A kind of pump light source and preparation method based on vcsel
A pumping light source and laser technology, which is applied to lasers, laser components, semiconductor lasers, etc., can solve the problems of low threshold current, small size, high coupling efficiency, etc., and achieve the effect of reducing loss
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[0035] Such as figure 2 As shown, the present invention provides a method for preparing the above-mentioned pump light source, including:
[0036] Step 1, disposing the two-dimensional VCSEL array chip 1 on the bottom of the substrate layer 2;
[0037] Step 2, etching a plurality of grooves 3 on the top of the substrate layer 2 along the laser emitting direction;
[0038] Step 3, filling the trench 3 with a first material to form a filler layer 4; wherein, the refractive index of the first material is higher than that of the substrate material, and the absorption rate of the laser emitted by the VCSEL is lower than that of the substrate material;
[0039] Step 4, connect the optical coupling system 5 on the top of the substrate layer 3 , and weld the heat sink 6 on the bottom of the two-dimensional VCSEL array chip 1 .
[0040] The advantages of the present invention are:
[0041] The present invention etches a groove on the substrate layer, and fills the groove with a mat...
Embodiment 1
[0044] The invention provides a structure and preparation method of a GaAs substrate layer with a specific groove, specifically comprising:
[0045] Clean and dehydrate the 350μm thick GaAs substrate, and use HMDS to form a film; use the spin coating method to coat the liquid phase photoresist material; perform soft baking at 90°C to 100°C, and then place it on a cold plate Lower the temperature; align the mask plate with the structure corresponding to the VCSEL light-emitting unit with the GaAs substrate, and perform deep ultraviolet exposure; bake on a hot plate at 100 ° C ~ 110 ° C; spin-spray the developer on the light On the resist, dissolve the soluble area of the photoresist; bake at 120°C-140°C to volatilize the remaining photoresist solution; use dry etching technology to remove the position corresponding to the VCSEL light-emitting unit to a depth of 345μm GaAs material;
[0046] Place the GaAs substrate with grooves obtained in the above steps at 300°C to 600°C, ...
Embodiment 2
[0049] The invention provides a structure and preparation method of a GaAs substrate layer with a specific groove, specifically comprising:
[0050]Clean and dehydrate the 350μm thick GaAs substrate, and use HMDS to form a film; use the spin coating method to coat the liquid phase photoresist material; perform soft baking at 90°C to 100°C, and then place it on a cold plate Lower the temperature; align the mask plate with the structure corresponding to the VCSEL light-emitting unit with the GaAs substrate, and perform deep ultraviolet exposure; bake on a hot plate at 100 ° C ~ 110 ° C; spin-spray the developer on the light On the resist, dissolve the soluble area of the photoresist; bake at 120°C to 140°C to evaporate the remaining photoresist solution; use dry etching technology to remove the position corresponding to the VCSEL light-emitting unit to a depth of 345μm GaAs material;
[0051] Place the GaAs substrate with grooves obtained in the above steps at 300°C to 600°C,...
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