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Glue solution for copper-clad plate applied to HDI multilayer plate as well as preparation method and application of glue solution

A technology for copper clad laminates and multilayer boards, which is applied in the field of glue for copper clad laminates and its preparation, which can solve the problems of unstable expansion and contraction of the inner layer sheet material, poor laser processing performance, and insufficient heat resistance, etc., to improve the transmission speed and integrity, reducing moisture absorption, and improving toughness

Inactive Publication Date: 2020-12-11
林州致远电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] HDI sheets are generally required to be halogen-free medium Tg materials. The previous materials had poor dimensional stability. After multiple pressings, the expansion and contraction of the inner layer sheet was unstable, resulting in the phenomenon of circuit layer deviation, high water absorption, and insufficient heat resistance. Poor processing performance, incomplete burning in the hole, resin residue, etc.

Method used

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  • Glue solution for copper-clad plate applied to HDI multilayer plate as well as preparation method and application of glue solution
  • Glue solution for copper-clad plate applied to HDI multilayer plate as well as preparation method and application of glue solution
  • Glue solution for copper-clad plate applied to HDI multilayer plate as well as preparation method and application of glue solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] 1. Preparation of polyacrylate modified phenolic epoxy resin

[0034] Add 100 parts of novolac epoxy resin and 20 parts of polyacrylate into a four-necked flask with a stirrer and a thermometer, fill it with nitrogen, add 0.05g of catalyst tetramethylammonium chloride at 135°C, and slowly raise the temperature to 180°C ℃, heat preservation reaction for 5 hours, and obtain yellow polyacrylate modified novolac epoxy resin.

[0035] 2. Preparation of glue

[0036] The glue solution for copper clad laminates in this embodiment consists of the following components by weight:

[0037]

[0038] The preparation steps of glue solution are as follows:

[0039] After cleaning the rubber blending tank with acetone, put into solvent propylene glycol methyl ether and silane coupling agent by weight, start stirring, and be 800r / min to stir 1.5h with rotating speed; Then, add silicon micropowder and aluminum hydroxide by weight again, with Stir at a high speed of 1500r / min for 2 ...

Embodiment 2

[0053] 1. Preparation of polyacrylate modified phenolic epoxy resin

[0054] Add 100 parts of novolac epoxy resin and 15 parts of polyacrylate into a four-necked flask with a stirrer and a thermometer, fill it with nitrogen, add 0.01g of catalyst tetrabutylammonium chloride at 135°C, and slowly raise the temperature to 185°C ℃, heat preservation reaction for 6 hours, and obtain yellow polyacrylate modified novolac epoxy resin.

[0055] 2. Preparation of glue

[0056] The glue solution for copper clad laminates in this embodiment consists of the following components by weight:

[0057]

[0058]

[0059] The preparation steps of glue solution are as follows:

[0060] After cleaning the rubber blending tank with acetone, put into solvent propylene glycol methyl ether and silane coupling agent by weight, start stirring, and be 1200r / min to stir 0.5h with rotating speed; Then, add silicon micropowder and aluminum hydroxide by weight again, with Stir at a high speed of 2000...

Embodiment 3

[0068] 1. Preparation of polyacrylate modified phenolic epoxy resin

[0069] Add 100 parts of novolac epoxy resin and 18 parts of polyacrylate into a four-necked flask with a stirrer and a thermometer, fill it with nitrogen, add 0.03g of catalyst triisopropylamine at 135°C, and slowly raise the temperature to 185°C , Insulation reaction for 4h, a yellow polyacrylate modified novolak epoxy resin was obtained.

[0070] 2. Preparation of glue

[0071] The glue solution for copper clad laminates in this embodiment consists of the following components by weight:

[0072]

[0073] The preparation steps of glue solution are as follows:

[0074] After cleaning the mixing tank with acetone, put in the solvent propylene glycol methyl ether and silane coupling agent in parts by weight, start stirring, and stir at a speed of 1000r / min for 1h; then, add silicon micropowder and aluminum hydroxide in parts by weight, Stir at a high speed at a speed of 1 / min for 1 hour, while feeding co...

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Abstract

The invention provides a glue solution for a copper-clad plate applied to an HDI multilayer plate as well as a preparation method and application of the glue solution. The glue solution for the copper-clad plate applied to the HDI multilayer plate comprises the following components in parts by weight: 15-35 parts of DOPO epoxy resin, 20-50 parts of DCPD epoxy resin, 2-10 parts of polyacrylate modified phenolic epoxy resin, 20-50 parts of phenolic resin, 10-40 parts of diaminodiphenyl ether benzoxazine resin, 0.01-0.05 part of a curing accelerator, 5-12 parts of a flame retardant, 25-65 parts of an inorganic filler, 0.1-0.3 part of an interface bonding agent, and 30-70 parts of a solvent. The copper-clad plate prepared from the glue solution for the copper-clad plate can be well applied tothe HDI multilayer plate, the toughness of the copper-clad plate is high, microcracks during preparation of the HDI multilayer plate are reduced, and meanwhile, the hygroscopicity is reduced; in addition, the dielectric constant and the dielectric loss of a substrate are low, and the market requirements of high transmission and low loss can be met.

Description

technical field [0001] The invention relates to the technical field of copper-clad laminates, in particular to a glue for copper-clad laminates applied to HDI multilayer boards, a preparation method and application thereof. Background technique [0002] Electronic products are constantly developing towards high density and high precision. The so-called "high" not only improves the performance of the machine, but also reduces the volume of the machine. High-density integration (HDI) technology can enable more miniaturized end-product designs while meeting higher standards for electronic performance and efficiency. At present, many popular electronic products, such as mobile phones, digital (camera) cameras, notebook computers, automotive electronics, etc., use HDI boards; with the upgrading of electronic products and market demand, the development of HDI boards will be very fast. [0003] HDI board (High Density Interconnector), that is, high-density interconnect board, is ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L61/04C08L61/06C08L61/34C08K13/02C08K5/5399C08K3/36C08K3/22C08J5/24C08K7/14H05K1/02H05K3/46C08G59/14B32B17/02B32B15/20B32B15/14B32B17/06B32B27/04B32B37/06B32B37/10
CPCC08L63/00C08J5/24H05K1/0298H05K3/46C08G59/14B32B5/02B32B15/20B32B15/14B32B17/061B32B37/06B32B37/10C08L2205/035C08L2205/025C08L2203/20C08L2201/02C08L2201/22C08K2003/2227C08J2363/00C08J2463/00C08J2487/00C08J2461/06C08J2461/34C08K7/14B32B2262/101B32B2260/021B32B2260/046B32B2307/50B32B2307/206B32B2307/20B32B2457/08
Inventor 李广元李永平钟英雄谢长乐
Owner 林州致远电子科技有限公司