A kind of n-type high-efficiency solar cell and preparation method thereof
A solar cell and N-type technology, which is applied in the field of solar cells, can solve the problems that the efficiency and yield of heterojunction solar cells are greatly affected, and achieve the effects of improving cell yield, reducing production costs, and improving utilization
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[0034] The preparation method of the N-type high-efficiency heterojunction solar cell of the present invention first performs gettering treatment on the N-type silicon wafer, and then completes the conventional production of the solar cell, and the gettering treatment includes the following steps:
[0035] (1) Clean the silicon wafer;
[0036] (2) Coating or depositing a layer of gettering source on the front and back of the silicon wafer;
[0037] (3) The silicon wafer coated or deposited with the gettering source is heat-treated in a chain annealing furnace to complete the gettering, and a gettering layer is formed on the surface of the silicon wafer;
[0038] (4) Erosion removes the gettering layer on the surface of the silicon wafer.
[0039] As another preferred solution of the present invention, step (4) can also remove the gettering layers on the front and back of the silicon wafer in the subsequent texturing process of conventional battery production, which further si...
Embodiment 1
[0043] (101) Take an N-type silicon wafer with the same or close minority carrier lifetime, first wash it with NaOH, then mix it with HF and HCL, and dry it;
[0044] (102) Apply a layer of gettering source on the surface of the silicon wafer by printing, rolling, spraying or spin-coating a liquid source on the front and back of the silicon wafer respectively. The liquid source can be a phosphorus-containing slurry or a boron-containing slurry , in this embodiment, roll-coat phosphoric acid solution on the front and back of the silicon wafer to form a gettering source on the surface of the silicon wafer;
[0045] (103) Send the silicon wafers coated with gettering sources on the surface into a chain annealing furnace for heat treatment. The chain annealing furnace is equipped with 5 temperature zones, and the temperature of each temperature zone is set to 530°C, 670°C, and 770°C respectively , 740°C, and 500°C, divided into four groups, and heat-treated in a chain annealing fu...
Embodiment 2
[0058] (201) Take an N-type silicon wafer with the same or close minority carrier lifetime, first wash it with NaOH, then mix it with HF and HCL, and dry it;
[0059] (202) Send the silicon wafer into a tubular diffusion furnace, which is filled with nitrogen and oxygen carrying a liquid source, and a layer of gettering source is deposited on the front and back of the silicon wafer through high-temperature diffusion. The liquid source can be Phosphorus oxychloride or boron tribromide, in this embodiment, a layer of boron source is deposited on the surface of the silicon wafer as a gettering layer by high-temperature diffusion of boron tribromide in a tubular diffusion furnace;
[0060] (203) Send the silicon wafer with the gettering source deposited on the surface into the chain-type annealing furnace for gettering treatment. The chain-type annealing furnace is equipped with 5 temperature zones, and the temperature of each temperature zone is set to 530°C, 670°C, 770°C, respect...
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