3D integrated structure and assembly process of a point-of-load power module

Abstract

The invention relates to a 3D integrated structure of a point-of-load power supply module, including a cover plate structure, a frame structure, a DPC substrate, an HTCC substrate, and a heat dissipation copper sheet. The frame structure is welded on the HTCC substrate, and the cover plate structure is welded by parallel seam welding In terms of the frame structure, the frame structure, HTCC substrate and cover structure together maintain a sealed cavity inside the power module; the thick metal layer of the DPC substrate has a current carrying capacity of ≥ 20A, and bracket inductors, chips, and ceramics are placed on it. For capacitors and tantalum capacitors, the wiring loss of the entire DPC substrate is ≤0.5W; the front and back of the HTCC substrate are designed with a square cavity structure in the center area, including a top cavity and a bottom cavity, where chips are placed in the top cavity, and ceramic capacitors are placed in the bottom cavity with resistors. The double-sided interconnection of chips on the DPC substrate of the present invention reduces the area of ​​the loop surrounded by metal layer wiring, reduces wiring parasitic impedance and the loss caused by it, and further improves the efficiency of the load point power supply module.

Description

technical field [0001] The invention relates to a 3D integrated structure and assembly process of a point-of-load power supply module, which is suitable for a synchronous Buck-type point-of-load power supply product with a ceramic seal structure with low voltage and high current output characteristics in aerospace distributed power supply and distribution systems, and can be used Promote the use of ceramic package point-of-load power supply products with miniaturization requirements in the ground environment. Background technique [0002] With the continuous development of high-resolution earth observation satellite technology, loads such as SAR loads and microwave communication components have developed from traditional hybrid integrated circuit modules to SoC integrated chips, and the operating voltage is decreasing and the operating current is increasing. However, the point-of-load power module that directly supplies power to the above-mentioned loads still adopts a hybri...

AI Technical Summary

Problems solved by technology

[0003] However, limited by the anti-irradiation process of aerospace power semiconductor devices, the aerospace synchronous Buck circuit point-of-load switching power supply will generate high power loss at frequencies above 300kHz, resulting in low overall conversion efficiency

The traditional module is led out by pins, and after installation, it will occupy the wiring space on the front and back sides of the circuit board, reducing the power density of the power module; the traditional module needs to be reinforced with mounting ears, and it also needs to occupy additional wiring space in actual use. Reduce space utilization; in addition, the height of the magnetic device used by the power module under the condition of high current output is much higher than other internal components, which further reduces the utilization of the internal space of the module

Images