanium dioxide to obtain disulfide bond-mercapto-modified nano-titanium dioxide, and other components are replaced.

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Abstract

The invention discloses a photosensitive composite resin for photocuring 3D printing and a preparation method thereof, wherein the photosensitive composite resin is prepared from acrylate oligomer, epoxy resin, a hybrid monomer, a free radical photoinitiator, a cationic photoinitiator, a disulfide bond and sulfydryl modified reinforcing material and a leveling agent according to a certain proportion. The hybrid monomer is a monomer containing a functional group capable of being subjected to free radical polymerization and a functional group capable of being subjected to cationic polymerizationat the same time. The synergistic advantages of two photocuring modes are complemented through the same monomer, and the reinforcing material modified by disulfide bonds and sulfydryl is adopted, sothat the problems of warping and volume shrinkage in the curing process of the photosensitive composite resin are improved, the reinforcing and toughening effects are achieved, and the mechanical property of the photosensitive composite resin is improved. The photosensitive composite resin provided by the invention can be rapidly molded by virtue of a photocuring 3D printer and a three-dimensionaldevice is excellent in mechanical property; the preparation method is simple, the raw materials are easy to obtain, and the photosensitive composite resin is green, environment-friendly and easy to industrialize.

Description

technical field [0001] The invention relates to the technical field of functional polymer materials, and more particularly, to a photosensitive composite resin for photocuring 3D printing and a preparation method thereof. Background technique [0002] 3D printing is a rapid prototyping technology that manufactures three-dimensional devices by layer-by-layer printing based on digital model files, using adhesive materials such as powdered metal, plastic or liquid photosensitive resin. Photosensitive resin is an important material basis for the development of light-curing 3D printing technology. However, although the photosensitive resin used in light-curing 3D printing has high reactivity and fast molding speed, the printing device still has large curing shrinkage, easy warpage and deformation, and poor mechanical properties. And other issues. [0003] In order to solve the problems of poor mechanical strength of 3D printing devices, large curing shrinkage and easy warping de...

Claims

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Application Information

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IPC IPC(8): C08L63/10C08L75/14C08L71/00C08L67/06C08L63/00C08L63/02C08L1/08C08K9/06C08K7/06C08K3/36C08K3/22C08K3/26B33Y70/10
CPCC08L63/10C08L75/14C08L71/00C08L67/06C08L63/00B33Y70/10C08L2205/03C08K2201/011C08K2003/2241C08K2003/265C08L1/08C08K9/06C08K7/06C08K3/36C08K3/22C08K3/26
Inventor 向洪平陈彦羽林子谦叶娟
Owner GUANGDONG UNIV OF TECH
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