3D integrated structure of load point power supply module and assembly process

Abstract

The invention relates to a 3D integrated structure of a load point power supply module, the 3D integrated structure comprises a cover plate structure, an enclosure frame structure, a DPC substrate, anHTCC substrate and a heat dissipation copper sheet, the enclosure frame structure is welded on the HTCC substrate, the cover plate structure is welded on the enclosure frame structure by adopting parallel seam welding, and the enclosure frame structure, the HTCC substrate and the cover plate structure jointly keep the interior of the power supply module to form a sealed cavity; wherein the current bearing capacity of a thick metal layer of the DPC substrate is greater than or equal to 20A, a bracket inductor, a chip, a ceramic capacitor and a tantalum capacitor are placed on the DPC substrate, and the wiring loss of the whole DPC substrate is less than or equal to 0.5 W; square concave cavity structures are designed in the center areas of the front face and the back face of the HTCC substrate and comprise top concave cavities and bottom concave cavities, chips are placed in the top concave cavities, and a ceramic capacitor and a resistor are placed in the bottom concave cavities. Thedouble-sided interconnection of the chips on the DPC substrate reduces the area of a loop defined by metal layer wiring, reduces the wiring parasitic impedance and the loss caused by the wiring parasitic impedance, and further improves the efficiency of the load point power supply module.

Description

technical field [0001] The invention relates to a 3D integrated structure and assembly process of a point-of-load power supply module, which is suitable for a synchronous Buck-type point-of-load power supply product with a ceramic seal structure with low voltage and high current output characteristics in aerospace distributed power supply and distribution systems, and can Promote the use of ceramic package point-of-load power supply products with miniaturization requirements in the ground environment. Background technique [0002] With the continuous development of high-resolution earth observation satellite technology, loads such as SAR loads and microwave communication components have developed from traditional hybrid integrated circuit modules to SoC integrated chips, and the operating voltage is decreasing and the operating current is increasing. However, the point-of-load power module that directly supplies power to the above-mentioned loads still adopts a hybrid integr...

AI Technical Summary

Problems solved by technology

[0003] However, limited by the anti-irradiation process of aerospace power semiconductor devices, the aerospace synchronous Buck circuit point-of-load switching power supply will generate high power loss at frequencies above 300kHz, resulting in low overall conversion efficiency

The traditional module is led out by pins, and after installation, it will occupy the wiring space on the front and back sides of the circuit board, reducing the power density of the power module; the traditional module needs to be reinforced with mounting ears, and it also needs to occupy additional wiring space in actual use. Reduce space utilization; in addition, the height of the magnetic device used by the power module under the condition of high current output is much higher than other internal components, which further reduces the utilization of the internal space of the module

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