Fluorine-silicon double-block ultraviolet cured resin and preparation method thereof
A curing resin and double-block technology, which is applied in coatings, polyurea/polyurethane coatings, etc., can solve the problems of complete miscibility, poor high temperature resistance, phase separation instability, etc., and achieve no VOC emission problem, curing The effect of short time and high production efficiency
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Embodiment 1
[0042] Weigh 25.3g (0.05mol) of organosilicon intermediate (number average molecular weight M n =500) and 17.1g (0.05mol) of bisphenol AF in a reactor, heated up to 100°C, dried and removed water for 4h, and after cooling down to normal temperature, slowly added 34.1g (0.2mol) of hexamethylene Diisocyanate, the feeding time is 0.5h, the temperature is raised to 70°C, the heating time is 0.5h, the measured NCO value is 11%, the reaction is kept at 70°C for 4h, the NCO value drops to 5%, the temperature is lowered to 60°C, and 23.5g is added slowly (0.2mol) hydroxyethyl acrylate and 0.01g triethylamine, the feeding time is 0.5h, the temperature is raised to 80°C and the reaction is completed until the NCO value is 0.2%.
[0043] The above-mentioned prepared fluorine-silicon double-block UV-curable resin was tested for UV-curable performance. Take 10g of the resin, add 0.5g of cracking photoinitiator 1-hydroxycyclohexyl phenyl ketone, and evenly coat it on the corona-treated On ...
Embodiment 2
[0046] Take by weighing 55.3g (0.011mol) of organosilicon intermediate (number average molecular weight M n =5000) and 13.6g (0.033mol) of 1,4-bis(2-hydroxyhexafluoroisopropyl)benzene in a reaction kettle, heated up to 150°C, dried to remove water for 2h, and after cooling down to normal temperature, in a nitrogen atmosphere Slowly add 19.6g (0.088mol) isophorone diisocyanate under low temperature, the feeding time is 2h, the temperature is raised to 80°C, the heating time is 1h, the measured NCO value is 4.2%, and the heat preservation reaction is carried out at 80°C for 1h, and the NCO value drops to 2.1 %, cool down to 70°C, slowly add 11.5g (0.088mol) hydroxyethyl methacrylate and 0.2g triethylenediamine, the addition time is 0.5h, heat up to 100°C until the NCO value is 0.2%, and then react Finish.
[0047] Carry out UV curing performance test on the fluorosilicone diblock UV-curable resin prepared above, take 10g resin, add 0.1g cracking photoinitiator 2-hydroxy-2-methy...
Embodiment 3
[0050] Take by weighing 43.5g (0.022mol) of organosilicon intermediate (number average molecular weight M n =2000) and 17.8g (0.044mol) of 1,4-bis(2-hydroxyhexafluoroisopropyl)benzene in a reaction kettle, heated up to 130°C, dried for 2.5h, and cooled to room temperature, under nitrogen Slowly add 21.7g (0.132mol) of 1,4-cyclohexane diisocyanate under the atmosphere, the feeding time is 2h, the temperature is raised to 75°C, the heating time is 1h, the measured NCO value is 6.7%, and the reaction is kept at 75°C for 1h, and the NCO value decreased to 3.3%, lowered the temperature to 65°C, slowly added 17g (0.132mol) hydroxypropyl acrylate and 0.05g dibutyltin dilaurate, the addition time was 1h, raised the temperature to 90°C until the NCO value was 0.2%, and reacted Finish.
[0051] The above-mentioned fluorine-silicon double-block UV-curable resin was tested for UV-curable performance. Take 10g of the resin, add 0.1g of cracking photoinitiator 1-hydroxycyclohexyl phenyl ke...
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